TW201340791A - 電子裝置及其印刷電路板的佈局結構 - Google Patents

電子裝置及其印刷電路板的佈局結構 Download PDF

Info

Publication number
TW201340791A
TW201340791A TW101110282A TW101110282A TW201340791A TW 201340791 A TW201340791 A TW 201340791A TW 101110282 A TW101110282 A TW 101110282A TW 101110282 A TW101110282 A TW 101110282A TW 201340791 A TW201340791 A TW 201340791A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
inductor
conductive metal
metal surface
Prior art date
Application number
TW101110282A
Other languages
English (en)
Inventor
Fu-Li Gao
Kuo-Pin Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201340791A publication Critical patent/TW201340791A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • H05K1/0225Single or multiple openings in a shielding, ground or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感設有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。本發明還提供一種具有該印刷電路板的佈局結構的電子裝置。

Description

電子裝置及其印刷電路板的佈局結構
本發明涉及一種印刷電路板的佈局結構,特別是涉及一種可降低電磁干擾的電子裝置及其印刷電路板的佈局結構。
電磁干擾是目前電子產業中存在的一大問題,特別是隨著積體電路上電子元件的工作頻率越來越高,其內部的傳輸導線、開關電源或主機板上具有高工作頻率的電子元件都會產生電磁波,並干擾其他元件的正常工作。印刷電路板是整個電子系統正常工作的基礎,在印刷電路板佈局時就做好防止電磁干擾的工作,是建構高可靠度電子系統的首要任務。
在目前的電路板佈局設計上,印刷電路板的大部分電磁干擾問題均可通過良好的接地來解決,但是有些時候由於接地層的佈局設計不當,反而會對電子產品的效能及可靠性產生不利的影響,例如增強電磁干擾的能量。以使用開關電源的電子產品,如DVD播放器的印刷電路板為例,如圖1所示,為降低電路板上的電子元件產生的電磁干擾,通常是在整塊印刷電路板100’上鋪上接地的銅箔(斜線部分)20’,以此接地的銅箔做為電磁防護元件,進而降低電磁干擾對電路板的影響。但是該現有的做法存在以下問題:
在該印刷電路板上,其他的電子元件,例如積體電路(IC)具有接地引腳,其自身的電源端與接地端之間會形成回路,且接地端與銅箔相連後再與系統外的大地連接。然而,該開關電源的電感(焊盤303’、304’為貼片電感的兩個焊盤)自身沒有接地端,且在反復充放電的過程中會產生大量的高次諧波及雜訊,由於通過電感下方的銅箔連接到接地端的距離較遠,所形成的回路路徑較長,這些高次諧波及雜訊在傳輸過程中會通過電感下方的銅箔流竄至系統中的其他電子元件中,並在系統中傳播放大而產生較大能量的電磁干擾,嚴重地影響了同空間的其他電子產品的正常工作。
有鑒於此,有必要提供一種印刷電路板的佈局結構,以降低電子產品的電磁干擾。
一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
還有必要提供一種電子裝置。
一種電子裝置,包括一開關電源的印刷電路板,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
本發明的印刷電路板的佈局結構,通過將電感下方的導電金屬面去除,以阻斷電感在工作時產生的高次諧波及雜訊的傳播路徑,阻止其進入系統並在系統中傳播,從而大大降低了開關電源的電感在充放電時所造成的電磁干擾。
請參閱圖2,為本發明提供的一種印刷電路板的佈局結構,用於降低電子裝置的印刷電路板(如DVD播放器主板)100上的電磁干擾。圖2中只示出了印刷電路板100的部分結構,該印刷電路板100上設置了一層導電金屬面(斜線部分)20、多個電子元件的焊盤(pad)301~304以及多條印刷導線40,該多條印刷導線40用於連接電子元件。本實施方式中,圖2中的該印刷電路板100示出了電子裝置的開關電源的部分佈局結構。
本實施方式中,該導電金屬面20與該印刷電路板100內的接地點導通,其主要目的在於給印刷電路板100上所有的電子元件提供接地端。本實施方式中,該導電金屬面20為在印刷電路板100上鋪銅所產生,以此接地的銅箔做為電磁防護元件,並且在鋪銅的過程中會避開印刷電路板100上的印刷導線以及電子元件的焊盤,以避免發生短路的情形。該導電金屬面20上還設有多個與該印刷電路板100內的接地點導通的地孔50,可用於散熱、提供熱膨脹空間,防止印刷電路板100受熱後變形。
該開關電源具有一電感(圖未示),用於反復充放電。本實施方式中,該電感採用貼片電感,該印刷電路板100上對應於該貼片電感设有兩個間隔開的焊盤303、304。由於電感在反復充放電過程中會產生大量的高次諧波及雜訊,本實施方式中,將兩個焊盤303、304之間的該貼片電感下方的導電金屬面20去除,且兩個焊盤303、304之間相互絕緣間隔,以阻斷電感在工作時產生的高次諧波及雜訊的傳播路徑,從而阻止這些高次諧波及雜訊進入系統並在系統中傳播,有效地降低了開關電源的電感在充放電時所造成的電磁干擾。
本技術領域的普通技術人員應當認識到,以上的實施方式僅是用來說明本發明,而並非用作為對本發明的限定,只要在本發明的實質精神範圍之內,對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。
100、100’...印刷電路板
20...導電金屬面
20’...銅箔
301~304、303’、304’...焊盤
40...印刷導線
50...地孔
圖1為現有技術中的電子裝置的印刷電路板的佈局結構示意圖。
圖2為本發明的電子裝置的印刷電路板的佈局結構示意圖。
100...印刷電路板
20...導電金屬面
301~304...焊盤
40...印刷導線
50...地孔

Claims (6)

  1. 一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電;該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端,其改良在於:該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
  2. 如申請專利範圍第1項所述之印刷電路板的佈局結構,其中,該導電金屬面為在印刷電路板上鋪銅所產生。
  3. 如申請專利範圍第1項所述之印刷電路板的佈局結構,其中,該電感採用貼片電感。
  4. 一種電子裝置,包括一開關電源的印刷電路板,該開關電源包括一電感,用於反復充放電;該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端,其改良在於:該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
  5. 如申請專利範圍第4項所述之電子裝置,其中,該導電金屬面為在印刷電路板上鋪銅所產生。
  6. 如申請專利範圍第4項所述之電子裝置,其中,該電感採用貼片電感。
TW101110282A 2012-03-19 2012-03-23 電子裝置及其印刷電路板的佈局結構 TW201340791A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100713599A CN103327726A (zh) 2012-03-19 2012-03-19 电子装置及其印刷电路板的布局结构

Publications (1)

Publication Number Publication Date
TW201340791A true TW201340791A (zh) 2013-10-01

Family

ID=46025541

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101110282A TW201340791A (zh) 2012-03-19 2012-03-23 電子裝置及其印刷電路板的佈局結構

Country Status (5)

Country Link
US (1) US20130242519A1 (zh)
EP (1) EP2642834A3 (zh)
JP (1) JP2013197592A (zh)
CN (1) CN103327726A (zh)
TW (1) TW201340791A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678712B (zh) * 2018-09-27 2019-12-01 創意電子股份有限公司 電路板結構以及其傳輸導線結構

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201503768A (zh) * 2013-07-05 2015-01-16 Phison Electronics Corp 焊墊結構及應用其之印刷電路板與記憶體儲存裝置
US10674611B2 (en) * 2015-06-29 2020-06-02 NagraID Security Method of reducing the thickness of an electronic circuit
KR102150695B1 (ko) * 2015-08-13 2020-09-01 삼성전자주식회사 다중 대역 안테나를 포함하는 전자 장치
KR20240079641A (ko) 2022-11-29 2024-06-05 주식회사 엠디엠 패턴 플레이트 삽입형 다층 기판
KR20240093041A (ko) 2022-12-15 2024-06-24 주식회사 엠디엠 다층 메탈 pcb
KR20240093029A (ko) 2022-12-15 2024-06-24 주식회사 엠디엠 양면 메탈 pcb

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438305A (en) * 1991-08-12 1995-08-01 Hitachi, Ltd. High frequency module including a flexible substrate
US5849355A (en) * 1996-09-18 1998-12-15 Alliedsignal Inc. Electroless copper plating
US6175727B1 (en) * 1998-01-09 2001-01-16 Texas Instruments Israel Ltd. Suspended printed inductor and LC-type filter constructed therefrom
JP3822390B2 (ja) * 1998-09-30 2006-09-20 太陽誘電株式会社 混成集積回路装置
WO2000072446A1 (en) * 1999-05-26 2000-11-30 Broadcom Corporation Integrated vco
US6684065B2 (en) * 1999-12-20 2004-01-27 Broadcom Corporation Variable gain amplifier for low voltage applications
JP4532825B2 (ja) * 2000-11-01 2010-08-25 日立金属株式会社 高周波スイッチモジュール
JP2002368553A (ja) * 2001-06-08 2002-12-20 Mitsubishi Electric Corp 高周波増幅器およびそれを用いた無線送信装置
JP2003045978A (ja) * 2001-07-30 2003-02-14 Niigata Seimitsu Kk 半導体装置
US7003744B2 (en) * 2002-04-18 2006-02-21 University Of South Florida Global equivalent circuit modeling system for substrate mounted circuit components incorporating substrate dependent characteristics
US6987307B2 (en) * 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7076216B2 (en) * 2002-09-17 2006-07-11 Hitachi Metals, Ltd. High-frequency device, high-frequency module and communications device comprising them
US7269810B1 (en) * 2003-04-18 2007-09-11 University Of South Florida Global equivalent circuit modeling system for substrate mounted circuit components incorporating substrate dependent characteristics
JP2005158770A (ja) * 2003-11-20 2005-06-16 Matsushita Electric Ind Co Ltd 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置
WO2005059961A2 (en) * 2003-12-10 2005-06-30 The Regents Of The University Of California Low crosstalk substrate for mixed-signal integrated circuits
US7738568B2 (en) * 2004-06-03 2010-06-15 Silicon Laboratories Inc. Multiplexed RF isolator
US7460604B2 (en) * 2004-06-03 2008-12-02 Silicon Laboratories Inc. RF isolator for isolating voltage sensing and gate drivers
US7376212B2 (en) * 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7302247B2 (en) * 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US7577223B2 (en) * 2004-06-03 2009-08-18 Silicon Laboratories Inc. Multiplexed RF isolator circuit
US8049573B2 (en) * 2004-06-03 2011-11-01 Silicon Laboratories Inc. Bidirectional multiplexed RF isolator
EP1796276A4 (en) * 2004-06-07 2012-03-14 Hitachi Metals Ltd HIGH FREQUENCY SWITCHING MODULE AND METHOD FOR CONTROLLING THE SAME
EP1768269B1 (en) * 2004-06-30 2016-06-22 Hitachi Metals, Ltd. High frequency circuit, high frequency component, and multi-band communication apparatus
US7350175B2 (en) * 2004-09-29 2008-03-25 Matsushita Electric Industrial Co., Ltd. Circuit board design system, design data analysis method and recording medium with analysis program recorded thereon
US8350657B2 (en) * 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
JP4701942B2 (ja) * 2005-09-14 2011-06-15 Tdk株式会社 半導体ic内蔵モジュール
US7626216B2 (en) * 2005-10-21 2009-12-01 Mckinzie Iii William E Systems and methods for electromagnetic noise suppression using hybrid electromagnetic bandgap structures
CN102185474B (zh) * 2005-10-28 2013-09-18 日立金属株式会社 Dc-dc转换器
CA2566283C (en) * 2005-11-02 2011-10-18 Synergy Microwave Corporation User-definable, low cost, low phase hit and spectrally pure tunable oscillator
WO2007069768A1 (ja) * 2005-12-16 2007-06-21 Hitachi Metals, Ltd. 非可逆回路素子
US8130055B2 (en) * 2006-08-09 2012-03-06 Hitachi Metals, Ltd. High-frequency device and high-frequency circuit used therein
EP2043149A1 (en) * 2007-09-27 2009-04-01 Oticon A/S Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use
US8217748B2 (en) * 2007-11-23 2012-07-10 Alpha & Omega Semiconductor Inc. Compact inductive power electronics package
US8169050B2 (en) * 2008-06-26 2012-05-01 International Business Machines Corporation BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit
US7811919B2 (en) * 2008-06-26 2010-10-12 International Business Machines Corporation Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor
US8276268B2 (en) * 2008-11-03 2012-10-02 General Electric Company System and method of forming a patterned conformal structure
WO2010053131A1 (ja) * 2008-11-05 2010-05-14 日立金属株式会社 高周波回路、高周波部品、及びマルチバンド通信装置
JP5240215B2 (ja) * 2010-02-17 2013-07-17 日立電線株式会社 回路基板及びそれを用いた電力変換装置
JP4953034B2 (ja) * 2010-03-26 2012-06-13 Tdk株式会社 電圧変換器
EP2393215B1 (en) * 2010-06-03 2015-10-21 Nxp B.V. Radio receiver and transmitter circuits, and corresponding methods
CN102299621B (zh) * 2010-06-28 2014-12-10 东芝照明技术株式会社 开关电源用装置、开关电源电路以及电气设备
US9064712B2 (en) * 2010-08-12 2015-06-23 Freescale Semiconductor Inc. Monolithic microwave integrated circuit
JP5976648B2 (ja) * 2010-08-23 2016-08-24 デ,ロシェモント,エル.,ピエール 共振トランジスタゲートを有するパワーfet
US20120048703A1 (en) * 2010-09-01 2012-03-01 Michael Kotson Printed circuit board and method for avoiding electromagnetic interference
JP5361951B2 (ja) * 2011-06-17 2013-12-04 株式会社東芝 半導体電力増幅器
US8558344B2 (en) * 2011-09-06 2013-10-15 Analog Devices, Inc. Small size and fully integrated power converter with magnetics on chip
US20130120415A1 (en) * 2011-11-14 2013-05-16 Qualcomm Mems Technologies, Inc. Combined resonators and passive circuit components on a shared substrate
US20130120081A1 (en) * 2011-11-14 2013-05-16 Qualcomm Mems Technologies, Inc. Combined resonators and passive circuit components for filter passband flattening

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678712B (zh) * 2018-09-27 2019-12-01 創意電子股份有限公司 電路板結構以及其傳輸導線結構
US10736209B2 (en) 2018-09-27 2020-08-04 Global Unichip Corporation Circuit board structure and conductive transmission line structure thereof

Also Published As

Publication number Publication date
CN103327726A (zh) 2013-09-25
EP2642834A3 (en) 2014-04-09
EP2642834A2 (en) 2013-09-25
US20130242519A1 (en) 2013-09-19
JP2013197592A (ja) 2013-09-30

Similar Documents

Publication Publication Date Title
TW201340791A (zh) 電子裝置及其印刷電路板的佈局結構
US8040212B2 (en) Low profile inductors for high density circuit boards
JP6391885B1 (ja) 回路基板
US9621196B2 (en) High-frequency module and microwave transceiver
CN105657962B (zh) 一种多层pcb电路板
KR20160120486A (ko) 회로기판 및 회로기판 제조방법
JP2007250928A (ja) 多層プリント配線板
CN102378476A (zh) 印刷电路板
EP2728976B1 (en) Printed circuit board with reduced emission of electro-magnetic radiation
TW201505496A (zh) 電子裝置之連接結構
US20160095249A1 (en) Printed circuit board and electronic component package having the same
US9860975B2 (en) Thermal relief pad
CN1972561A (zh) 印刷电路板
US9226386B2 (en) Printed circuit board with reduced emission of electro-magnetic radiation
CN111653551A (zh) 一种具有高抗电磁脉冲干扰能力的bga芯片封装结构
WO2010116993A1 (ja) 集積回路の搭載構造
JP4816274B2 (ja) Lsiのシールド装置、lsiのシールド方法、lsiパッケージ
US7414321B2 (en) Wiring configuration for semiconductor component
TW200529720A (en) Pad structure for improving parasitic effect
CN212752738U (zh) 印刷电路板及半导体装置
JP2001203434A (ja) プリント配線板及び電気機器
WO2017000110A1 (zh) 电路板结构及电子设备
JP2004260141A (ja) 集積回路ボンディングパッド及びその形成方法
JP6318761B2 (ja) 半導体モジュール
JP6269233B2 (ja) 半導体モジュール