TW201340791A - 電子裝置及其印刷電路板的佈局結構 - Google Patents
電子裝置及其印刷電路板的佈局結構 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感設有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。本發明還提供一種具有該印刷電路板的佈局結構的電子裝置。
Description
本發明涉及一種印刷電路板的佈局結構,特別是涉及一種可降低電磁干擾的電子裝置及其印刷電路板的佈局結構。
電磁干擾是目前電子產業中存在的一大問題,特別是隨著積體電路上電子元件的工作頻率越來越高,其內部的傳輸導線、開關電源或主機板上具有高工作頻率的電子元件都會產生電磁波,並干擾其他元件的正常工作。印刷電路板是整個電子系統正常工作的基礎,在印刷電路板佈局時就做好防止電磁干擾的工作,是建構高可靠度電子系統的首要任務。
在目前的電路板佈局設計上,印刷電路板的大部分電磁干擾問題均可通過良好的接地來解決,但是有些時候由於接地層的佈局設計不當,反而會對電子產品的效能及可靠性產生不利的影響,例如增強電磁干擾的能量。以使用開關電源的電子產品,如DVD播放器的印刷電路板為例,如圖1所示,為降低電路板上的電子元件產生的電磁干擾,通常是在整塊印刷電路板100’上鋪上接地的銅箔(斜線部分)20’,以此接地的銅箔做為電磁防護元件,進而降低電磁干擾對電路板的影響。但是該現有的做法存在以下問題:
在該印刷電路板上,其他的電子元件,例如積體電路(IC)具有接地引腳,其自身的電源端與接地端之間會形成回路,且接地端與銅箔相連後再與系統外的大地連接。然而,該開關電源的電感(焊盤303’、304’為貼片電感的兩個焊盤)自身沒有接地端,且在反復充放電的過程中會產生大量的高次諧波及雜訊,由於通過電感下方的銅箔連接到接地端的距離較遠,所形成的回路路徑較長,這些高次諧波及雜訊在傳輸過程中會通過電感下方的銅箔流竄至系統中的其他電子元件中,並在系統中傳播放大而產生較大能量的電磁干擾,嚴重地影響了同空間的其他電子產品的正常工作。
有鑒於此,有必要提供一種印刷電路板的佈局結構,以降低電子產品的電磁干擾。
一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
還有必要提供一種電子裝置。
一種電子裝置,包括一開關電源的印刷電路板,該開關電源包括一電感,用於反復充放電。該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端。該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
本發明的印刷電路板的佈局結構,通過將電感下方的導電金屬面去除,以阻斷電感在工作時產生的高次諧波及雜訊的傳播路徑,阻止其進入系統並在系統中傳播,從而大大降低了開關電源的電感在充放電時所造成的電磁干擾。
請參閱圖2,為本發明提供的一種印刷電路板的佈局結構,用於降低電子裝置的印刷電路板(如DVD播放器主板)100上的電磁干擾。圖2中只示出了印刷電路板100的部分結構,該印刷電路板100上設置了一層導電金屬面(斜線部分)20、多個電子元件的焊盤(pad)301~304以及多條印刷導線40,該多條印刷導線40用於連接電子元件。本實施方式中,圖2中的該印刷電路板100示出了電子裝置的開關電源的部分佈局結構。
本實施方式中,該導電金屬面20與該印刷電路板100內的接地點導通,其主要目的在於給印刷電路板100上所有的電子元件提供接地端。本實施方式中,該導電金屬面20為在印刷電路板100上鋪銅所產生,以此接地的銅箔做為電磁防護元件,並且在鋪銅的過程中會避開印刷電路板100上的印刷導線以及電子元件的焊盤,以避免發生短路的情形。該導電金屬面20上還設有多個與該印刷電路板100內的接地點導通的地孔50,可用於散熱、提供熱膨脹空間,防止印刷電路板100受熱後變形。
該開關電源具有一電感(圖未示),用於反復充放電。本實施方式中,該電感採用貼片電感,該印刷電路板100上對應於該貼片電感设有兩個間隔開的焊盤303、304。由於電感在反復充放電過程中會產生大量的高次諧波及雜訊,本實施方式中,將兩個焊盤303、304之間的該貼片電感下方的導電金屬面20去除,且兩個焊盤303、304之間相互絕緣間隔,以阻斷電感在工作時產生的高次諧波及雜訊的傳播路徑,從而阻止這些高次諧波及雜訊進入系統並在系統中傳播,有效地降低了開關電源的電感在充放電時所造成的電磁干擾。
本技術領域的普通技術人員應當認識到,以上的實施方式僅是用來說明本發明,而並非用作為對本發明的限定,只要在本發明的實質精神範圍之內,對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。
100、100’...印刷電路板
20...導電金屬面
20’...銅箔
301~304、303’、304’...焊盤
40...印刷導線
50...地孔
圖1為現有技術中的電子裝置的印刷電路板的佈局結構示意圖。
圖2為本發明的電子裝置的印刷電路板的佈局結構示意圖。
100...印刷電路板
20...導電金屬面
301~304...焊盤
40...印刷導線
50...地孔
Claims (6)
- 一種印刷電路板的佈局結構,應用於一電子裝置的開關電源中,該開關電源包括一電感,用於反復充放電;該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端,其改良在於:該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
- 如申請專利範圍第1項所述之印刷電路板的佈局結構,其中,該導電金屬面為在印刷電路板上鋪銅所產生。
- 如申請專利範圍第1項所述之印刷電路板的佈局結構,其中,該電感採用貼片電感。
- 一種電子裝置,包括一開關電源的印刷電路板,該開關電源包括一電感,用於反復充放電;該印刷電路板上設置了一層導電金屬面,該導電金屬面與該印刷電路板內的接地點導通,用於給印刷電路板上所有的電子元件提供接地端,其改良在於:該印刷電路板上對應於該電感设有兩個間隔開的焊盤,該兩個焊盤之間的該電感下方不覆蓋導電金屬面,且兩個焊盤之間相互絕緣間隔。
- 如申請專利範圍第4項所述之電子裝置,其中,該導電金屬面為在印刷電路板上鋪銅所產生。
- 如申請專利範圍第4項所述之電子裝置,其中,該電感採用貼片電感。
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CN2012100713599A CN103327726A (zh) | 2012-03-19 | 2012-03-19 | 电子装置及其印刷电路板的布局结构 |
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US (1) | US20130242519A1 (zh) |
EP (1) | EP2642834A3 (zh) |
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CN (1) | CN103327726A (zh) |
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JP4953034B2 (ja) * | 2010-03-26 | 2012-06-13 | Tdk株式会社 | 電圧変換器 |
EP2393215B1 (en) * | 2010-06-03 | 2015-10-21 | Nxp B.V. | Radio receiver and transmitter circuits, and corresponding methods |
CN102299621B (zh) * | 2010-06-28 | 2014-12-10 | 东芝照明技术株式会社 | 开关电源用装置、开关电源电路以及电气设备 |
US9064712B2 (en) * | 2010-08-12 | 2015-06-23 | Freescale Semiconductor Inc. | Monolithic microwave integrated circuit |
JP5976648B2 (ja) * | 2010-08-23 | 2016-08-24 | デ,ロシェモント,エル.,ピエール | 共振トランジスタゲートを有するパワーfet |
US20120048703A1 (en) * | 2010-09-01 | 2012-03-01 | Michael Kotson | Printed circuit board and method for avoiding electromagnetic interference |
JP5361951B2 (ja) * | 2011-06-17 | 2013-12-04 | 株式会社東芝 | 半導体電力増幅器 |
US8558344B2 (en) * | 2011-09-06 | 2013-10-15 | Analog Devices, Inc. | Small size and fully integrated power converter with magnetics on chip |
US20130120415A1 (en) * | 2011-11-14 | 2013-05-16 | Qualcomm Mems Technologies, Inc. | Combined resonators and passive circuit components on a shared substrate |
US20130120081A1 (en) * | 2011-11-14 | 2013-05-16 | Qualcomm Mems Technologies, Inc. | Combined resonators and passive circuit components for filter passband flattening |
-
2012
- 2012-03-19 CN CN2012100713599A patent/CN103327726A/zh active Pending
- 2012-03-23 TW TW101110282A patent/TW201340791A/zh unknown
- 2012-04-23 US US13/454,027 patent/US20130242519A1/en not_active Abandoned
- 2012-04-24 EP EP12165415.6A patent/EP2642834A3/en not_active Withdrawn
-
2013
- 2013-03-18 JP JP2013054722A patent/JP2013197592A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI678712B (zh) * | 2018-09-27 | 2019-12-01 | 創意電子股份有限公司 | 電路板結構以及其傳輸導線結構 |
US10736209B2 (en) | 2018-09-27 | 2020-08-04 | Global Unichip Corporation | Circuit board structure and conductive transmission line structure thereof |
Also Published As
Publication number | Publication date |
---|---|
CN103327726A (zh) | 2013-09-25 |
EP2642834A3 (en) | 2014-04-09 |
EP2642834A2 (en) | 2013-09-25 |
US20130242519A1 (en) | 2013-09-19 |
JP2013197592A (ja) | 2013-09-30 |
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