JP5240215B2 - 回路基板及びそれを用いた電力変換装置 - Google Patents
回路基板及びそれを用いた電力変換装置 Download PDFInfo
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- JP5240215B2 JP5240215B2 JP2010031930A JP2010031930A JP5240215B2 JP 5240215 B2 JP5240215 B2 JP 5240215B2 JP 2010031930 A JP2010031930 A JP 2010031930A JP 2010031930 A JP2010031930 A JP 2010031930A JP 5240215 B2 JP5240215 B2 JP 5240215B2
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Description
この直列共振器は、図12に示される、共振器のインピーダンス概略図に破線で示したような特性を持つ。共振周波数fresoにおいて低インピーダンスとなる領域が存在し、fresoを境界にして低域側で容量性、高域側で誘導性に振舞う。このfresoは絶縁基板の寄生容量350と金属ベース及び接地面の寄生インダクタ349により定まる。
と低インピーダンスになる零周波数
を持つ。共振器のQ値が無限大であると仮定した場合、LC共振器の|Z|は、極周波数f∞において極大値(並列共振に見える)、零周波数fzeroにおいて極小値(直列共振に見える)を示すことになり、極周波数f∞では絶縁基板334を介したコモンモード電流(漏洩電流)を無限小まで低減できるが、零周波数fzeroにおいてはこの周波数成分を持ったコモンモード電流が絶縁基板を貫通して流れる危険性がある。
その共振器のインピーダンス特性|Z|は図12の概略図中の実線で示すよう、高インピーダンスになる極周波数
と低インピーダンスになる零周波数
を持つ。
と低インピーダンスになる零周波数
を持つ。また、極周波数f∞及び零周波数fzeroを決定するための、平型インダクタ(L)355及び第一の絶縁基板内の寄生容量(Cp)353と第二の絶縁基板内の寄生容量(Cs)354の構造上の決定法は、前記第二の発明構成と同様である。本発明構成によると、実装面積が増大するという欠点はあるが、第二の発明構成で前述したf∞≫fzeroとするためのCs≫Cpとなる条件の適合範囲が広がるという利点がある。
Claims (5)
- 車両の駆動用モータに交流電流を出力するインバータ装置に備えられる回路基板であって、
絶縁層と、
インバータ回路を構成する上アーム及び下アームのうち下アームを構成する半導体チップを実装し、かつ前記絶縁層の一方の面に形成された第1配線導体と、
前記絶縁層を挟んで、前記第1配線導体とは反対側の他方の面に形成され、かつ前記車両のアースに接続される第2配線導体と、
前記第1配線導体と前記第2配線導体との間に発生する寄生容量と並列に接続されることにより、当該寄生容量と並列共振器を構成するためのインダクタと、
前記絶縁層の前記一方の面に形成された中継配線導体と、を備え、
前記インダクタは、当該インダクタの一方の端子が前記第2配線導体に接続され、当該インダクタの他方の端子が前記中継配線導体に接続される外付け用チップインダクタである回路基板。 - 請求項1に記載された回路基板であって、
前記中継配線導体に、前記インダクタと直列に接続される外付け用チップコンデンサを接続する回路基板。 - 請求項1または2に記載されたいずれかの回路基板であって、
前記絶縁層の一方の面に形成された前記中継配線導体と、前記絶縁層の他方の面に形成する前記第2配線導体と、を電気的に接続し、かつ前記絶縁層を貫通させる接続導体を備える回路基板。 - 請求項3に記載された回路基板であって、
前記接続導体は、前記絶縁層の一方の導体面側から他方の導体面側に伸びるスルーホールである回路基板。 - 車両の駆動用モータに交流電流を出力するインバータ装置に備えられる回路基板であって、
絶縁層と、
インバータ回路部を構成する上アーム及び下アームのうち下アームを構成する半導体チップを実装し、かつ前記絶縁層の一方の面に形成された第1配線導体と、
前記絶縁層を挟んで、前記第1配線導体とは反対側の他方の面に形成され、かつ前記車両のアースに接続される第2配線導体と、
前記絶縁層内に形成され、かつ一方の面が前記第1配線導体と対向され、さらに他方の面が前記第2配線導体と対向するように配置される中間導体と、
前記第1配線導体と前記中間導体との間に蓄えられる寄生容量と並列に接続され、かつ前記第2配線導体と前記中間導体との間に発生する寄生容量と直列に接続されることにより、当該寄生容量と並列共振器を構成するためのインダクタと、
前記絶縁層の前記一方の面に形成された中継配線導体と、
一方の端子が前記中間導体に接続され、かつ他方の端子が前記中継配線導体に接続され、前記インダクタと直列に接続される外付け用チップインダクタと、を備え、
前記インダクタは、前記絶縁層内に形成された中間導体を用いて形成され、当該インダクタの一端部から伸びる配線パターンが、他端部を中心として当該他端部に近づくように屈曲または湾曲しながら渦状に形成されることによりインダクタンス成分を有するように構成される回路基板。
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JP2010031930A JP5240215B2 (ja) | 2010-02-17 | 2010-02-17 | 回路基板及びそれを用いた電力変換装置 |
US13/028,982 US20110198919A1 (en) | 2010-02-17 | 2011-02-16 | Circuit Board |
CN2011100412760A CN102195499A (zh) | 2010-02-17 | 2011-02-17 | 电路基板 |
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JP2010031930A JP5240215B2 (ja) | 2010-02-17 | 2010-02-17 | 回路基板及びそれを用いた電力変換装置 |
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JP5846929B2 (ja) * | 2012-01-23 | 2016-01-20 | カルソニックカンセイ株式会社 | パワー半導体モジュール |
CN103327726A (zh) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其印刷电路板的布局结构 |
US20140077611A1 (en) * | 2012-09-14 | 2014-03-20 | Henry Todd Young | Capacitor bank, laminated bus, and power supply apparatus |
JP6151110B2 (ja) * | 2013-07-01 | 2017-06-21 | 株式会社日立製作所 | 電力変換装置 |
JP6308017B2 (ja) * | 2014-05-22 | 2018-04-11 | 株式会社明電舎 | 半導体装置 |
KR101592702B1 (ko) | 2014-06-10 | 2016-02-15 | 현대자동차주식회사 | 공통모드 전압 저감 장치 및 방법 |
JP6402580B2 (ja) * | 2014-10-17 | 2018-10-10 | 日産自動車株式会社 | 電源装置 |
JP6447391B2 (ja) * | 2015-06-30 | 2019-01-09 | オムロン株式会社 | 電力変換装置 |
KR102532881B1 (ko) * | 2016-03-15 | 2023-05-17 | 주식회사 위츠 | 무선 전력 송신 장치 및 그의 제어 방법 |
US10277074B2 (en) * | 2016-03-15 | 2019-04-30 | Samsung Electro-Mechanics Co., Ltd. | Wireless power transmitter and method for controlling the same |
EP3632197B1 (de) * | 2017-06-02 | 2021-04-28 | Bombardier Transportation GmbH | Leistungsphasenmodul eines umrichters, umrichter, und fahrzeug |
CN111032419A (zh) * | 2017-09-19 | 2020-04-17 | 日本电产株式会社 | 无人移动体 |
JP7148372B2 (ja) * | 2018-11-20 | 2022-10-05 | 株式会社Soken | モータ駆動装置 |
JP7471504B2 (ja) | 2021-03-05 | 2024-04-19 | 三菱電機株式会社 | インバータ装置 |
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JP2877132B2 (ja) * | 1997-03-26 | 1999-03-31 | 日本電気株式会社 | 多層プリント基板とその製造方法 |
JP2006115649A (ja) * | 2004-10-18 | 2006-04-27 | Fuji Electric Systems Co Ltd | 電力変換装置 |
CN1905361B (zh) * | 2005-07-27 | 2012-06-13 | 精工爱普生株式会社 | 半导体装置及振荡器 |
JP4047351B2 (ja) * | 2005-12-12 | 2008-02-13 | キヤノン株式会社 | 多層プリント回路板 |
CN101351924A (zh) * | 2006-01-19 | 2009-01-21 | 株式会社村田制作所 | 无线ic器件以及无线ic器件用零件 |
JP2008035657A (ja) * | 2006-07-31 | 2008-02-14 | Fuji Electric Device Technology Co Ltd | 電力変換装置のパワーモジュール |
JP5354949B2 (ja) * | 2007-06-19 | 2013-11-27 | キヤノン株式会社 | プリント回路板 |
JP2009295916A (ja) * | 2008-06-09 | 2009-12-17 | Daikin Ind Ltd | 冷凍装置 |
JP4657329B2 (ja) * | 2008-07-29 | 2011-03-23 | 日立オートモティブシステムズ株式会社 | 電力変換装置および電動車両 |
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