WO2017000110A1 - 电路板结构及电子设备 - Google Patents

电路板结构及电子设备 Download PDF

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Publication number
WO2017000110A1
WO2017000110A1 PCT/CN2015/082629 CN2015082629W WO2017000110A1 WO 2017000110 A1 WO2017000110 A1 WO 2017000110A1 CN 2015082629 W CN2015082629 W CN 2015082629W WO 2017000110 A1 WO2017000110 A1 WO 2017000110A1
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Prior art keywords
connecting portion
conductive pad
pad
circuit board
board structure
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PCT/CN2015/082629
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English (en)
French (fr)
Inventor
李伟
刘自鸿
Original Assignee
深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201580000933.3A priority Critical patent/CN105519240B/zh
Priority to PCT/CN2015/082629 priority patent/WO2017000110A1/zh
Publication of WO2017000110A1 publication Critical patent/WO2017000110A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes

Definitions

  • the present invention relates to the field of circuit boards, and more particularly to a circuit board structure capable of reducing electromagnetic interference and an electronic device having the same.
  • Electromagnetic interference is an interference phenomenon that occurs in electronic equipment, especially the interference caused by electromagnetic waves and electronic components.
  • circuit board PCB
  • high-frequency signal lines, pins of integrated circuits, various types of connectors, etc. may become interference sources with antenna characteristics, which can emit electromagnetic waves and affect the normal operation of other components.
  • electromagnetic interference is shielded in different ways, such as adding EMI suppression devices, such as magnetic rings, or adding shielding devices.
  • the EMI suppression device since the EMI suppression device is generally not cheap, this increases the product cost.
  • electronic devices must add space to place these devices, which may result in changes in the appearance or structural design of the product. Further, if the radiation source is the ground level (ground) of the electronic device, placing the EMI suppression device cannot effectively suppress the noise source, and a shielding device is required.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention is required to provide a circuit board structure capable of reducing electromagnetic interference and an electronic device having the same.
  • An embodiment of the present invention provides a circuit board structure including a substrate, a first conductive pad, a second conductive pad, a first connecting portion, a second connecting portion, and a ground pad, the first conductive pad and the second conductive pad
  • the first connecting portion, the second connecting portion and the ground end pad are located on the substrate, the first connecting portion is connected to the first conductive pad and the ground end pad, and the second connecting portion is connected to the second conductive pad
  • the first connecting portions are spaced apart from each other on both sides of the second connecting portion.
  • the second connecting portion limits the signal path from the second conductive pad to the ground end, and the first connecting portion disposed at two sides of the second connecting portion can shield the signal to suppress the signal, in particular High frequency signals radiate from the ground to the space, which reduces EMI. Therefore, the above circuit board structure only needs to modify the wiring of the circuit board, saves the development time, has no influence on the device placement on the circuit board structure, and does not need to increase the EMI suppression device or the shielding device, thereby reducing the product cost. Since there is no need to add EMI suppression devices or shielding devices, there is no need to change the appearance or structural design of the product.
  • An embodiment of the present invention provides an electronic device including a circuit board structure including a substrate, a first conductive pad, a second conductive pad, a first connecting portion, a second connecting portion, and a ground end pad, the first The conductive pad, the second conductive pad, the first connecting portion, the second connecting portion and the ground end pad are located on the substrate, the first connecting portion connecting the first conductive pad and the ground end pad, the second The connecting portion connects the second conductive pad and the ground end pad, and the first connecting portions are spaced apart from each other on both sides of the second connecting portion.
  • FIG. 1 is a schematic structural view of a circuit board structure according to a preferred embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • a circuit board structure 100 includes a substrate 102 , a first conductive pad 104 , a second conductive pad 106 , a first connection portion 108 , a second connection portion 110 , and a ground pad 112 .
  • the first conductive pad 104 , the second conductive pad 106 , the first connecting portion 108 , the second connecting portion 110 , and the ground pad 112 are located on the substrate 102 .
  • a chip (not shown) may be fixed on the circuit board structure 100.
  • the circuit board structure 100 includes a chip region 114 disposed between the first conductive pad 104 and the second conductive pad 106.
  • the chip can be fixed in the chip region 114, and the ground pin of the chip can be respectively connected to the first conductive pad 104 and The second conductive pad 106 is soldered.
  • the first conductive pad 104, the second conductive pad 106, the first connection portion 108, the second connection portion 110, and the ground pad 112 may be formed by etching a conductive film layer (such as a copper film) on the substrate 102.
  • the substrate 102 can be selected from a substrate material suitable for producing a printed circuit board, such as resin (Resin), glass fiber (Glass fiber), or the like.
  • Resin can be selected from phenolic resin (Epoxy Resin), epoxy resin (Epoxy Resin), polyamidene resin (Polyamide Resin), polytetrafluoroethylene (Polytetrafluorethylene, PTFE or TEFLON), B-three-nitrogen resin (Bismaleimide Triazine).
  • the first connecting portion 108 is connected to the first conductive pad 104 and the ground pad 112.
  • the second connecting portion 110 is connected to the second conductive pad 106 and the ground pad 112.
  • the first connecting portion 108 is spaced apart at intervals. Both sides of the second connecting portion 110.
  • the two pins of the first conductive pad 104 and the second conductive pad 106 corresponding to the chip are located at the ground end of the same network, and the two pins of the chip are analog ground pins and digital ground respectively.
  • the terminal pin, the analog ground pin is connected to the first conductive pad 104, and the digital ground pin is connected to the second conductive pad 106. That is, in the circuit board structure 100, the first conductive pad 104 and the second conductive pad 106 are both connected to the same ground end of the circuit board structure 100.
  • the circuit board structure 100 further includes a plurality of signal conductive pads 116 for soldering to the signal pins of the chip.
  • the signal pins of the chip can be electrically connected to other components (not shown) on the circuit board structure 100, such as resistors, capacitors, etc., through the signal conductive pads 116.
  • the signal conductive pad 116 is insulated from the signal conductive pad 116, the signal conductive pad 116 is electrically insulated from the first conductive pad 104, and between the signal conductive pad 116 and the second conductive pad 106.
  • the signal conductive pad 116 and the ground pad 112 are insulated. Insulation between.
  • the high frequency or low frequency signals (including noise) generated by the chip during operation may flow back to the ground pad 112 of the circuit board structure 100 through the first conductive pad 104 and the second conductive pad 106. If noise is allowed to pass from the first conductive pad 104 and the second conductive pad 106 through the free path to the ground pad 112, the ground pad 112 may form an antenna effect that radiates high frequency signals into the space to form electromagnetic interference. Therefore, between the second conductive pad 106 and the ground pad 112, the circuit board structure 100 is connected to the second conductive pad 106 and the ground pad 112 by using the second connecting portion 110, and is disposed at two sides of the second connecting portion 110. The first connecting portion 108 causes the high frequency signal of the second conductive pad 106 to be suppressed in the second connecting portion 110 and cannot pass The ground pad 112 radiates into the space to achieve the purpose of suppressing electromagnetic interference.
  • the second connecting portion 110 reaches the ground pad 112 by the shortest distance, and the width thereof is greater than 0.3 millimeters (mm), and the specific value may be according to the size of the circuit board structure 100 and the periphery of the chip.
  • the layout of the components is determined.
  • the width of the second connecting portion 110 can be understood as the minimum width of the second connecting portion 110.
  • the second connection portion 110 cannot be switched to other layers of the circuit board structure 100 through the vias of the circuit board structure 100.
  • the width of the first connecting portion 108 disposed on one side of the second connecting portion 110 is greater than 0.25 mm, and the width of the first connecting portion 108 disposed on the other side of the second connecting portion 110 is greater than 0.25 mm.
  • the width of the first connecting portion 108 can be understood as the minimum width of the first connecting portion 108.
  • the distance L between the first connecting portion 108 and the second connecting portion 110 is 0.25 mm, that is, the interval L between the first connecting portion 108 and the second connecting portion 110 on the side of the second connecting portion 110 is 0.25.
  • the interval L between the first connecting portion 108 and the second connecting portion 110 on the other side of the second connecting portion 110 is 0.25 mm.
  • the circuit board structure 100 includes a third conductive pad 118 and a power pad 120 on the substrate 102.
  • the third conductive pad 118 is connected to the power pad 120.
  • the third conductive pad 118 and the power pad 120 are both The first conductive pad 104, the second conductive pad 106, the first connecting portion 108, the second connecting portion 110, and the ground end pad 112 are insulated.
  • the third conductive pad 118 can be connected to the power supply terminal of the chip.
  • the power pad 120 can be connected to an external power source to enable the chip to obtain an operating voltage from the external power source through the power pad 120 and the third conductive pad 118.
  • the second connecting portion 110 limits the signal path from the second conductive pad 106 to the ground end, and the first connecting portion 108 spaced apart from the two sides of the second connecting portion 110 can It acts as a shield to suppress the signal, especially the high-frequency signal radiates from the ground to the space, thereby reducing EMI interference. Therefore, the above-mentioned circuit board structure 100 only needs to modify the wiring of the circuit board, saves the development time, has no influence on the device placement on the circuit board structure 100, and does not need to increase the EMI suppression device or the shielding device, thereby reducing the product cost. Since there is no need to add EMI suppression devices or shielding devices, there is no need to change the appearance or structural design of the product.
  • the above-mentioned circuit board structure 100 can solve the problem that the noise source is radiated to the space through the ground end of the circuit board structure 100.
  • the second conductive pad 106 is the highest energy point found by using the high frequency probe. When searching for the highest energy point, the spectrum center frequency can be set to EMI test but the frequency point is set, and the bandwidth is set to 2 to 5 MHz.
  • the electronic device of the preferred embodiment of the present invention includes a circuit board structure and a chip.
  • the circuit board structure can be the circuit board structure 100 of the above embodiment.
  • the chip can be attached to the chip area 114 of the board structure 100.
  • the chip includes a first pin, a second pin, and a third pin.
  • the first pin is an analog ground pin and is connected to the first conductive pad 104.
  • the second pin is a digital ground pin and is connected to the second conductive pad 106.
  • the third pin is a power terminal pin and is connected to the third conductive pad 118.
  • the circuit board structure 100 is provided with a first connecting portion 108 spaced apart on both sides of the second connecting portion 110, so that the signal of the second conductive pad 106 is suppressed in the second connecting portion 110, and cannot be radiated to the space through the ground end, thereby achieving suppression.
  • the circuit board structure 100 can suppress electromagnetic interference without adding cost and space for additional EMI suppression devices or shielding devices, and at the same time, it is not necessary to change the product appearance or structural design of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种电路板结构及电子设备，所述电路板结构(100)包括基板(102)、第一导电垫(104)、第二导电垫(106)、第一连接部(108)、第二连接部(110)及地端垫(112)，第一导电垫(104)、第二导电垫(106)、第一连接部(108)、第二连接部(110)及地端垫(112)位于基板(102)上，第一连接部(108)连接第一导电垫(104)及地端垫(112)，第二连接部(110)连接第二导电垫(106)及地端垫(112)，第一连接部(108)间隔地设置在第二连接部(110)的两侧。上述电路板结构(100)中，第二连接部(110)限制了从第二导电垫(106)流到地端的信号路径，且间隔设置在第二连接部(110)两侧的第一连接部(108)能够起到屏蔽作用从而抑制信号，特别是高频信号从地端辐射到空间，进而降低了EMI。因此，上述电路板结构只需对电路板的布线做修改，降低产品成本。

Description

电路板结构及电子设备 技术领域
本发明涉及电路板领域，更具体而言，涉及一种能够降低电磁干扰的电路板结构及一种具有该电路板结构的电子设备。
背景技术
电磁干扰(Electromagnetic Interference，EMI)是电子设备中出现的一种干扰现象，特别是电磁波与电子元件作用后而产生的干扰现象。在电路板(PCB)的设计中，高频信号线、集成电路的引脚、各类接插件等都可能成为具有天线特性的干扰源，能发射电磁波并影响其它元件的正常工作。
现有的电子设备中都对电磁干扰作出不同方式的屏蔽，例如增加EMI抑制器件，如磁环等，或则加屏蔽器件。
但是，上述以电磁干扰的屏蔽方式中，由于EMI抑制器件一般都不便宜，因此，这会增加产品成本。另外，电子设备必须增加空间来放置这些器件，可能会导致产品外观或结构设计的变更。进一步地，如果辐射源为电子设备的地电平(地端)，放置EMI抑制器件不能有效抑制噪声源，需加屏蔽器件。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明需要提供一种能够降低电磁干扰的电路板结构及一种具有该电路板结构的电子设备。
本发明实施方式提供一种电路板结构，其包括基板、第一导电垫、第二导电垫、第一连接部、第二连接部及地端垫，该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫位于该基板上，该第一连接部连接该第一导电垫及该地端垫，该第二连接部连接该第二导电垫及该地端垫，该第一连接部间隔地设置在该第二连接部的两侧。
上述电路板结构中，第二连接部限制了从第二导电垫流到地端的信号路径，且间隔设置在第二连接部两侧的第一连接部能够起到屏蔽作用从而抑制信号，特别是高频信号从地端辐射到空间，进而降低了EMI。因此，上述电路板结构只需对电路板的布线做修改，节约研发时间，对电路板结构上器件摆放基本没有影响，同时也不用增加EMI抑制器件或屏蔽器件，降低产品成本。由于不用增加EMI抑制器件或屏蔽器件，因此也无需变更产品外观或结构设计。
本发明实施方式提供一种电子设备，其包括电路板结构，该电路板结构包括基板、第一导电垫、第二导电垫、第一连接部、第二连接部及地端垫，该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫位于该基板上，该第一连接部连接该第一导电垫及该地端垫，该第二连接部连接该第二导电垫及该地端垫，该第一连接部间隔地设置在该第二连接部的两侧。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明较佳实施方式的电路板结构的结构示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设定进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设定之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以 意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本发明较佳实施方式的电路板结构100包括基板102、第一导电垫104、第二导电垫106、第一连接部108、第二连接部110及地端垫112。该第一导电垫104、该第二导电垫106、该第一连接部108、该第二连接部110及该地端垫112位于该基板102上。电路板结构100上可固定有芯片(图未示)。例如，电路板结构100包括设置在第一导电垫104及第二导电垫106之间的芯片区域114，芯片可固定在芯片区域114，芯片的地端管脚可分别与第一导电垫104及第二导电垫106焊接。可对位于基板102上的导电薄膜层(如铜膜)进行蚀刻工艺而形成第一导电垫104、第二导电垫106、第一连接部108、第二连接部110及地端垫112。
基板102可以选择适合制作印刷电路板的基板材料，例如树脂(Resin)及玻璃纤维(Glass fiber)等。树脂可选用酚醛树脂(Phonetic Resin)、环氧树脂(Epoxy Resin)、聚亚醯胺树脂(Polyamide Resin)、聚四氟乙烯(Polytetrafluorethylene，简称PTFE或称TEFLON)、B一三氮树脂(Bismaleimide Triazine Resin简称BT)等热固型的树脂(Thermosetted Plastic Resin)。
该第一连接部108连接该第一导电垫104及该地端垫112，该第二连接部110连接该第二导电垫106及该地端垫112，该第一连接部108间隔地设置在该第二连接部110的两侧。
具体地，本实施方式中，第一导电垫104及第二导电垫106对应芯片的两个管脚是位于同一网络的地端，芯片的两个管脚分别为模拟地端管脚及数字地端管脚，模拟地端管脚连接第一导电垫104，数字地端管脚连接第二导电垫106。也就是说，在电路板结构100中，第一导电垫104及第二导电垫106均连接到电路板结构100的同一个地端。
除了第一导电垫104及第二导电垫106外，电路板结构100还包括多个信号导电垫116，该信号导电垫116用于与芯片的信号管脚焊接。例如，芯片的信号管脚可通过信号导电垫116与电路板结构100上的其它元器件(图未示)，例如电阻、电容等实现电连接。信号导电垫116与信号导电垫116之间绝缘，信号导电垫116与第一导电垫104之间，及信号导电垫116与第二导电垫106之间绝缘，信号导电垫116与地端垫112之间绝缘。
芯片在工作时产生的高频或低频信号(包括噪声)会经过第一导电垫104及第二导电垫106回流到电路板结构100的地端垫112。如果任由噪声从第一导电垫104及第二导电垫106经过自由路径传到地端垫112，该地端垫112可能形成天线效应，将高频信号辐射到空间，从而形成电磁干扰。因此，在第二导电垫106及地端垫112之间，电路板结构100利用第二连接部110连接第二导电垫106及地端垫112，及在第二连接部110两侧间隔设置有第一连接部108，使第二导电垫106的高频信号被抑制在第二连接部110中，无法通过 地端垫112辐射到空间，进而达到抑制电磁干扰的目的。
较佳地，为了保证信号导通效果，该第二连接部110采用最短距离到达地端垫112，并且其宽度大于0.3毫米(mm)，具体的数值可根据电路板结构100的尺寸及芯片周围元器件的布局来确定。当第二连接部110是不规则形状时，第二连接部110的宽度可以理解为第二连接部110的最小宽度。另外，第二连接部110不能通过电路板结构100的过孔切换到电路板结构100的其它层。
另外，为了进一步保证抑制效果，设置在第二连接部110一侧的第一连接部108的宽度大于0.25毫米，设置在第二连接部110另一侧的第一连接部108的宽度大于0.25毫米。当位于第二连接部110一侧的第一连接部108是不规则形状时，第一连接部108的宽度可以理解为第一连接部108的最小宽度。该第一连接部108与该第二连接部110之间的间距L为0.25毫米，即位于第二连接部110一侧的第一连接部108与第二连接部110之间的间隔L为0.25毫米，位于第二连接部110另一侧的第一连接部108与第二连接部110之间的间隔L为0.25毫米。
进一步地，该电路板结构100包括位于该基板102上的第三导电垫118及电源垫120，该第三导电垫118连接该电源垫120，该第三导电垫118及该电源垫120均与该第一导电垫104、该第二导电垫106、该第一连接部108、该第二连接部110及该地端垫112绝缘。第三导电垫118可与芯片的电源端管脚连接。而电源垫120可与外部电源连接，使芯片通过电源垫120及第三导电垫118从外部电源获得工作电压。
综上所述，上述电路板结构100中，第二连接部110限制了从第二导电垫106流到地端的信号路径，且间隔设置在第二连接部110两侧的第一连接部108能够起到屏蔽作用从而抑制信号，特别是高频信号从地端辐射到空间，进而降低了EMI干扰。因此，上述电路板结构100只需对电路板的布线做修改，节约研发时间，对电路板结构100上器件摆放基本没有影响，同时也不用增加EMI抑制器件或屏蔽器件，降低产品成本。由于不用增加EMI抑制器件或屏蔽器件，因此也无需变更产品外观或结构设计。
需要指出的是，由上可知，上述电路板结构100能够解决噪声源是通过电路板结构100的地端辐射到空间的问题。第二导电垫106是使用高频探头所寻找到的能量最高点，寻找能量最高点时，可通过把频谱仪中心频率设置成EMI测试不过频点，带宽设置为2～5MHz。
本发明较佳实施方式的电子设备包括电路板结构及芯片。该电路板结构可为以上实施方式的电路板结构100。
该芯片可固定在电路板结构100的芯片区域114。该芯片包括第一管脚、第二管脚及第三管脚。在本实施方式中，该第一管脚为模拟地端管脚且连接该第一导电垫104，该第 二管脚为数字地端管脚且连接该第二导电垫106，该第三管脚为电源端管脚且连接该第三导电垫118。
因此，芯片工作时产生的高频或低频信号(包括噪声)会经过第二管脚及第二导电垫106流到第二连接部110。电路板结构100在第二连接部110两侧间隔设置有第一连接部108，使第二导电垫106的信号被抑制在第二连接部110中，无法通过地端辐射到空间，进而达到抑制电磁干扰的目的。
综上所述，上述电子设备中，电路板结构100能够抑制电磁干扰，无需增加额外EMI抑制器件或屏蔽器件的成本及空间，同时，也无需变更电子设备的产品外观或结构设计。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种电路板结构，其特征在于，包括基板、第一导电垫、第二导电垫、第一连接部、第二连接部及地端垫，该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫位于该基板上，该第一连接部连接该第一导电垫及该地端垫，该第二连接部连接该第二导电垫及该地端垫，该第一连接部间隔地设置在该第二连接部的两侧。
  2. 如权利要求1所述的电路板结构，其特征在于，该第二连接部的宽度大于0.3毫米。
  3. 如权利要求1所述的电路板结构，其特征在于，设置在该第二连接部一侧的该第一连接部的宽度大于0.25毫米，设置在该第二连接部另一侧的该第一连接部的宽度大于0.25毫米。
  4. 如权利要求3所述的电路板结构，其特征在于，该第一连接部与该第二连接部之间的间距为0.25毫米。
  5. 如权利要求1所述的电路板结构，其特征在于，该电路板结构包括位于该基板上的第三导电垫及电源垫，该第三导电垫连接该电源垫，该第三导电垫及该电源垫均与该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫绝缘。
  6. 一种电子设备，其特征在于，包括电路板结构，该电路板结构包括基板、第一导电垫、第二导电垫、第一连接部、第二连接部及地端垫，该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫位于该基板上，该第一连接部连接该第一导电垫及该地端垫，该第二连接部连接该第二导电垫及该地端垫，该第一连接部间隔地设置在该第二连接部的两侧。
  7. 如权利要求6所述的电子设备，其特征在于，该第二连接部的宽度大于0.3毫米。
  8. 如权利要求6所述的电子设备，其特征在于，设置在该第二连接部一侧的该第一连接部的宽度大于0.25毫米，设置在该第二连接部另一侧的该第一连接部的宽度大于0.25毫米。
  9. 如权利要求8所述的电子设备，其特征在于，该第一连接部与该第二连接部之间的 间距为0.25毫米。
  10. 如权利要求6所述的电子设备，其特征在于，该电路板结构包括位于该基板上的第三导电垫及电源垫，该第三导电垫连接该电源垫，该第三导电垫及该电源垫均与该第一导电垫、该第二导电垫、该第一连接部、该第二连接部及该地端垫绝缘。
  11. 如权利要求10所述的电子设备，其特征在于，该电子设备包括芯片，该芯片包括第一管脚、第二管脚及第三管脚，该第一管脚为模拟地端管脚且连接该第一导电垫，该第二管脚为数字地端管脚且连接该第二导电垫，该第三管脚为电源端管脚且连接该第三导电垫。
PCT/CN2015/082629 2015-06-29 2015-06-29 电路板结构及电子设备 WO2017000110A1 (zh)

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