TW201337964A - 包含噴墨列印傳導線路的透明層合物及其形成方法 - Google Patents
包含噴墨列印傳導線路的透明層合物及其形成方法 Download PDFInfo
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- TW201337964A TW201337964A TW101143934A TW101143934A TW201337964A TW 201337964 A TW201337964 A TW 201337964A TW 101143934 A TW101143934 A TW 101143934A TW 101143934 A TW101143934 A TW 101143934A TW 201337964 A TW201337964 A TW 201337964A
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Abstract
本發明揭露一種包含傳導網紗之透明體。該傳導網紗由在聚合物薄膜上或玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯基板上之多數噴墨列印導電線路形成,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。本發明也揭露一種包含透明體(其包括傳導網紗)之飛行載具。此外,本發明也揭露一種將聚合物薄膜及基板層合在一起以製備透明體之方法,其中傳導網紗藉由多數噴墨列印導電線路而形成於聚合物薄膜上。
Description
以下敘述大致關於一種包括傳導網紗之透明體。更特定的,以下敘述關於一種包括傳導網紗之透明體,該傳導網紗由多數噴墨列印導電線路形成,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交,以及關於一種包括該透明體之飛行載具或地面載具。再者,以下敘述關於一種製備包括傳導網紗之透明體的方法。
傳導透明體具有各種用途,例如,傳導透明體可用作飛行載具(例如,航空器)之座艙罩、窗戶或擋風玻璃,或用作地面載具之裝甲等級透明體,諸如AM General HMMWV("HUMVEE®")之擋風玻璃或窗戶。HUMVEE®為AM General有限責任公司之註冊商標。當用作航空器之座艙罩、窗戶或擋風玻璃或地面載具之裝甲等級透明體時,該透明體最好具有除霧及除冰能力。例如,除了其他之外,除霧及除冰可藉由透明體之傳導部(諸如,氧化銦錫(ITO)層或電鍍柵)加熱透明體(例如,窗戶或擋風玻璃),因而防止或減少冰或凝結於透明體上之形成,或者使透明體上已形成之冰或凝結得以融化或蒸發而完成。ITO層有時被包括為裝甲等級透明體之傳導部。
傳導透明體最好也具有防止或減少靜電生成及
具有電磁干擾(EMI)屏蔽的能力,藉此屏蔽載具內之電子系統免於電磁干擾。可以藉著耗盡或消散靜電性(其由於靜電積聚及/或雷擊之故而產生於透明體上)而防止或減少靜電之生成。此外,可藉由防止或減少破壞性電磁輻射(亦即,干擾電子系統之電磁輻射)穿過透明體之傳播而提供EMI屏蔽。
典型之航空器透明體包括成本昂貴且產率很低的傳導部。例如,透明體之傳導部可為經編織之佈線網紗。再者,一些航空器窗戶包括電鍍柵,其需要有機起始劑、銅、光罩與抗蝕層之施用,及銅與鎳之電鍍。每一個製程步驟都增添了整個製程的複雜性、增加了製造成本及操作性損壞值之風險。例如,典型之航空器透明體及裝甲等級透明體係使用真空沉積製程而生產,但真空沉積製程需要昂貴的腔室、相當費時且本身會在透明體或其塗層中產生缺陷。
此外,現有的航空器透明體常無法提供令人滿意之除冰、靜電消散及/或EMI屏蔽能力,而且現在仍在使用之一些傳導透明體的壽命也不令人滿意。因此,需要一種耐用的傳導性航空器透明體及傳導性裝甲等級透明體,其可組配來提供除冰、靜電消散及/或EMI屏蔽性質,而且可以使用比傳統工業技術(諸如,電鍍、真空沉積及經編織佈線網紗之形成)更簡單及更經濟的方法生產。
本發明實施例之面向為針對一種透明體,包括:
一基板;在該基板上之一聚合物薄膜;及由在該聚合物薄膜上之多數噴墨列印導電線路形成之一傳導網紗,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。藉由包括傳導網紗,根據本發明實施例之透明體較現有之航空器或裝甲等級透明體可用遠為低廉之成本生產,因為例示傳導網紗(及例示透明體本身)之生產不需要非常昂貴之真空沉積腔室(其原為生產典型之透明體所需)。此外,本發明實施例之傳導網紗可具有非常大範圍之導電性,結果是,其可被組配來提供優良之EMI屏蔽或靜電消散及/或除冰或除霧。
於某些實施例中,該透明體被組配來提供電磁干擾(EMI)屏蔽。
多數噴墨列印導電線路可被組配來當電流穿過至少一條噴墨列印導電線路時加熱透明體而使得該透明體除冰。
傳導網紗之片電阻範圍可為約0.02至約1,000ohms/sq。
傳導網紗之片電阻範圍可為約0.02至少於400ohms/sq。
傳導網紗之片電阻範圍可為約0.02至約100ohms/sq。
傳導網紗之片電阻範圍可為約0.02至約4ohms/sq。
於某些實施例中,多數噴墨列印導電線路包括噴
墨列印的金屬。
例如,多數噴墨列印導電線路包括選自由Cu、Au、Ni、Ag及其等組合構成之群組的一金屬。
於某些實施例中,該聚合物薄膜包括聚對苯二甲酸乙二酯、聚碳酸酯或聚胺甲酸酯。
於某些實施例中,該基板包括玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯。例如,基板之聚胺甲酸酯可為OPTICOR,其可得自PPG工業公司。OPTICOR為PPG工業公司的商標。
於某些實施例中,該透明體在該聚合物薄膜上之一外覆層;在該外覆層與該聚合物薄膜之間的一第一結合薄膜;及在該聚合物薄膜與該基板之間的一第二結合薄膜。
該外覆層可包括聚碳酸酯、聚丙烯酸酯、玻璃或聚胺甲酸酯。例如,外覆層之聚胺甲酸酯可為OPTICOR,其可得自PPG工業公司,OPTICOR為PPG工業公司的商標。
該第一結合薄膜可包括聚胺甲酸酯、聚乙烯丁醛或聚矽氧。
該第二結合薄膜可包括聚胺甲酸酯、聚乙烯丁醛或聚矽氧。
於某些實施例中,該透明體之可見光透射率為約60%或更大。
於某些實施例中,一種飛行載具包括如上所述之透明體。
本發明實施例之面向也針對一種透明體,包括一基板,該基板包括玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯;及由在該基板上之多數噴墨列印導電線路形成之一傳導網紗,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。
本發明實施例之又一面向針對一種製備一透明體的方法,該方法包括:將一聚合物薄膜及一基板層合在一起,其中一傳導網紗由在該聚合物薄膜上之多數噴墨列印導電線路形成。
將該聚合物薄膜及該基板層合在一起包括:將一外覆層、一第一結合薄膜、該聚合物薄膜、一第二結合薄膜及該基板層合在一起。
將該外覆層、該第一結合薄膜、該聚合物薄膜、該第二結合薄膜及該基板層合在一起包括:將該聚合物薄膜、該第二結合薄膜及該基板層合在一起以形成一經層合基板;將該外覆層及該第一結合薄膜層合在一起以形成一經層合外覆層;及將該經層合基板及該經層合外覆層層合在一起。
於某些實施例中,將該聚合物薄膜及該基板層合在一起包括在約125至約300℉範圍之溫度下加熱及在約50至約220psi範圍之壓力下加壓,達約15分鐘至約5小時範圍之時間。
例如,將聚合物薄膜、第二結合薄膜及基板層合在一起可包括在溫度範圍約150至約300℉下加熱。
將聚合物薄膜、第二結合薄膜及基板層合在一起可包括在壓力範圍約50至約220psi下加壓。
將聚合物薄膜、第二結合薄膜及基板層合在一起的實行時間範圍為約15分鐘至約5小時。
將外覆層及第一結合薄膜層合在一起以形成經層合外覆層可包括在溫度範圍約100至約300℉下加熱。
將外覆層及第一結合薄膜層合在一起以形成經層合外覆層可包括在壓力範圍約100至約250psi下加壓。
將外覆層及第一結合薄膜層合在一起以形成經層合外覆層的實行時間範圍為約1至約5小時。
將經層合基板及經層合外覆層層合在一起可包括在溫度範圍約100至約300℉下加熱。
將經層合基板及經層合外覆層層合在一起可包括在壓力範圍約100至約250psi下加壓。
將經層合基板及經層合外覆層層合在一起的實行時間範圍為約1至約5小時。
本發明實施例也針對一種航空器透明體除冰或除霧之方法,該方法包括:加熱透明體,該透明體包括:一基板;在該基板上之一聚合物薄膜;及一傳導網紗,其由藉著噴墨列印而沉積於聚合物薄膜上之多數相交導電線路所形成,其中該透明體貼附至航空器,及加熱該透明體包括施加電流至至少一條導電線路。
其他本發明實施例係針對一種航空器透明體除冰或除霧之方法,該方法包括:加熱該透明體,該透明體
包括:一基板;及一傳導網紗,其由藉著噴墨列印而沉積於基板上之多數相交導電線路所形成,其中該透明體貼附至航空器,及加熱該透明體包括施加電流至至少一條導電線路。
本發明實施例也針對一種構型航空器以屏蔽電磁干擾(EMI)之方法,該方法包括:將透明體貼附至航空器,其中該透明體包括:一基板;在該基板上之一聚合物薄膜;與藉由噴墨列印沉積於聚合物薄膜上之多數相交導電線路所形成之一傳導網紗。
其他本發明實施例係針對一種構型航空器以屏蔽電磁干擾(EMI)之方法,該方法包括:將透明體貼附至航空器,其中該透明體包括:一基板;及藉由噴墨列印沉積於基板上之多數相交導電線路所形成之一傳導網紗。
本發明實施例也針對一種裝甲等級透明體除冰或除霧之方法,該方法包括:加熱該裝甲等級透明體,該裝甲等級透明體包括:一彈道基板;在該彈道基板上之一聚合物薄膜;及由藉噴墨列印沉積於聚合物薄膜上之多數相交導電線路所形成之一傳導網紗,其中加熱該裝甲等級透明體包括施加電流至至少一條導電線路。
再一本發明實施例係針對一種裝甲等級透明體除冰或除霧之方法,該方法包括:加熱該裝甲等級透明體,該裝甲等級透明體包括:一彈道基板;由及藉著噴墨列印沉積於彈道基板上之多數相交導電線路所形成之一傳導網紗,其中加熱該裝甲等級透明體包括施加電流至至少一條
導電線路。
本發明實施例也針對一種構型載具以屏蔽電磁干擾(EMI)之方法,該方法包括:將裝甲等級透明體貼附至一載具,其中該透明體包括:一彈道基板;在彈道基板上之一聚合物薄膜;及由藉著噴墨列印沉積於聚合物薄膜上之多數相交導電線路所形成之一傳導網紗。
其他本發明實施例係針對一種構型載具以屏蔽電磁干擾(EMI)之方法,該方法包括:將裝甲等級透明體貼附至一載具,其中該透明體包括:一彈道基板;及由藉著噴墨列印沉積於彈道基板之多數相交導電線路所形成之一傳導網紗。
本發明實施例也針對一種智慧窗戶,該智慧窗戶包括:一透明基板;在該透明基板上之一第一透明電極;在該第一透明電極之一穿透度控制層,該穿透度控制層被組配來變化智慧窗戶之透光度;及在穿透度控制層上之一第二透明電極,其中第一及第二透明電極之一者包括由多數噴墨列印導電線路所形成之一傳導網紗,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。
於某些實施例中,該智慧窗戶更包括介於第一透明電極與透明基板之間的聚合物薄膜。
於一實施例中,智慧窗戶包括在第二透明電極上之一聚合物薄膜。
傳導網紗可被直接噴墨列印在聚合物薄膜上或者它可被直接噴墨列印在透明基板上。
20,720‧‧‧基板
30‧‧‧第二結合薄膜
40‧‧‧傳導網紗
42,792‧‧‧聚合物薄膜
50‧‧‧第一結合薄膜
60,80‧‧‧外覆層
70‧‧‧層合基板
200,300‧‧‧透明體
400,500,600‧‧‧層合過程
791‧‧‧第一透明電極
793‧‧‧穿透度控制層
794‧‧‧第二電極
附上之圖式與說明書相結合以說明本發明之例示實施例,而且加上發明說明來解釋本發明之原理。
圖1為包括傳導網紗之透明體的放大橫截面圖。
圖2為本發明例示實施例之多數導電線路的簡圖。
圖3為包括傳導網紗之透明體的放大橫截面圖。
圖4為包括傳導網紗之透明體的放大立體圖。
圖5為顯示聚合物薄膜、第二結合薄膜及基板層合在一起以形成經層合基板之流程圖。
圖6為顯示聚合物薄膜、第二結合薄膜及基板層合在一起以形成經層合基板之簡要說明圖。
圖7為顯示外覆層及第一結合薄膜層合在一起以形成經層合外覆層之流程圖。
圖8為顯示外覆層及第一結合薄膜層合在一起以形成經層合外覆層之簡要說明圖。
圖9為顯示經層合外覆層及經層合基板層合在一起以形成透明體之流程圖。
圖10為顯示經層合外覆層及經層合基板層合在一起以形成透明體之簡要說明圖。
圖11為顯示例示透明體於頻率範圍內之EMI屏蔽有效性的圖形。
圖12為顯示本發明例示實施例之透明體之加熱圖案的熱圖譜。
圖13為顯示例示透明體於光波長範圍內之透光度的圖形。
圖14為根據本發明例示實施例之智慧窗戶的放大橫截面圖。
圖15為根據本發明另一例示實施例之智慧窗戶的放大橫截面圖。
圖16根據本發明另一例示實施例之智慧窗戶的放大橫截面圖。
在以下之詳細說明及申請專利範圍中,描述的是一或多個額外薄膜及層"上"的各種薄膜及層。這僅是表示薄膜及層的相對位置。因此,於一些實施例中,兩薄膜及/或層如文義上所示的彼此相鄰,然而於其他實施例中,相同的兩薄膜及/或層被一或多個額外的薄膜及/或層分隔。在各個案例中,兩薄膜及/或層之一者被認為是在另一薄膜或層"上"。或是,"在…上"可意指"在…下方",例如,在另一薄膜或層上之一薄膜或層也可被認為在另一薄膜或層下方,依據觀看的點而不同。此外,如此處所使用者,術語"薄膜"指稱薄而撓性之片狀物,當不受另一結構特徵支持時,它不會保持靜態形狀。
本發明實施例針對一種包括傳導網紗之透明體。此種透明體具有各種用途,例如作為用於飛行載具(例如,航空器)之座艙罩、窗戶或擋風玻璃,或是作為地面載
具之裝甲等級擋風玻璃或窗戶。例如,本發明實施例之透明體可用作AM General HMMWV("HUMVEE®")之擋風玻璃或窗戶。因此,本發明例示實施例係針對一種包括透明體(其含有傳導網紗)之飛行載具。
於某些實施例中,傳導網紗由聚合物薄膜上之多數噴墨列印導電線路形成,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。例示傳導網紗可得自CIMA Nanotech公司、Dontech公司、Applied Nanotech控股公司、NanoMas Technologies公司及FUJIFILM Dimatix公司。於其他實施例中,傳導網紗由在基板上(例如,實體性接觸)之多數噴墨列印導電線路形成,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。例如,多數噴墨列印導電線路可被直接噴墨列印於基板上,諸如,例如玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯。於某些實施例中,基板之聚胺甲酸酯為OPTICOR,其得自PPG工業公司。OPTICOR係PPG工業公司的商標。例如,基板之聚胺甲酸酯可為任何記載於美國專利申請公開案第2009/0280329 A1號(其全部內容併入此處作為參考)之聚胺甲酸酯。例示導電線路可藉由噴墨列印傳導墨水而製備,諸如購自Novacentrix之METALON®傳導墨水。METALON®為Novacentrix之註冊商標。本發明實施例針對製備包含傳導網紗之透明體的方法。
本發明現在將參考附隨之圖式(其中顯示本發明之例示實施例)加以說明。圖式係本質性說明,不應被解釋
為對本發明之限制。在圖式中,為了容易說明,可能放大薄膜、層及區域之厚度。
圖1顯示透明體之一例示實施例。圖1所示之透明體200可用作航空器之座艙罩、窗戶或擋風玻璃,或用作裝甲等級之透明體(諸如用於地面載具之裝甲等級透明體)。如圖1所示,透明體200包括基板20及傳導網紗40。傳導網紗40包括多數條噴墨列印導電線路,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。傳導網紗40可位在聚合物薄膜上,且多數條噴墨列印導電線路可與聚合物薄膜實體性接觸。或者,多數條噴墨列印導電線路可被直接噴墨列印在基板20上(例如,噴墨列印導電線路可實體性接觸基板20)。然而,透明體不限於只具有單一傳導網紗。例如,可重複傳導網紗40以在基板30上形成一堆疊構造。傳導網紗40也可位在基板20的相對側上以形成三明治構造。在基板20相對側上的傳導網紗40可以是單一薄膜,或是形成堆疊構造的多層薄膜。
根據本發明某些實施例,多數導電線路彼此空間上分離。例如,多數條噴墨列印導電線路可空間上相隔任何距離,只要該距離適於提供傳導網紗EMI屏蔽、除冰及/或除霧。例如,該等間隔應該具有一定大小,其適於防止或減輕正被遮蔽之特定範圍的電磁輻射穿過透明體而透射。若間隔太大(例如,大於要被遮蔽之電磁輻射的波長),傳導網紗將無法提供所欲的屏蔽。鑒於此種間隔對於傳導網紗之EMI屏蔽性質的作用,網紗中之間隔應該小於或實
質上小於正被遮蔽之電磁輻射的波長(例如,實質上小於干擾電子系統之破壞性電磁輻射的波長)。
然而,網紗中噴墨列印之導電線路的排列並不受限。也就是說,網紗(亦即,多數噴墨列印導電線路)可以圖案或鑲嵌式鋪裝(tessellation)之形式排列。例如,網紗可以排列成正方格形、三角磚形、六邊磚形或由直線、波狀線、正弦曲線或彎折線所形成的格子。網紗可排列成一致、非一致、重複或隨機圖案的形式。在圖2所示之傳導網紗的簡圖中可以見到多數噴墨列印之導電線路的正方格形排列的例示實施例。如圖2所示,多數噴墨列印導電線路顯示為直線,其於噴墨列印導電線路之間界定出重複的正方形圖案。在該特別實施例中,各個噴墨列印導電線路的寬度約為25μm,但是並不限於此。此外,在該特別實施例中,噴墨列印導電線路之間的各個正方形的寬度約為250μm,但是並不限於此。
現在將敘述根據本發明實施例之透明體之額外的薄膜及層。依據特別的實施例,這些額外的薄膜及/或層可出現或不會出現於透明體中。例如,根據本發明實施例之透明體顯示於圖3。此外,根據此實施例之透明體的放大立體圖顯示於圖4。如圖3及4所示,透明體300包括外覆層60、第一結合薄膜50、由多數噴墨列印之導電線路在聚合物薄膜42上形成的傳導網紗、第二結合薄膜30及基板20。外覆層60、第一結合薄膜50、聚合物薄膜42及第二結合薄膜30可堆疊在基板20上一次,或者它們可重複地堆疊許多
次以形成多數堆疊構造。此外,這些薄膜與層可在基板20的相對側上,以形成三明治構造。在基板20之相對側上的薄膜及層可堆疊一次,或者它們可重複多次以形成多層堆疊構造。
外覆層60保護透明體。它應該是耐受性且應該能夠抵擋刮擦或其他形式的實體損害。外覆層也應該抵擋來自天氣或其他形式之化學攻擊的損害。例如,外覆層60可包括合適的有機樹脂,諸如聚丙烯酸酯(例如,聚甲基丙烯酸甲酯(PMMA))、聚碳酸酯(例如雙酚A聚碳酸酯)或聚胺甲酸酯、玻璃或其他具有合適之透射與保護性質的材料。於某些實施例中,外覆層的聚胺甲酸酯為OPTICOR,其可得自於PPG工業公司。OPTICOR為PPG工業公司的商標。例如,外覆層的聚胺甲酸酯可為美國專利申請早期公開案第2009/0280329 A1號中所記載之聚胺甲酸酯,該公開案的全部內容併入此處做為參考。外覆層的厚度範圍為約0.1至約0.75英吋。
第一結合薄膜50蓋住外覆層60中的缺陷並促進外覆層60黏著至聚合物薄膜42。例如,第一結合薄膜50使外覆層60與聚合物薄膜42連接,而且能夠使外覆層60與聚合物薄膜42結合。於某些實施例中,第一結合薄膜50包括聚胺甲酸酯、聚乙烯丁醛(PVB)、聚矽氧或其他具有合適黏著特性的材料。聚胺甲酸酯的分子量範圍為100,000至300,000g/mol,但不限於此。聚乙烯丁醛的分子量範圍為200,000至300,000g/mol,但不限於此。第一結合薄膜50的
厚度範圍為約0.003至約0.100英吋。
類似於第一結合薄膜50,第二結合薄膜30蓋住基板20中的缺陷並促進基板20黏著至聚合物薄膜42。據此,第二結合薄膜30使基板20連接至聚合物薄膜42,且應該能夠使基板20結合至聚合物薄膜42。於某些實施例中,第二結合薄膜30包括聚胺甲酸酯、聚乙烯丁醛(PVB)、聚矽氧或其他具有合適黏著性質的材料。聚胺甲酸酯的分子量範圍可為100,000至300,000g/mol,但不限於此。聚乙烯丁醛的分子量範圍可為200,000至300,000g/mol,但不限於此。第二結合薄膜30的厚度範圍可為約0.003至約0.100英吋。
如上所述,於某些實施例中,傳導網紗由聚合物薄膜42上之多數噴墨列印導電線路形成。多數噴墨列印導電線路可噴墨列印在任何合適的聚合物薄膜上,諸如,例如,聚對苯二甲酸乙二酯、聚碳酸酯或聚胺甲酸酯。根據本發明其他實施例,傳導網紗由噴墨列印於玻璃、聚丙烯酸酯、聚碳酸酯或其他合適基板上之多數噴墨列印導電線路形成。於本發明之任一實施例中,多數導電線路可由噴墨列印之傳導墨水製備,諸如購自Novacentrix的METALON®傳導墨水。於某些實施例中,多數噴墨列印導電線路包括任何合適的噴墨列印金屬,諸如選自由銅(Cu)、金(Au)、鎳(Ni)、銀(Ag)及其等組合組成之群組的金屬。例如,多數噴墨列印導電線路可包括Cu。多數導電噴墨列印的線路可更包括環氧化物或其他具有合適結合性質的材料。
如以下將進一步說明者,可以形成多數噴墨列印導電線路使得透明體被組配來提供EMI屏蔽。此外,如以下將進一步說明者,多數噴墨列印導電線路可被組配為藉由加熱透明體(當電流通過至少一條噴墨列印導電線路時)使透明體除冰。例示透明體之EMI屏蔽或除冰能力可來自傳導網紗40的片電阻。例如,於某些實施例中,傳導網紗40可具有範圍在約0.02至約1,000ohms/sq的片電阻。於其他實施例中,傳導網紗40可具有少於400ohms/sq的片電阻。於另一實施例中,傳導網紗40可具有少於100ohms/sq的片電阻。
傳導網紗40可在聚合物薄膜42上。聚合物薄膜可包括任何合適的聚合物,諸如聚對苯二甲酸乙二酯、聚碳酸酯或聚胺甲酸酯,但本發明不限於此。於某些實施例中,多數導電線路實體上接觸聚合物薄膜。例如,多數噴墨列印導電線路可噴墨列印於聚合物薄膜上(例如,藉由噴墨列印沉積於聚合物薄膜上)。聚合物薄膜的厚度範圍為約70μm至約1,000μm。多數噴墨列印導電線路各可具有的寬度範圍為約20μm至約50μm。多數噴墨列印導電線路各可具有的厚度範圍為約50nm至約5μm。導電線路之厚度及/或寬度可以改變以變化透明體的EMI屏蔽、除冰及/或除霧性質。
類似於外覆層60,基板20也保護透明體300。因此,基板20應該耐久且應該能夠抵擋刮擦或其他形式的實體性損害。基板也應該抵擋來自天氣或其他形式之化學攻擊所造成的損害。例如,基板20可包括任何合適的有機樹脂,諸如聚碳酸酯(例如,雙酚A聚碳酸酯)、聚丙烯酸酯(例
如,聚甲基丙烯酸甲酯(PMMA))或聚胺甲酸酯、玻璃或其他具有合適透射及保護性質的材料。於某些實施例中,基板的聚胺甲酸酯為OPTICOR,其可得自於PPG工業公司。OPTICOR是PPG工業公司的商標。例如,基板的聚胺甲酸酯可為美國專利申請早期公開案第2009/0280329 A1號中記載之任何聚胺甲酸酯,該公開案之全部內容併入此處作為參考。基板的厚度範圍為約0.125至約0.75英吋。
現在將大致說明製備透明體的方法。例如,根據本發明之一實施例,製備透明體的方法包括噴墨列印至基板上,其中至少一條噴墨列印導電線路至少一條其他噴墨列印導電線路相交。如上所討論者,基板可包括玻璃、聚丙烯酸酯、聚碳酸酯、OPTICOR或其他具有合適的傳送及保護性質的材料。於某些實施例中,基板的聚胺甲酸酯為OPTICOR,其可得自於PPG工業公司。OPTICOR為PPG工業公司的商標。例如,基板的聚胺甲酸酯可為美國專利申請早期公開案第2009/0280329 A1號中記載之任何聚胺甲酸酯,該公開案之全部內容併入此處作為參考。噴墨列印導電線路可藉由將合適的墨水噴墨列印於基板上而形成。例如,導電線路可藉由噴墨列印傳導墨水(諸如,購自Novacentrix之METALON®傳導墨水)於基板上而製備。可根據任何合適的噴墨列印技術執行噴墨列印,諸如那些描述於Huang,Lu等人,"用於直接噴墨列印撓性傳導圖案之以石墨烯為主的傳導墨水與它們在電路及化學感測器的應用",奈米研究(2011)第4卷第7期,第675-684頁的噴墨列印技
術,其全部內容併入此處做為參考。
噴墨列印具有可與許多種類的基板相容之低成本、非接觸性應用的優點。此外,噴墨列印不需要遮罩圖案化,可在低溫下操作,而且不需要真空加工。噴墨列印可不經接觸基板而沉積傳導液體。噴墨印刷機可以電腦數位驅動來精確地劃出格線。噴墨列印機可具有數個噴頭,各噴頭空間上相距約254微米並可形成大小範圍約1至約10皮升(picoliter)的粒滴,但本發明不限於此。於某些實施例中,由於壓電效應之故,噴頭施加墨水珠粒至基板。例如,如描述於Griggs,C.等人,"噴墨列印於工業應用上的機會",工業+特化品印刷,2010年5月/6月(可自http://www.dimatix.com/files/isp05-0610p18-22.pdf取得),其全部內容併入此處做為參考,可使用噴墨列印來列印小至20μm的特徵。
於本發明另一實施例中,製備透明體之方法包括將聚合物薄膜及基板層合在一起,其中傳導網紗藉由聚合物薄膜上之多數噴墨列印導電線路而形成。例如,如圖5所示,聚合物薄膜、第二結合薄膜及基板(例如聚合物薄膜42、第二結合薄膜30及基板20)可在層合過程400中被層合在一起以形成層合基板70。此層合過埕的簡單說明顯示於圖6。此層合過程可包括在溫度範圍約200至約300℉間加熱聚合物薄膜、第二結合薄膜及基板。再者,此層合過程可包括在壓力範圍約50至約250psi間加壓聚合物薄膜、第二結合薄膜及基板。實行將聚合物薄膜、第二結合薄膜及基板
層合在一起的時間範圍可以為約15分鐘至約5小時。
如圖7所示,外覆層及第一結合薄膜(例如外覆層60及第一結合薄膜50)可在層合過程500中被層合在一起以形成經層合的外覆層80。此層合過程之簡單說明顯示於圖8。此層合過程可包括在溫度範圍約100至約300℉間加熱外覆層及第一結合薄膜。再者,此層合過程可包括在壓力範圍約100至約250psi間加壓外覆層及第一結合薄膜。實行將外覆層及第一結合薄膜層合在一起的時間範圍為約1至約5小時。
如圖9所示,經層合之外覆層80及經層合之基板70可於層合過程600中層合在一起而形成透明體300。此層合過程的簡單說明顯示於圖10。此層合過程可包括在溫度範圍約100至約300℉間加熱經層合之外覆層及經層合之基板。再者,此層合過程可包括在壓力範圍約100至約250psi間加壓經層合外覆層及經層合基板。實行將經層合外覆層及經層合基板兩者層合在一起的時間範圍可為約1至約5小時。上述層合過程之一或多者可在已經事先清空之密閉真空塑膠袋中進行。此外,上述層合過程之一或多者可在壓力釜中進行。
根據本發明實施例之透明體可為平面或經形塑的透明體。依此,前述製備透明體的方法也可包括形塑透明體。透明體可在上述製備過程任一者之前、期間或之後形塑。例如,可在將多數導電線路直接噴墨列印於基板上之前、期間或之後形塑基板。此外,可在將基板及聚合物
薄膜層合在一起之前、期間或之後形塑基板。例如,可在聚合物薄膜、第二結合薄膜及基板被層合在一起以形成經層合基板之前或之後形塑基板,或者可於層合過程期間形塑基板。再者,可在將外覆層及第一結合薄膜層合在一起以形成經層合之外覆層之前或之後形塑基板,或者可在層合過程期間形塑基板。類似地,可在將經層合之外覆層及經層合之基板層合在一起以形成透明體之前或之後形塑基板,或者可在層合過程期間形塑基板。
根據本發明實施例之透明體較現有之航空器透明體及裝甲等級透明體提供更為顯著的優點。例如,藉由使用此處所述之傳導網紗,可以不經使用數百萬美金之真空沉積室(其為製備現有航空器透明體及裝甲等級透明體所必須)而製造本發明之透明體。依此,與現有之航空器及裝甲等級透明體相較,此處所述之透明體之製造成本可以大幅地減少。
雖然早已可以取得傳導網紗,但是它們從未被用於航空應用中(例如,用於航空器之透明體),而且這種傳導網紗也未被使用於與裝甲等級之透明體有關的應用中。這些應用(例如,航空及裝甲等級之透明體的應用)有特別的需求(以下將進一步討論),以前並不知道根據本發明實施例之傳導網紗將會合適地滿足這些需求。發明人對於現在描述之透明體及傳導網紗在航空與裝甲等級之應用中具有突出的表現確實感到訝異。然而,於測試這些傳導網紗及透明體時,發明人出乎意料地發現這些傳導網紗及透明體展現
出優異的耐受性、EMI屏蔽、除冰及/或除霧的能力。
雖然傳導網紗也適合與例如顯示裝置一起使用,但是本發明之傳導網紗係針對航空及裝甲等級之透明體應用的特別需求。例如,根據本發明實施例之傳導網紗包括此處所述之特別厚度、材料、構型及/或片電阻。不會為了滿足航空及裝甲等級之透明體應用的需求,而構型用於其他應用(諸如顯示裝置)之傳導網紗。例如,對於航空及裝甲等級之透明體應用而言,用於顯示裝置(其中灰塵是主要關切點)之傳導網紗可能過薄且具有過高的片電阻。此外,用於顯示裝置的傳導網紗不會為了冰或除霧而構型。
本發明之例示透明體可被組配來提供航空器或裝甲等級之透明體所需的EMI屏蔽。也就是,透明體可被組配來防止或減少破壞性電磁輻射(即,干擾電子系統之電磁輻射)穿過透明體的透射。藉由防止或減少破壞性電磁輻射穿過透明體的透射,透明體防止或減少對於電子系統(諸如,航空器內之電子系統)的電磁干擾效應。此外,透明體之EMI屏蔽防止或減少航空器內電子系統發出之電磁輻射對於航空器外邊之電子系統的干擾效應。
傳導網紗之EMI屏蔽性質至少部份來自其導電性。例如,施加電場至傳導網紗之一側可在傳導網紗中誘發電流,其可引起傳導網紗內部電荷的移動,藉此消除作用於透明體之另一側上的電場。由於被誘發電流的緣故,某些電磁輻射(例如,干擾電子系統之電磁輻射)至少部分地為傳導網紗反射,因而防止或減少電磁輻射穿過透明體的
透射。擺動磁場以實質類似之方式與傳導網紗交互作用,但靜態磁場不會。
因為傳導網紗之EMI屏蔽作用至少部分來自於傳導網紗中的誘導電流,所以傳導網紗之屏蔽有效性至少部份依靠傳導網紗的電阻(或片電阻;即,導電性)決定。例如,當傳導網紗之電阻(或片電阻)增加,誘導傳導網紗內之電流會變得困難。結果是,傳導網紗之電阻增加典型上降低了傳導網紗之EMI屏蔽的有效性。據此,藉由適當地選擇傳導網紗之導電性(或片電阻),可構型透明體以提供EMI屏蔽。例如,可在圖11之圖形中見到例示透明體(其包含聚碳酸酯基板與聚碳酸酯外覆層之間的例示傳導網紗)之EMI屏蔽有效性。如圖11所示,對於頻率範圍為約1GHz至約18GHz之電磁輻射,透明體提供之EMI屏蔽的範圍為約20至約50dB,且在18GHz時的平均屏蔽有效性為25dB。當透明體被組配來提供航空器或裝甲等級之透明體所需的EMI屏蔽時,透明體可包括電性連接(諸如,匯流排柵),但是此種電氣連接對於提供EMI屏蔽並不是必要的。
此外,傳導網紗之導電性可讓透明體得以防止或減少靜電在透明體上產生,否則會導致凝結及/或雷擊。例如,傳導網紗可具有低片電阻(即,高導電性),藉此耗盡或消散靜電,否則其會生成於透明體上。具有低片電阻之傳導網紗也可提供額外的優點,諸如雷達衰減。依此,傳導網紗之片電阻的範圍為約0.02至約1,000ohms/sq。例如,傳導網紗可具有少於400ohms/sq之片電阻,或少於100ohms/sq
之片電阻。與本發明實施例相反,少於0.3ohms/sq之片電阻無法以連續性氧化銦錫(ITO)傳導塗層(在一些案例中,其為特別之航空器透明體所需)達成。
除了傳導網紗電阻(或片電阻)之外,傳導網紗之EMI屏蔽也依據傳導網紗之組成(例如,噴墨列印之導電線路的組成)、各條噴墨列印之導電線路的厚度、屏蔽體積之大小、被屏蔽之電磁輻射的頻率及大小與傳導網紗中噴墨列印之導電線路之間的空隙特質而不同。
除了被構型以提供EMI屏蔽的能力之外,透明體可藉由讓電流通過傳導網紗之至少一條噴墨列印導電線路來加熱透明體而被組配來使透明體除冰或除霧。或是,不被組配來提供EMI屏蔽的能力,而被組配為藉由讓電流通過傳導網紗之至少一條噴墨列印導電線路來加熱透明體,使透明體除冰或除霧。也就是說,除霧或除冰可經由施加電流到至少一部分之傳導網紗以加熱透明體(例如,航空器之座艙罩、窗戶或擋風玻璃,或裝甲載具之擋風玻璃或窗戶)而完成,因而防止或檢少透明體上凝結或冰的形成,或是蒸發或融解已經形成的凝結或冰。
例如,圖12之紅外線熱圖譜中可見到根據例示本發明實施例之透明體加熱圖案。紅外線熱圖譜可利用熱成像相機(其偵測電磁光譜中紅外線範圍之輻射並產生擋風玻璃/窗戶熱影像)而獲得。使用14/18DC伏特供能予擋風玻璃/窗戶直到擋風玻璃/窗戶之表面溫度達到100至150℉,然後擋風玻璃/窗戶之熱影像會被紀錄。如這些紅外線熱圖譜
所示,儘管傳導網紗的片電阻非常低(例如約0.02至約4ohms/sq),但例示透明體展現出適合用於航空器之座艙罩、窗戶或擋風玻璃除霧或除冰的優良加熱圖案。圖12中觀察到的加熱圖案提供了比現有航空器透明體及裝甲等級透明體更意想不到且令人期待的結果,在這種結果中,例示透明體比起某些現有的透明體呈現出更為一致的加熱效果。
再者,可以為了特別應用而調整例示透明體之特殊除冰及/或除霧能力。典型上,航空器駕駛艙之擋風玻璃比航空器駕駛艙之側窗需要更強的除冰能力,因而,就瓦/平方英吋而言,典型上施加至航空器駕駛艙擋風玻璃之瓦/平方英吋(例如,約4至約5W/in.sq.)比施加至航空器駕駛艙側窗(例如,約1至約2W/in.sq.)者還大。因此,藉由適當選擇傳導網紗之片電阻,可調整透明體之除冰及/或除霧能力以適合於特別的應用。此外,透明體可包括電氣連接(諸如匯流排柵)來完成除冰或除霧作用。
然根據本發明實施例之透明體可被組配為獨立具有除冰或EMI屏蔽能力,但是發明人也驚訝地發現根據本發明實施例之透明體可被組配為兼具除冰及EMI屏蔽能力(例如,對於航空器透明體有所助益的能力)。根據本發明實施例之透明體之除冰及EMI屏蔽能力的組合較現有航空器透明體提供了意料之外且所欲的結果。
除了除冰及/或EMI屏蔽能力之外,根據本發明實施例之透明體也具有非常高的可見光透射率。例如,此種透明體可具有大於60%、大於65%、大於70%或大於84%
的可見光透射率。如圖13中之圖形所示,根據本發明實施例之例示透明體在可見光範圍(例如,波長約400nm至約750nm)以及在近紅外線範圍(例如,波長約700至約900nm)均具有高度的光透射率。例如,圖13顯示,根據本發明實施例之例示透明體在波長約700至約900nm時具有約74%的光透射率。近紅外線範圍對於夜視設備(夜視設備藉由使用將近紅外線轉換為可見光的裝置,讓使用者得以利用比單用肉眼觀察範圍更廣的電磁輻射光譜,因而可以看見影像)特別地有用。
此外,本發明實施例係針對透明體,諸如具有可見光透射性質的智慧窗戶或可開關窗戶。例如,本發明實施例係針對電致變色裝置、懸浮微粒裝置及液晶裝置。上述之傳導網紗可被用作一或多個任一前述裝置中的透明電極。例如,電致變色裝置、懸浮微粒裝置或液晶裝置可包括含有傳導網紗(其由多數噴墨列印之導電線路形成)的透明電極,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。如上本發明其他實施例所敘述者,當用作這些裝置中之透明電極時,傳導網紗可在聚合物薄膜上或是它可在基板上。傳導網紗之操作或構型與先前之例示實施例實質上相同,因此,將不再提供進一步說明。
於一實施例中,智慧窗戶包括:透明基板;透明基板上之第一透明電極;第一透明電極上之穿透度控制層,穿透度控制層被組配來改變智慧窗戶之光穿透度;及穿透度控制層上之第二透明電極,其中第一及第二透明電極之一者
包括由多數噴墨列印之導電線路在透明基板上形成的傳導網紗,其中至少一條噴墨列印之導電線路至少一條其他噴墨列印之導電線路相交。圖14為包含根據本發明實施例之例示傳導網紗之智慧窗戶的放大橫截面圖式。如圖14所示,智慧窗戶包括基板720、第一透明電極791、穿透度控制層793及第二電極794。各個第一及第二透明電極791及794或是第一及第二透明電極791及794兩者分別地可包括傳導網紗。基板720可為任何合適的基板,包括那些先前實施例中所描述的例示基板。穿透度控制層793可包括任何適於改變智慧窗戶穿透度之電致變色材料、懸浮粒子或液晶。
於某些實施例中,智慧窗戶也包括聚合物薄膜。例如,圖15為例示智慧窗戶(其包括基板720與第一透明電極791間的聚合物薄膜792)之放大橫截面圖。此外,圖16為例示智慧窗戶(其包括第二透明電極794上之聚合物薄膜792)之放大橫截面圖。聚合物薄膜可為如上所述之任何合適的聚合物薄膜。如上所述,傳導網紗可被直接噴墨列印於聚合物薄膜792上或者它可被直接噴墨列印於透明基板720上。
作為透明電極,傳導網紗可被組配來提供電氣訊號以引起裝置透明度及/或顏色之改變,此係藉由引起穿透度控制層之電致變色材料、懸浮粒子、聚合物或液晶的變化而達成。裝置可包括任何合適的電致變色材料,諸如電致變色聚合物(例如聚苯胺)、紫原素(viologens)、聚側氧鎢酸鹽(polyoxotungstates)、氧化鎢、氧化鎳及/或二氧化鎢。
例示電致變色裝置於美國專利第7,256,923號中有更詳細的描述,該專利之全部內容併入此處做為參考。額外之例示智慧窗戶更詳細地描述於Niklasson,G.A.與Granqvist,C.G.,"用於智慧窗戶之電致變色件:氧化鎢及氧化鎳薄膜,與基於這些薄膜的裝置",J.Mater.Chem.,17,127-156(2007),其全部內容併入此處做為參考。
以下的實例僅作為說明之用,不應被視為對本發明請求範圍之限制。
根據本發明實施例製備數個例示透明體。透明體藉由將傳導網紗(其由聚合物薄膜上之多數噴墨列印導電線路形成)、第二結合薄膜及玻璃基板層合在一起以形成經層合之基板而製備。例示之聚合物薄膜上的傳導網紗可從CIMA Nanotech公司、Dontech公司、Applied Nanotech控股公司、NanoMas Technologies公司與FUJIFILM Dimatix公司獲得。在層合過程前,兩傳導匯流排柵(1cm寬)被垂直地施用於傳導網紗的上方以提供編織體(braids)的施用位置。這些編織體被用於紀錄經層合透明體之電阻。於此特別實例中,第二結合層包含聚胺甲酸酯。由多數噴墨列印之導電線路在聚合物薄膜上形成之傳導網紗、第二結合薄膜及基板被放入密閉真空塑膠袋中,其然後被抽真空。由多數噴墨列印之導電線路在聚合物薄膜上形成之傳導網紗、第二結合薄膜及基板在溫度範圍約200至約250℉、壓力範圍約50至約100psi及時間範圍約60至約90分鐘下層合在一起,以
形成經層合之基板。
外覆層及第一結合薄膜被層合在一起以形成經層合之外覆層。於此特別實例中,覆層包含聚碳酸酯且第一結合層包含聚胺甲酸酯。外覆層及第一結合薄膜被放入密閉真空塑膠袋中,然後抽真空。外覆層及第一結合薄膜在溫度範圍約200至約250℉、壓力範圍約120至約150psi及時間範圍約1至約2小時下層合在一起以形成經層合之外覆層。
經層合之外覆層及經層合之基板又被層合在一起以形成例示透明體。經層合之外覆層及經層合之基板被放入密閉真空塑膠袋中,然後抽真空。經層合之外覆層及經層合之基板在溫度範圍約125至約175℉、壓力範圍約100至約200psi及時間範圍約1至約2小時下層合在一起以形成例示透明體。
於根據實例1製備之層合試驗件上執行環境耐久性試驗。各個層合試驗件近似航空器擋風玻璃之特性。試驗件之光學及抵抗性質都沒有遭到實質上的破壞。環境耐久性試驗之結果顯示於以下的表1中。試驗件上執行之QUV及溼度試驗沒有顯示對於電阻與透光度有任何實質上的減損。此外,含噴墨列印薄膜之層合窗戶的結合抗張強度經測定為1200psi。為了鑑定結合強度之特性,各個層合試驗件被切成2英吋乘2英吋的樣品。各個樣品使用環氧化物黏劑(9460 HYSOL)而黏附於兩鋁立方塊(2立方英吋大小)之間。HYSOL為Henkel公司的註冊商標。使用來自United Calibration公司之抗張試驗機,藉由朝垂直結合界面之方向
拉扯各鋁立方塊直到結合破壞,來測量結合強度。試驗拉扯速度為0.05英吋/分鐘,並使用個人電腦來控制拉扯速度及獲得之資料。
依據ASTM D1003,使用Haze-Gard Plus儀器測試根據實例1製備之一6英吋乘12英吋之試驗件。霾度為透明體之清晰度及透明度之測量值(該透明體不應漫射實質數量的光線),而透光度或可見光透射率表示透過樣本之可見光數量。該試驗件展現68-70%之可見光透射率及3-4%之霾度。根據試驗結果,該試驗件滿足航空器座艙罩、擋風玻璃及窗戶所要求之可見光透射率及霾度值,其等分別為65%以上及10%以下。
使用來自Guardian製造公司之四點探針表面電阻儀測試根據實例1製備之一6英吋乘12英吋試驗件的片電阻。該傳導網紗之片電阻經決定於層合作用前為0.15-0.3ohm/sq,於層合作用後為0.25-0.48ohm/sq。
根據實例1製備之一6英吋乘12英吋試驗件在122℉(50℃)下被暴露於100%凝結溼度中達13星期。溼度試驗之前,試驗件呈現69.3%之可見光透射率及3.65%之霾度(如上述霾度及透光度試驗所決定者)。溼度試驗後,試驗件呈現70%之可見光透射率及3.61%之霾度(如上述霾度及透光度試驗所決定者)。根據以上試驗結果,試驗件之可見光透
射率及霾度不會受到溼度試驗的嚴重影響。
根據實例1製備之一6英吋乘12英吋試驗件在158℉(70℃)下暴露於紫外線(UV)輻射達8小時。該試驗件然後在122℉(50℃)暴露於凝結情況下達4小時。該循環重複總計達2,184小時(10星期)。於QUV試驗前,試驗件呈現68.9%之可見光透射率及3.87%之霾度。於QUV試驗後,試驗件呈現68.7%之可見光透射率及3.76%之霾度(如上述霾度及透光度試驗所決定者)。如表1所示,QUV試驗不會顯著改變試驗件之可見光透射率或霾度。
一些上述試驗結果簡述於以下的表1及2中。
執行層合試驗件之熱(溫度)循環試驗以評估試驗件在極端天氣狀況下(例如-40℉至150℉)的環境耐久性。在熱循環試驗中,於室溫(RT)、20℉、0℉、-20℉、-40℉、室溫及150℉下測定傳導網紗之匯流排至匯流排電阻。層合試驗件之-40℉與150℉間的熱循環,於20循環後沒有顯示對片電阻造成顯著影響。熱循環之結果簡述於以下之表3中。
雖然本發明已經參考例示實施例而說明,要了解的是,本發明不限於所揭露的實施例,相反地,本發明想要涵蓋各種修飾及均等的安排,其等都被包括於後附申請專利範圍(與其均等範圍)之精神與範疇內。
20‧‧‧基板
40‧‧‧傳導網紗
200‧‧‧透明體
Claims (20)
- 一種透明體,包括:一基板;在該基板上之一聚合物薄膜;及由在該聚合物薄膜上之多數噴墨列印導電線路形成之一傳導網紗,其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。
- 如申請專利範圍第1項的透明體,其中該透明體係組配來提供電磁干擾(EMI)屏蔽。
- 如申請專利範圍第1項的透明體,其中該等多數噴墨列印導電線路係組配為藉由當一電流通過至少一條噴墨列印導電線路時,加熱該透明體而使該透明體除冰。
- 如申請專利範圍第1項的透明體,其中該傳導網紗具有約0.02至約1,000ohms/sq範圍的片電阻。
- 如申請專利範圍第1項的透明體,其中該等多數噴墨列印導電線路包括一噴墨列印的金屬。
- 如申請專利範圍第1項的透明體,其中該等多數噴墨列印導電線路包括選自由Cu、Au、Ni、Ag及其等之組合構成之群組的一金屬。
- 如申請專利範圍第1項的透明體,其中該聚合物薄膜包括聚對苯二甲酸乙二酯、聚碳酸酯或聚胺甲酸酯。
- 如申請專利範圍第1項的透明體,其中該基板包括玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯。
- 如申請專利範圍第1項的透明體,更包括:在該聚合物薄膜上之一外覆層;在該外覆層與該聚合物薄膜之間的一第一結合薄膜;及在該聚合物薄膜與該基板之間的一第二結合薄膜。
- 如申請專利範圍第9項的透明體,其中該外覆層包括玻璃、聚碳酸酯、聚丙烯酸酯或聚胺甲酸酯。
- 如申請專利範圍第9項的透明體,其中該第一結合薄膜包括聚胺甲酸酯、聚乙烯丁醛或聚矽氧。
- 如申請專利範圍第9項的透明體,其中該第二結合薄膜包括聚胺甲酸酯或聚乙烯丁醛。
- 如申請專利範圍第1項的透明體,其中該透明體具有約60%或更大的可見光透射率。
- 一種飛行載具,包括申請專利範圍第1項之透明體。
- 一種智慧窗戶,包括申請專利範圍第1項之透明體,其中該傳導網紗為一第一透明電極且該智慧窗戶更包括:在該第一透明電極上之一穿透度控制層,該穿透度控制層係組配來變化該智慧窗戶之該光透射率;及在該穿透度控制層上之一第二透明電極。
- 一種透明體,包括:一基板,該基板包括玻璃、聚丙烯酸酯、聚碳酸酯或聚胺甲酸酯;及由該基板上之多數噴墨列印導電線路形成之一傳導網紗, 其中至少一條噴墨列印導電線路與至少一條其他噴墨列印導電線路相交。
- 一種製備透明體的方法,該方法包括:將一聚合物薄膜及一基板層合在一起,其中一傳導網紗由在該聚合物薄膜上之多數噴墨列印導電線路形成。
- 如申請專利範圍第17項的方法,其中將該聚合物薄膜及該基板層合在一起的步驟包括:將一外覆層、一第一結合薄膜、該聚合物薄膜、一第二結合薄膜及該基板層合在一起。
- 如申請專利範圍第18項的方法,其中將該外覆層、該第一結合薄膜、該聚合物薄膜、該第二結合薄膜及該基板層合在一起的步驟包括:將該聚合物薄膜、該第二結合薄膜及該基板層合在一起以形成一經層合基板;將該外覆層及該第一結合薄膜層合在一起以形成一經層合外覆層;及將該經層合基板及該經層合外覆層層合在一起。
- 如申請專利範圍第17項的方法,其中將該聚合物薄膜及該基板層合在一起的步驟包括在約125至約300℉範圍之溫度下加熱,及在約50至約220psi範圍之壓力下加壓,達約15分鐘至約5小時範圍之期間。
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CA2865916C (en) | 2020-06-23 |
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US9900980B2 (en) | 2018-02-20 |
US20180192515A1 (en) | 2018-07-05 |
US9302452B2 (en) | 2016-04-05 |
JP6599963B2 (ja) | 2019-10-30 |
JP2015513487A (ja) | 2015-05-14 |
TWI579866B (zh) | 2017-04-21 |
US20130228365A1 (en) | 2013-09-05 |
US10420210B2 (en) | 2019-09-17 |
US20160242282A1 (en) | 2016-08-18 |
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