TW201335330A - 導電性接著劑及電子零件之連接方法 - Google Patents

導電性接著劑及電子零件之連接方法 Download PDF

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Publication number
TW201335330A
TW201335330A TW101147305A TW101147305A TW201335330A TW 201335330 A TW201335330 A TW 201335330A TW 101147305 A TW101147305 A TW 101147305A TW 101147305 A TW101147305 A TW 101147305A TW 201335330 A TW201335330 A TW 201335330A
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TW
Taiwan
Prior art keywords
solder particles
electronic component
temperature
organic peroxide
minute half
Prior art date
Application number
TW101147305A
Other languages
English (en)
Chinese (zh)
Inventor
Daisuke Sato
Ryosuke Odaka
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201335330A publication Critical patent/TW201335330A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
TW101147305A 2011-12-15 2012-12-14 導電性接著劑及電子零件之連接方法 TW201335330A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011274841A JP6231257B2 (ja) 2011-12-15 2011-12-15 導電性接着剤、及び電子部品の接続方法

Publications (1)

Publication Number Publication Date
TW201335330A true TW201335330A (zh) 2013-09-01

Family

ID=48612508

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101147305A TW201335330A (zh) 2011-12-15 2012-12-14 導電性接著劑及電子零件之連接方法
TW106139162A TWI655267B (zh) 2011-12-15 2012-12-14 Conductive adhesive and connection method of electronic parts

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106139162A TWI655267B (zh) 2011-12-15 2012-12-14 Conductive adhesive and connection method of electronic parts

Country Status (8)

Country Link
US (1) US9752058B2 (https=)
EP (1) EP2792722B1 (https=)
JP (1) JP6231257B2 (https=)
KR (1) KR102005129B1 (https=)
CN (1) CN103987801B (https=)
IN (1) IN2014MN01199A (https=)
TW (2) TW201335330A (https=)
WO (1) WO2013089061A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659079B (zh) * 2014-02-03 2019-05-11 日商迪睿合股份有限公司 Method for measuring reaction rate of acrylic adhesive and acrylic adhesive
TWI690945B (zh) * 2015-03-24 2020-04-11 日商迪睿合股份有限公司 各向異性導電薄膜、連接方法、及其接合體

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016035044A (ja) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 導電性接着剤および電子部品
JP6280017B2 (ja) * 2014-10-03 2018-02-14 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
WO2018003704A1 (ja) * 2016-06-27 2018-01-04 株式会社スリーボンド 熱硬化型導電性接着剤
JP7148799B2 (ja) * 2016-09-02 2022-10-06 株式会社スリーボンド （メタ）アクリル樹脂組成物およびそれを用いた導電性接着剤
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
WO2022102672A1 (ja) * 2020-11-12 2022-05-19 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム及びその製造方法、並びに、接続構造体及びその製造方法
WO2024111481A1 (ja) * 2022-11-24 2024-05-30 デクセリアルズ株式会社 異方性導電膜、電子部品の製造方法、及びカード積層体
KR20250115908A (ko) 2022-11-30 2025-07-31 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, rfid 인레이 및 rfid 인레이의 제조 방법
CN120826747A (zh) 2023-08-25 2025-10-21 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法
WO2025047575A1 (ja) 2023-08-25 2025-03-06 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563355A (ja) 1991-08-30 1993-03-12 Hitachi Ltd 電子部品の実装組立方法
JP5137347B2 (ja) * 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 熱硬化性コーティング組成物
JP5329028B2 (ja) * 2006-09-15 2013-10-30 パナソニック株式会社 電子部品実装構造体の製造方法
JP4872949B2 (ja) * 2007-10-12 2012-02-08 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
KR20110036733A (ko) * 2008-07-11 2011-04-08 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP5440478B2 (ja) 2010-11-12 2014-03-12 住友電気工業株式会社 異方導電性接着剤、電極の接続構造及び電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659079B (zh) * 2014-02-03 2019-05-11 日商迪睿合股份有限公司 Method for measuring reaction rate of acrylic adhesive and acrylic adhesive
TWI690945B (zh) * 2015-03-24 2020-04-11 日商迪睿合股份有限公司 各向異性導電薄膜、連接方法、及其接合體

Also Published As

Publication number Publication date
US9752058B2 (en) 2017-09-05
EP2792722A4 (en) 2015-07-29
WO2013089061A1 (ja) 2013-06-20
JP2013124330A (ja) 2013-06-24
CN103987801A (zh) 2014-08-13
JP6231257B2 (ja) 2017-11-15
EP2792722B1 (en) 2022-04-06
KR102005129B1 (ko) 2019-07-29
IN2014MN01199A (https=) 2015-07-03
KR20140112017A (ko) 2014-09-22
CN103987801B (zh) 2016-08-24
TWI655267B (zh) 2019-04-01
US20140318709A1 (en) 2014-10-30
TW201809189A (zh) 2018-03-16
EP2792722A1 (en) 2014-10-22

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