CN103987801B - 导电性粘接剂及电子零件的连接方法 - Google Patents

导电性粘接剂及电子零件的连接方法 Download PDF

Info

Publication number
CN103987801B
CN103987801B CN201280061643.6A CN201280061643A CN103987801B CN 103987801 B CN103987801 B CN 103987801B CN 201280061643 A CN201280061643 A CN 201280061643A CN 103987801 B CN103987801 B CN 103987801B
Authority
CN
China
Prior art keywords
temperature
flux
organic peroxide
minute half
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280061643.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN103987801A (zh
Inventor
佐藤大祐
小高良介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN103987801A publication Critical patent/CN103987801A/zh
Application granted granted Critical
Publication of CN103987801B publication Critical patent/CN103987801B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN201280061643.6A 2011-12-15 2012-12-10 导电性粘接剂及电子零件的连接方法 Active CN103987801B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-274841 2011-12-15
JP2011274841A JP6231257B2 (ja) 2011-12-15 2011-12-15 導電性接着剤、及び電子部品の接続方法
PCT/JP2012/081931 WO2013089061A1 (ja) 2011-12-15 2012-12-10 導電性接着剤、及び電子部品の接続方法

Publications (2)

Publication Number Publication Date
CN103987801A CN103987801A (zh) 2014-08-13
CN103987801B true CN103987801B (zh) 2016-08-24

Family

ID=48612508

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280061643.6A Active CN103987801B (zh) 2011-12-15 2012-12-10 导电性粘接剂及电子零件的连接方法

Country Status (8)

Country Link
US (1) US9752058B2 (https=)
EP (1) EP2792722B1 (https=)
JP (1) JP6231257B2 (https=)
KR (1) KR102005129B1 (https=)
CN (1) CN103987801B (https=)
IN (1) IN2014MN01199A (https=)
TW (2) TWI655267B (https=)
WO (1) WO2013089061A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231394B2 (ja) * 2014-02-03 2017-11-15 デクセリアルズ株式会社 アクリル系接着剤の反応率測定方法、及びアクリル系接着剤
JP2016035044A (ja) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 導電性接着剤および電子部品
JP6280017B2 (ja) * 2014-10-03 2018-02-14 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR102307810B1 (ko) * 2016-06-27 2021-09-30 가부시끼가이샤 쓰리본드 열경화형 도전성 접착제
US11505692B2 (en) 2016-09-02 2022-11-22 Threebond Co., Ltd. (Meth) acrylic resin composition and electroconductive adhesive using the same
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
KR20230107273A (ko) * 2020-11-12 2023-07-14 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그 제조 방법, 및 접속 구조체 및 그 제조 방법
CN119895668A (zh) * 2022-11-24 2025-04-25 迪睿合株式会社 各向异性导电膜、电子元件的制造方法以及卡片层叠体
CN119678228A (zh) 2022-11-30 2025-03-21 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法
CN120836064A (zh) 2023-08-25 2025-10-24 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法
CN120826747A (zh) 2023-08-25 2025-10-21 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101361412A (zh) * 2006-09-15 2009-02-04 松下电器产业株式会社 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563355A (ja) 1991-08-30 1993-03-12 Hitachi Ltd 電子部品の実装組立方法
JP5137347B2 (ja) * 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 熱硬化性コーティング組成物
JP4872949B2 (ja) * 2007-10-12 2012-02-08 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
CN102090154B (zh) 2008-07-11 2014-11-05 迪睿合电子材料有限公司 各向异性导电薄膜
JP5440478B2 (ja) 2010-11-12 2014-03-12 住友電気工業株式会社 異方導電性接着剤、電極の接続構造及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101361412A (zh) * 2006-09-15 2009-02-04 松下电器产业株式会社 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Also Published As

Publication number Publication date
JP6231257B2 (ja) 2017-11-15
KR20140112017A (ko) 2014-09-22
IN2014MN01199A (https=) 2015-07-03
EP2792722A4 (en) 2015-07-29
US20140318709A1 (en) 2014-10-30
TW201335330A (zh) 2013-09-01
TW201809189A (zh) 2018-03-16
WO2013089061A1 (ja) 2013-06-20
TWI655267B (zh) 2019-04-01
EP2792722A1 (en) 2014-10-22
EP2792722B1 (en) 2022-04-06
JP2013124330A (ja) 2013-06-24
KR102005129B1 (ko) 2019-07-29
US9752058B2 (en) 2017-09-05
CN103987801A (zh) 2014-08-13

Similar Documents

Publication Publication Date Title
CN103987801B (zh) 导电性粘接剂及电子零件的连接方法
US20120292082A1 (en) Anisotropic conductive film
KR101098205B1 (ko) 이방성 도전 필름
CN107112658A (zh) 各向异性导电膜和连接方法
JP2013125858A (ja) 接続方法、接続構造体、異方性導電フィルム及びその製造方法
JP7006029B2 (ja) 回路接続用接着剤組成物及び構造体
JP6133069B2 (ja) 加熱硬化型接着フィルム
JP2011202173A (ja) 異方性導電フィルム及びその製造方法
JP6307294B2 (ja) 回路接続材料、及び電子部品の製造方法
JP6231256B2 (ja) 異方性導電接着剤、及び電子部品の接続方法
JP6307308B2 (ja) 接続構造体の製造方法、及び回路接続材料
HK1135803B (en) Anisotropic electroconductive film
HK1175036A (en) Anisotropic conductive film
HK1154332B (en) Anisotropic conductive film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant