TWI655267B - Conductive adhesive and connection method of electronic parts - Google Patents

Conductive adhesive and connection method of electronic parts Download PDF

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Publication number
TWI655267B
TWI655267B TW106139162A TW106139162A TWI655267B TW I655267 B TWI655267 B TW I655267B TW 106139162 A TW106139162 A TW 106139162A TW 106139162 A TW106139162 A TW 106139162A TW I655267 B TWI655267 B TW I655267B
Authority
TW
Taiwan
Prior art keywords
electronic component
solder particles
temperature
organic peroxide
minute half
Prior art date
Application number
TW106139162A
Other languages
English (en)
Chinese (zh)
Other versions
TW201809189A (zh
Inventor
佐藤大祐
小高良介
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201809189A publication Critical patent/TW201809189A/zh
Application granted granted Critical
Publication of TWI655267B publication Critical patent/TWI655267B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW106139162A 2011-12-15 2012-12-14 Conductive adhesive and connection method of electronic parts TWI655267B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2011-274841 2011-12-15
JP2011274841A JP6231257B2 (ja) 2011-12-15 2011-12-15 導電性接着剤、及び電子部品の接続方法

Publications (2)

Publication Number Publication Date
TW201809189A TW201809189A (zh) 2018-03-16
TWI655267B true TWI655267B (zh) 2019-04-01

Family

ID=48612508

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106139162A TWI655267B (zh) 2011-12-15 2012-12-14 Conductive adhesive and connection method of electronic parts
TW101147305A TW201335330A (zh) 2011-12-15 2012-12-14 導電性接著劑及電子零件之連接方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101147305A TW201335330A (zh) 2011-12-15 2012-12-14 導電性接著劑及電子零件之連接方法

Country Status (8)

Country Link
US (1) US9752058B2 (https=)
EP (1) EP2792722B1 (https=)
JP (1) JP6231257B2 (https=)
KR (1) KR102005129B1 (https=)
CN (1) CN103987801B (https=)
IN (1) IN2014MN01199A (https=)
TW (2) TWI655267B (https=)
WO (1) WO2013089061A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231394B2 (ja) * 2014-02-03 2017-11-15 デクセリアルズ株式会社 アクリル系接着剤の反応率測定方法、及びアクリル系接着剤
JP2016035044A (ja) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 導電性接着剤および電子部品
JP6280017B2 (ja) * 2014-10-03 2018-02-14 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR102307810B1 (ko) * 2016-06-27 2021-09-30 가부시끼가이샤 쓰리본드 열경화형 도전성 접착제
US11505692B2 (en) 2016-09-02 2022-11-22 Threebond Co., Ltd. (Meth) acrylic resin composition and electroconductive adhesive using the same
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
KR20230107273A (ko) * 2020-11-12 2023-07-14 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그 제조 방법, 및 접속 구조체 및 그 제조 방법
CN119895668A (zh) * 2022-11-24 2025-04-25 迪睿合株式会社 各向异性导电膜、电子元件的制造方法以及卡片层叠体
CN119678228A (zh) 2022-11-30 2025-03-21 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法
CN120836064A (zh) 2023-08-25 2025-10-24 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法
CN120826747A (zh) 2023-08-25 2025-10-21 积水化学工业株式会社 导电糊、rfid嵌体和rfid嵌体的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101822130A (zh) * 2007-10-12 2010-09-01 日立化成工业株式会社 电路连接材料和使用其的电路部件的连接结构
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563355A (ja) 1991-08-30 1993-03-12 Hitachi Ltd 電子部品の実装組立方法
JP5137347B2 (ja) * 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 熱硬化性コーティング組成物
JP5329028B2 (ja) * 2006-09-15 2013-10-30 パナソニック株式会社 電子部品実装構造体の製造方法
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
CN102090154B (zh) 2008-07-11 2014-11-05 迪睿合电子材料有限公司 各向异性导电薄膜
JP5440478B2 (ja) 2010-11-12 2014-03-12 住友電気工業株式会社 異方導電性接着剤、電極の接続構造及び電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101822130A (zh) * 2007-10-12 2010-09-01 日立化成工业株式会社 电路连接材料和使用其的电路部件的连接结构
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Also Published As

Publication number Publication date
JP6231257B2 (ja) 2017-11-15
KR20140112017A (ko) 2014-09-22
IN2014MN01199A (https=) 2015-07-03
EP2792722A4 (en) 2015-07-29
US20140318709A1 (en) 2014-10-30
TW201335330A (zh) 2013-09-01
TW201809189A (zh) 2018-03-16
WO2013089061A1 (ja) 2013-06-20
CN103987801B (zh) 2016-08-24
EP2792722A1 (en) 2014-10-22
EP2792722B1 (en) 2022-04-06
JP2013124330A (ja) 2013-06-24
KR102005129B1 (ko) 2019-07-29
US9752058B2 (en) 2017-09-05
CN103987801A (zh) 2014-08-13

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