IN2014MN01199A - - Google Patents

Info

Publication number
IN2014MN01199A
IN2014MN01199A IN1199MUN2014A IN2014MN01199A IN 2014MN01199 A IN2014MN01199 A IN 2014MN01199A IN 1199MUN2014 A IN1199MUN2014 A IN 1199MUN2014A IN 2014MN01199 A IN2014MN01199 A IN 2014MN01199A
Authority
IN
India
Prior art keywords
solder particles
adhesive agent
electrically conductive
organic
conductive adhesive
Prior art date
Application number
Inventor
Daisuke Sato
Ryosuke Odaka
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of IN2014MN01199A publication Critical patent/IN2014MN01199A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Provided are: an electrically conductive adhesive agent which can achieve good conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An electrically conductive adhesive agent is used which comprises a polymerizable acrylic compound an organic peroxide and solder particles wherein the one minute half life temperature of the organic peroxide is lower than the solidus line temperature of the solder particles. An oxide film is removed when the solder particles are crushed upon thermal compression bonding an organic solderability preservative layer on the surface of a bump is removed upon the melting/fluidizing of the solder particles and the adhesive agent component is hardened completely after the securement of the distribution of an electric power.
IN1199MUN2014 2011-12-15 2012-12-10 IN2014MN01199A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011274841A JP6231257B2 (en) 2011-12-15 2011-12-15 Conductive adhesive and electronic component connecting method
PCT/JP2012/081931 WO2013089061A1 (en) 2011-12-15 2012-12-10 Electrically conductive adhesive agent, and method for connecting electronic component

Publications (1)

Publication Number Publication Date
IN2014MN01199A true IN2014MN01199A (en) 2015-07-03

Family

ID=48612508

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1199MUN2014 IN2014MN01199A (en) 2011-12-15 2012-12-10

Country Status (8)

Country Link
US (1) US9752058B2 (en)
EP (1) EP2792722B1 (en)
JP (1) JP6231257B2 (en)
KR (1) KR102005129B1 (en)
CN (1) CN103987801B (en)
IN (1) IN2014MN01199A (en)
TW (2) TW201335330A (en)
WO (1) WO2013089061A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231394B2 (en) * 2014-02-03 2017-11-15 デクセリアルズ株式会社 Method for measuring reaction rate of acrylic adhesive and acrylic adhesive
JP2016035044A (en) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 Conductive adhesive and electronic component
JP6280017B2 (en) * 2014-10-03 2018-02-14 デクセリアルズ株式会社 Anisotropic conductive film, connection method and joined body
JP6510846B2 (en) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
KR102307810B1 (en) * 2016-06-27 2021-09-30 가부시끼가이샤 쓰리본드 Thermosetting conductive adhesive
KR102461272B1 (en) 2016-09-02 2022-10-31 가부시끼가이샤 쓰리본드 (meth)acrylic resin composition and conductive adhesive using same
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
JPWO2022102672A1 (en) * 2020-11-12 2022-05-19
EP4625706A1 (en) * 2022-11-24 2025-10-01 Dexerials Corporation Anisotropic conductive film, electronic component manufacturing method, and card laminated body
CN119678228A (en) 2022-11-30 2025-03-21 积水化学工业株式会社 Conductive paste, RFID inlay, and method for manufacturing RFID inlay
CN120826747A (en) 2023-08-25 2025-10-21 积水化学工业株式会社 Conductive paste, RFID inlay, and method for manufacturing RFID inlay
WO2025047575A1 (en) 2023-08-25 2025-03-06 積水化学工業株式会社 Electroconductive paste, rfid inlay, and method for producing rfid inlay

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563355A (en) 1991-08-30 1993-03-12 Hitachi Ltd Electronic component mounting and assembly method
JP5137347B2 (en) 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 Thermosetting coating composition
JP5329028B2 (en) * 2006-09-15 2013-10-30 パナソニック株式会社 Manufacturing method of electronic component mounting structure
JP4872949B2 (en) 2007-10-12 2012-02-08 日立化成工業株式会社 Circuit connection material and circuit member connection structure using the same
JP2009277769A (en) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd Circuits connecting material and connection structure of circuit member using the same
CN102090154B (en) * 2008-07-11 2014-11-05 迪睿合电子材料有限公司 Anisotropic conductive film
JP5540916B2 (en) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 Method for manufacturing connection structure
JP5440478B2 (en) 2010-11-12 2014-03-12 住友電気工業株式会社 Anisotropic conductive adhesive, electrode connection structure and electronic equipment

Also Published As

Publication number Publication date
TWI655267B (en) 2019-04-01
US20140318709A1 (en) 2014-10-30
CN103987801A (en) 2014-08-13
KR20140112017A (en) 2014-09-22
EP2792722B1 (en) 2022-04-06
CN103987801B (en) 2016-08-24
JP6231257B2 (en) 2017-11-15
EP2792722A1 (en) 2014-10-22
KR102005129B1 (en) 2019-07-29
TW201809189A (en) 2018-03-16
TW201335330A (en) 2013-09-01
JP2013124330A (en) 2013-06-24
US9752058B2 (en) 2017-09-05
WO2013089061A1 (en) 2013-06-20
EP2792722A4 (en) 2015-07-29

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