IN2014DN08073A - - Google Patents

Info

Publication number
IN2014DN08073A
IN2014DN08073A IN8073DEN2014A IN2014DN08073A IN 2014DN08073 A IN2014DN08073 A IN 2014DN08073A IN 8073DEN2014 A IN8073DEN2014 A IN 8073DEN2014A IN 2014DN08073 A IN2014DN08073 A IN 2014DN08073A
Authority
IN
India
Prior art keywords
layer
aluminum
aluminum layer
copper
laminated
Prior art date
Application number
Inventor
Nobuyuki Terasaki
Yoshiyuki Nagatomo
Yoshirou Kuromitsu
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DN08073A publication Critical patent/IN2014DN08073A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

In this substrate for a power module a circuit layer (12) includes an aluminum layer (12A) arranged on one face of an insulating layer (11) and a copper layer (12B) laminated to one side of the aluminum layer (12A) the aluminum layer (12A) and the copper layer (12B) being bonded by solid phase diffusion.
IN8073DEN2014 2012-03-30 2013-03-29 IN2014DN08073A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012083249 2012-03-30
JP2012203362A JP5403129B2 (en) 2012-03-30 2012-09-14 Power module substrate, power module substrate with heat sink, power module, and method for manufacturing power module substrate
PCT/JP2013/059500 WO2013147144A1 (en) 2012-03-30 2013-03-29 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module

Publications (1)

Publication Number Publication Date
IN2014DN08073A true IN2014DN08073A (en) 2015-05-01

Family

ID=49260386

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8073DEN2014 IN2014DN08073A (en) 2012-03-30 2013-03-29

Country Status (7)

Country Link
US (1) US9723707B2 (en)
EP (1) EP2833398B1 (en)
JP (1) JP5403129B2 (en)
KR (1) KR101971756B1 (en)
CN (1) CN104205323B (en)
IN (1) IN2014DN08073A (en)
WO (1) WO2013147144A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102051697B1 (en) * 2012-09-21 2019-12-03 미쓰비시 마테리알 가부시키가이샤 Bonding structure for aluminum member and copper member
IN2015DN03283A (en) 2012-10-16 2015-10-09 Mitsubishi Materials Corp
JP6307832B2 (en) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 Power module board, power module board with heat sink, power module with heat sink
JP6413230B2 (en) * 2013-11-14 2018-10-31 三菱マテリアル株式会社 Resistor and manufacturing method of resistor
JP6413229B2 (en) * 2013-11-14 2018-10-31 三菱マテリアル株式会社 Resistor and manufacturing method of resistor
US9969654B2 (en) 2014-01-24 2018-05-15 United Technologies Corporation Method of bonding a metallic component to a non-metallic component using a compliant material
JP6269116B2 (en) * 2014-02-05 2018-01-31 三菱マテリアル株式会社 Metal member with underlayer, insulated circuit board, semiconductor device, insulated circuit board with heat sink, and method for producing metal member with underlayer
JP6192561B2 (en) * 2014-02-17 2017-09-06 三菱電機株式会社 Power semiconductor device
JP6384112B2 (en) 2014-04-25 2018-09-05 三菱マテリアル株式会社 Power module substrate and power module substrate with heat sink
JP6550971B2 (en) * 2014-07-02 2019-07-31 三菱マテリアル株式会社 Manufacturing method of joined body, manufacturing method of multilayer joined body, manufacturing method of power module substrate, and manufacturing method of power module substrate with heat sink
WO2016002804A1 (en) * 2014-07-02 2016-01-07 三菱マテリアル株式会社 Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
JP6488917B2 (en) * 2014-07-04 2019-03-27 三菱マテリアル株式会社 Power module substrate with heat sink and power module
JP6396703B2 (en) * 2014-07-08 2018-09-26 トヨタ自動車株式会社 Manufacturing method of heat dissipation component for semiconductor element
JP6670240B2 (en) * 2014-07-29 2020-03-18 デンカ株式会社 Ceramic circuit board and method of manufacturing the same
JP6435711B2 (en) * 2014-08-21 2018-12-12 三菱マテリアル株式会社 Power module substrate with heat sink and power module
JP6432466B2 (en) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 Bonded body, power module substrate with heat sink, heat sink, method for manufacturing bonded body, method for manufacturing power module substrate with heat sink, and method for manufacturing heat sink
JP6432465B2 (en) 2014-08-26 2018-12-05 三菱マテリアル株式会社 Bonded body, power module substrate with heat sink, heat sink, method for manufacturing bonded body, method for manufacturing power module substrate with heat sink, and method for manufacturing heat sink
JP6428327B2 (en) * 2015-02-04 2018-11-28 三菱マテリアル株式会社 Power module substrate with heat sink, power module, and method for manufacturing power module substrate with heat sink
JP6575386B2 (en) * 2015-03-11 2019-09-18 三菱マテリアル株式会社 Manufacturing method of joined body, manufacturing method of power module substrate with heat sink, and manufacturing method of heat sink
WO2016143631A1 (en) * 2015-03-11 2016-09-15 三菱マテリアル株式会社 Manufacturing method for junction, manufacturing method for substrate for power module with heat sink, and manufacturing method for heat sink
JP6696215B2 (en) * 2015-04-16 2020-05-20 三菱マテリアル株式会社 Bonded body, power module substrate with heat sink, heat sink, and method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
DE102015111667B4 (en) * 2015-07-17 2025-11-06 Rogers Germany Gmbh Substrate for electrical circuits and methods for producing such a substrate
JP6638282B2 (en) * 2015-09-25 2020-01-29 三菱マテリアル株式会社 Light emitting module with cooler and method of manufacturing light emitting module with cooler
JP2017063127A (en) * 2015-09-25 2017-03-30 三菱マテリアル株式会社 Light emitting module substrate, light emitting module, light emitting module substrate with cooler, and method for manufacturing light emitting module substrate
CN108346637B (en) * 2017-01-24 2019-10-08 比亚迪股份有限公司 A kind of power module and its manufacturing method
JP6776953B2 (en) * 2017-03-07 2020-10-28 三菱マテリアル株式会社 Board for power module with heat sink
JP6717245B2 (en) 2017-03-17 2020-07-01 三菱マテリアル株式会社 Method for manufacturing joined body, method for manufacturing insulated circuit board, and method for manufacturing insulated circuit board with heat sink
DE102017217537B4 (en) 2017-10-02 2021-10-21 Danfoss Silicon Power Gmbh Power module with integrated cooling device
JP7039933B2 (en) * 2017-11-06 2022-03-23 三菱マテリアル株式会社 Bond, Insulated Circuit Board, Insulated Circuit Board with Heat Sink, Heat Sink, and Joined Body Manufacturing Method, Insulated Circuit Board Manufacturing Method, Heat Sinked Insulated Circuit Board Manufacturing Method, Heat Sink Manufacturing Method
JP6601512B2 (en) 2018-01-24 2019-11-06 三菱マテリアル株式会社 Power module substrate with heat sink and power module
CN111819682B (en) * 2018-03-26 2025-04-29 三菱综合材料株式会社 Method for manufacturing joint body for insulating circuit substrate and joint body for insulating circuit substrate
JP7167642B2 (en) * 2018-11-08 2022-11-09 三菱マテリアル株式会社 Joined body, insulated circuit board with heat sink, and heat sink
JP7342371B2 (en) * 2019-02-14 2023-09-12 三菱マテリアル株式会社 Insulated circuit board and method for manufacturing an insulated circuit board
CN110216939B (en) * 2019-04-25 2022-02-15 吉林省中赢高科技有限公司 Copper-aluminum composite base material and pressure diffusion welding processing method and application thereof
KR20220119359A (en) * 2020-01-09 2022-08-29 후루카와 덴키 고교 가부시키가이샤 metal bonding material
JP7608891B2 (en) * 2021-03-12 2025-01-07 三菱マテリアル株式会社 Heat sink integrated insulating circuit board
DE112022002382T5 (en) * 2021-04-25 2024-02-15 Danfoss Silicon Power Gmbh Electronic device with improved cooling
WO2023100917A1 (en) 2021-11-30 2023-06-08 三菱マテリアル株式会社 Metal paste for joining, and method for manufacturing joined body and method for manufacturing insulated circuit board
WO2023100939A1 (en) 2021-11-30 2023-06-08 三菱マテリアル株式会社 Temporary fastening material, and manufacturing method for joined body
US20250029844A1 (en) * 2023-07-19 2025-01-23 Semiconductor Components Industries, Llc Copper features and related methods of forming
CN119526841A (en) * 2023-08-28 2025-02-28 超能高新材料股份有限公司 Composite structure with heat dissipation material on one side of the ceramic substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952938A (en) * 1973-12-10 1976-04-27 Clad Metals, Inc. Method of making multiple member composite metal products
US4427716A (en) * 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
JP3211856B2 (en) 1994-11-02 2001-09-25 電気化学工業株式会社 Circuit board
JPH08255973A (en) * 1995-03-17 1996-10-01 Toshiba Corp Ceramics circuit board
JP3171234B2 (en) 1997-03-26 2001-05-28 三菱マテリアル株式会社 Ceramic circuit board with heat sink
JP3012835B2 (en) 1997-11-07 2000-02-28 電気化学工業株式会社 Substrate and its manufacturing method, metal joined body suitable for substrate
JP2003078086A (en) * 2001-09-04 2003-03-14 Kubota Corp Stacked structure of semiconductor element module substrate
JP4055596B2 (en) * 2003-02-05 2008-03-05 日本発条株式会社 Composite
AU2003257838A1 (en) * 2003-08-07 2005-02-25 Sumitomo Precision Products Co., Ltd. Al-Cu JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
JP2010034238A (en) 2008-07-28 2010-02-12 Shin Kobe Electric Mach Co Ltd Wiring board
IN2012DN02727A (en) * 2009-09-09 2015-09-11 Mitsubishi Materials Corp
DK2662179T3 (en) * 2009-10-26 2014-10-13 Neomax Materials Co Ltd Aluminum bonding alloy of a nickel-magnesium alloy
CN102947043B (en) * 2010-06-08 2014-04-23 株式会社新王材料 Aluminum copper clad material and manufacture method thereof
JP5884291B2 (en) * 2011-04-20 2016-03-15 三菱マテリアル株式会社 Power module board unit with heat sink

Also Published As

Publication number Publication date
CN104205323B (en) 2018-04-06
JP2013229545A (en) 2013-11-07
KR101971756B1 (en) 2019-04-23
EP2833398A1 (en) 2015-02-04
US9723707B2 (en) 2017-08-01
WO2013147144A1 (en) 2013-10-03
US20150041188A1 (en) 2015-02-12
EP2833398A4 (en) 2016-01-20
KR20140142235A (en) 2014-12-11
CN104205323A (en) 2014-12-10
JP5403129B2 (en) 2014-01-29
EP2833398B1 (en) 2018-06-20

Similar Documents

Publication Publication Date Title
TW201613037A (en) Substrate for power modules, substrate with heat sink for power modules and power module with heat sink
TW201613066A (en) Package-on-package options with multiple layer 3-D stacking
WO2012087475A3 (en) Substrate with embedded stacked through-silicon via die
EP3986094A3 (en) Assembly structure and electronic device having the same
IN2015DN02361A (en)
GB2496564A (en) Interlayer for electronic devices
EP2485254A4 (en) Insulation circuit board, and power semiconductor device or inverter module using the same
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
WO2015009957A3 (en) Circuit assembly and corresponding methods
MY175032A (en) Photovoltaic cell and laminate metallization
EP2819134A3 (en) Laminated chip electronic component, board for mounting the same, and packing unit thereof
WO2013032670A3 (en) Laminated flex circuit layers for electronic device components
WO2013052672A3 (en) Power management applications of interconnect substrates
PH12016501804B1 (en) Bonds for solar cell metallization
WO2010038179A3 (en) An oled device and an electronic circuit
EP3106447A4 (en) Copper/ceramic bond and power module substrate
EA201391645A1 (en) SYSTEM AND METHOD OF COOLING POWER ELECTRONIC DEVICES
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
EP2753159A4 (en) LAMINATED FRITTED CERAMIC WIRING SUBSTRATE, AND SEMICONDUCTOR HOUSING CONTAINING THE WIRING SUBSTRATE
GB2482039B (en) Electronic device
MX2013009396A (en) Method of locating smt connector with smt cap feature.
WO2012169750A3 (en) Lighting apparatus for broadcasting
TW201432230A (en) Polarized light detection system
WO2014052162A3 (en) Transparent multi-layer structure with transparent electrical routing
WO2012163461A3 (en) Connector for devices with identical connections and converter arrangement