IN2015DN02361A - - Google Patents

Info

Publication number
IN2015DN02361A
IN2015DN02361A IN2361DEN2015A IN2015DN02361A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A IN 2361DEN2015 A IN2361DEN2015 A IN 2361DEN2015A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A
Authority
IN
India
Prior art keywords
copper
aluminum
bonding
intermetallic
interface
Prior art date
Application number
Inventor
Nobuyuki Terasaki
Yosliiyuki NAGATOMO
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012208578 priority Critical
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to PCT/JP2013/075158 priority patent/WO2014046130A1/en
Publication of IN2015DN02361A publication Critical patent/IN2015DN02361A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266O, S, or organic compound in metal component
    • Y10T428/12667Oxide of transition metal or Al

Abstract

The present invention pertains to a bonding structure for an aluminum member and a copper member , wherein: an aluminum member (11) comprising aluminum or an aluminum alloy and a copper member (12) comprising copper or a copper alloy are bonded to one another via solid phase diffusion bonding; an intermetallic -compound layer (21) comprising Cu and Al is formed at the bonding interface between the aluminum member (11) and the copper member (12); and an oxide (27) is dispersed in a layer shape along the interface between the copper member (12) and the intermetallic- compound layer (21).
IN2361DEN2015 2012-09-21 2013-09-18 IN2015DN02361A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012208578 2012-09-21
PCT/JP2013/075158 WO2014046130A1 (en) 2012-09-21 2013-09-18 Bonding structure for aluminum member and copper member

Publications (1)

Publication Number Publication Date
IN2015DN02361A true IN2015DN02361A (en) 2015-09-04

Family

ID=50341440

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2361DEN2015 IN2015DN02361A (en) 2012-09-21 2013-09-18

Country Status (8)

Country Link
US (1) US10011093B2 (en)
EP (1) EP2898979B1 (en)
JP (1) JP5549958B2 (en)
KR (1) KR102051697B1 (en)
CN (1) CN104661785B (en)
IN (1) IN2015DN02361A (en)
TW (1) TWI589382B (en)
WO (1) WO2014046130A1 (en)

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JP5549958B2 (en) * 2012-09-21 2014-07-16 三菱マテリアル株式会社 Joining structure of aluminum member and copper member
WO2014061588A1 (en) 2012-10-16 2014-04-24 三菱マテリアル株式会社 Substrate for power module with heat sink, power module with heat sink, and method for producing substrate for power module with heat sink
JP6428327B2 (en) * 2015-02-04 2018-11-28 三菱マテリアル株式会社 Power module substrate with heat sink, power module, and method for manufacturing power module substrate with heat sink
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US10050139B2 (en) 2016-06-24 2018-08-14 Infineon Technologies Ag Semiconductor device including a LDMOS transistor and method
US10622284B2 (en) 2016-06-24 2020-04-14 Infineon Technologies Ag LDMOS transistor and method
US9875933B2 (en) 2016-06-24 2018-01-23 Infineon Technologies Ag Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures
US10242932B2 (en) 2016-06-24 2019-03-26 Infineon Technologies Ag LDMOS transistor and method
US9960229B2 (en) 2016-06-24 2018-05-01 Infineon Technologies Ag Semiconductor device including a LDMOS transistor
CN106475679B (en) * 2016-11-30 2018-07-27 山东大学 A kind of discontinuous pressure process diffusion connecting process of unrepeatered transmission of copper and aluminium alloy
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Also Published As

Publication number Publication date
JP2014076486A (en) 2014-05-01
CN104661785B (en) 2017-05-03
JP5549958B2 (en) 2014-07-16
WO2014046130A1 (en) 2014-03-27
EP2898979B1 (en) 2019-03-06
KR20150056534A (en) 2015-05-26
US10011093B2 (en) 2018-07-03
EP2898979A4 (en) 2016-06-08
US20150251382A1 (en) 2015-09-10
EP2898979A1 (en) 2015-07-29
CN104661785A (en) 2015-05-27
KR102051697B1 (en) 2019-12-03
TW201433392A (en) 2014-09-01
TWI589382B (en) 2017-07-01

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