IN2014DN08074A - - Google Patents

Info

Publication number
IN2014DN08074A
IN2014DN08074A IN8074DEN2014A IN2014DN08074A IN 2014DN08074 A IN2014DN08074 A IN 2014DN08074A IN 8074DEN2014 A IN8074DEN2014 A IN 8074DEN2014A IN 2014DN08074 A IN2014DN08074 A IN 2014DN08074A
Authority
IN
India
Prior art keywords
power module
module substrate
joining
heat sink
aluminum
Prior art date
Application number
Inventor
Yoshiyuki Nagatomo
Hiroya Ishizuka
Toshiyuki Nagase
Yoshirou Kuromitsu
Masakazu Edo
Hideyuki Miyake
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DN08074A publication Critical patent/IN2014DN08074A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H10W40/255—
    • H10W40/47—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/128—The active component for bonding being silicon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • H10W40/611—
    • H10W72/352—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

This power module substrate with a heat sink is provided with a power module substrate having a circuit layer disposed on one surface of an insulating layer and a heat sink joined to the other surface of the power module substrate. The joining surface of the heat sink and the joining surface of the power module substrate are each composed of aluminum or an aluminum alloy. A joining layer (50) obtained by dispersing a magnesium containing compound (52) (excluding magnesium oxide) containing magnesium in an aluminum silicon eutectic structure is formed on the joining surfaces of the heat sink and the power module substrate and the thickness (t) of the joining layer (50) is set within a range of 5 µm to 80 µm.
IN8074DEN2014 2012-03-30 2013-03-29 IN2014DN08074A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012083247A JP5548722B2 (en) 2012-03-30 2012-03-30 Power module substrate with heat sink, and method for manufacturing power module substrate with heat sink
PCT/JP2013/059464 WO2013147121A1 (en) 2012-03-30 2013-03-29 Power module substrate with heat sink, and method for producing power module substrate with heat sink

Publications (1)

Publication Number Publication Date
IN2014DN08074A true IN2014DN08074A (en) 2015-05-01

Family

ID=49260363

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8074DEN2014 IN2014DN08074A (en) 2012-03-30 2013-03-29

Country Status (8)

Country Link
US (1) US9237682B2 (en)
EP (1) EP2833400B1 (en)
JP (1) JP5548722B2 (en)
KR (1) KR101548474B1 (en)
CN (1) CN104205324B (en)
IN (1) IN2014DN08074A (en)
TW (1) TWI493661B (en)
WO (1) WO2013147121A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9414512B2 (en) * 2009-10-22 2016-08-09 Mitsubishi Materials Corporation Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
JP5542765B2 (en) * 2011-09-26 2014-07-09 日立オートモティブシステムズ株式会社 Power module
JP5614423B2 (en) * 2012-03-29 2014-10-29 三菱マテリアル株式会社 Power module substrate and manufacturing method thereof
JP2015050257A (en) * 2013-08-30 2015-03-16 株式会社東芝 Power conversion device for vehicle and railway vehicle
CN104754913B (en) * 2013-12-27 2018-06-05 华为技术有限公司 Heat-conductive composite material piece and preparation method thereof
CN105900189B (en) * 2014-01-08 2018-06-26 三菱综合材料株式会社 The manufacturing method of resistor and resistor
WO2016060079A1 (en) * 2014-10-16 2016-04-21 三菱マテリアル株式会社 Substrate with cooler for power modules and method for producing same
US10211068B2 (en) 2014-10-16 2019-02-19 Mitsubishi Materials Corporation Power-module substrate with cooler and method of producing the same
JP6638282B2 (en) * 2015-09-25 2020-01-29 三菱マテリアル株式会社 Light emitting module with cooler and method of manufacturing light emitting module with cooler
EP3358610B1 (en) * 2015-10-02 2021-09-15 Mitsui Mining and Smelting Co., Ltd. A bonding junction structure
JP6656657B2 (en) 2015-11-06 2020-03-04 三菱マテリアル株式会社 Ceramic / aluminum joint, power module substrate, and power module
JP6822247B2 (en) * 2016-03-25 2021-01-27 三菱マテリアル株式会社 Manufacturing method of insulated circuit board with heat sink
KR101956983B1 (en) 2016-09-20 2019-03-11 현대자동차일본기술연구소 Power module and manufacturing method therefor
JP7277286B2 (en) * 2019-06-28 2023-05-18 三菱重工業株式会社 Plant inspection method
US11776870B2 (en) * 2020-01-16 2023-10-03 Semiconductor Components Industries, Llc Direct bonded copper substrates fabricated using silver sintering

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US6033787A (en) * 1996-08-22 2000-03-07 Mitsubishi Materials Corporation Ceramic circuit board with heat sink
JP3180677B2 (en) * 1996-08-22 2001-06-25 三菱マテリアル株式会社 Ceramic circuit board with heat sink
JP2002064169A (en) 2000-08-21 2002-02-28 Denki Kagaku Kogyo Kk Heat dissipation structure
WO2003028946A1 (en) * 2001-09-28 2003-04-10 Furukawa-Sky Aluminum Corp. Method for brazing of aluminum or aluminum alloy material and aluminum alloy brazing sheet
JP2006100770A (en) * 2004-09-01 2006-04-13 Toyota Industries Corp Circuit board base board manufacturing method, circuit board base board, and circuit board using the base board
US8371367B2 (en) 2005-08-11 2013-02-12 Mitsubishi Denki Kabushiki Kaisha Heat sink and fabricating method of the same
JP4759384B2 (en) * 2005-12-20 2011-08-31 昭和電工株式会社 Semiconductor module
JP5056340B2 (en) 2007-10-22 2012-10-24 トヨタ自動車株式会社 Semiconductor module cooling device
JP5067187B2 (en) 2007-11-06 2012-11-07 三菱マテリアル株式会社 Power module substrate with heat sink and power module with heat sink
JP4832419B2 (en) 2007-12-25 2011-12-07 トヨタ自動車株式会社 Semiconductor module
KR101610973B1 (en) 2008-03-17 2016-04-08 미쓰비시 마테리알 가부시키가이샤 Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module
JP5359954B2 (en) * 2009-03-31 2013-12-04 三菱マテリアル株式会社 Power module substrate with heat sink, power module, and method for manufacturing power module substrate with heat sink
JP4547032B1 (en) * 2009-04-17 2010-09-22 三菱アルミニウム株式会社 Fluxless brazing method of aluminum material and aluminum clad material for fluxless brazing
JP5724273B2 (en) 2009-10-22 2015-05-27 三菱マテリアル株式会社 Power module substrate, power module substrate with heat sink, power module, method for manufacturing power module substrate, and method for manufacturing power module substrate with heat sink
JP2012061483A (en) 2010-09-14 2012-03-29 Mitsubishi Alum Co Ltd Flux-less brazing method of aluminum material
JP6122573B2 (en) * 2011-01-14 2017-04-26 日本軽金属株式会社 Method for manufacturing liquid-cooled integrated substrate
JP5854758B2 (en) * 2011-10-24 2016-02-09 昭和電工株式会社 Electronic device mounting board

Also Published As

Publication number Publication date
WO2013147121A1 (en) 2013-10-03
CN104205324B (en) 2016-09-21
TWI493661B (en) 2015-07-21
TW201405722A (en) 2014-02-01
US9237682B2 (en) 2016-01-12
EP2833400A4 (en) 2015-10-28
CN104205324A (en) 2014-12-10
JP2013214576A (en) 2013-10-17
KR101548474B1 (en) 2015-08-28
EP2833400A1 (en) 2015-02-04
KR20140145129A (en) 2014-12-22
EP2833400B1 (en) 2016-11-23
JP5548722B2 (en) 2014-07-16
US20150055303A1 (en) 2015-02-26

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