TW201235824A - Heat dissipating module and its manufacturing method - Google Patents
Heat dissipating module and its manufacturing method Download PDFInfo
- Publication number
- TW201235824A TW201235824A TW100106354A TW100106354A TW201235824A TW 201235824 A TW201235824 A TW 201235824A TW 100106354 A TW100106354 A TW 100106354A TW 100106354 A TW100106354 A TW 100106354A TW 201235824 A TW201235824 A TW 201235824A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- groove
- dissipation module
- base
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 230000000149 penetrating effect Effects 0.000 claims abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 238000001704 evaporation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000282994 Cervidae Species 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
- B21D39/03—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding
- B21D39/038—Perpendicular plate connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
201235824 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種散熱模組及其製造方法,尤指一種 具有減少熱阻,以有效提升熱傳效率之散熱模組及其製造 方法。 【先前技術】 如今,在電腦產業中,為將發熱電子元件(如中央處理 器、南北橋晶片)產生之熱量有效散發,通常採用方法係將 被動式的散熱器緊密地貼設於發熱電子元件溢熱表面,以 協助發熱電子元件散熱,故保證發熱電子元件能夠在適當 溫度下運作。 而習知的散熱器一般分為一體式散熱器以及將散熱鰭 片組接於基座而成之嵌接式散熱器二種;其中一體式散熱 器其主要係具有一基座,該基座之一側得直接接觸發熱 源,相反之另一侧則延伸設有散熱鰭片,用以將基座吸收 之熱源向外散發;所述嵌接式散熱器請參閱第1A、1B圖, 邊散熱器1係包括一基座1〇及複數散熱鰭片12,該基座 忉具有複數凹槽1〇1,該等凹槽101係凹設形成在該基座 10的一側上,其用以供該等散熱鰭片12插設;而該基座 10的另一侧則貼設於對應的一發熱元件14(如中央處理 器、南北橋晶片)上,用以吸收發熱元件14所產生的熱量。 前述每一散熱鰭片12具有一吸熱端121及一從該吸熱 端121延伸之散熱端122,該吸熱端121係容置固定在該 凹槽101内’以與該基座10構成所述散熱模組1,所以當 201235824 發,、’、元件14產生熱量肖,該基座會吸收該發熱元件μ 其上,熱1’料至該等凹槽1()1内對應的吸熱端⑵上, 使該等吸熱端121將接收的歸傳遞給料散熱端122, 然後透過該等散熱端122將其上的熱量向外擴散散熱。 雖上述兩種習知之散熱器皆可對發熱元件14達到散 熱目的’但其散果並不彰顯,詳細說明如后··原因習知散 熱器對,發熱元件14散熱時,必需透過該基座10 _熱 量★使知發熱元件14的熱量是將由基座1〇再間接傳遞至 該等散熱鰭>} 12上’以導致熱料過程會產生熱阻現 所以俾使造祕賴傳效率不佳,姆的勢时影 體散熱效果。 θ 以上所述,習知具有下列缺點: 1·熱傳效率不佳; 2·因需透職基座傳遞歸,以導致會產生熱阻; 3.散熱效能不佳。 是以,要如何解決上述習用之問題與缺失即為本案 之發明人與從事此行業之侧廠騎亟欲研究改善之方向 所在者。 ° 【發明内容】 爱此,為有效解決上述之問題,本發明之主要目的在 提供-種具有減少触,以提升熱傳效率之散熱模組。 本發月之人要目的,係提供—種具有達到絕佳敎 效果之散熱模組。 … 本發明之次要目的,係提供—祕錢少熱阻,以提 201235824 '升熱傳效率之散熱模組製造方法。 本發明之次要目的,雜供—種具有達魏佳的散熱 效果之散熱模組製造方法。 ’、、、 為達上述目的,本發明係提供一種散熱模組,係包括: -基座具有複數賴及—底部,該等溝槽係貫穿該基座; 及一散熱鰭片組係具有複數散熱鰭片,該每一散熱鰭片具 有一散熱端及-從該散熱端延伸之吸熱端,該吸熱端係對 • 應、貫穿該溝槽且彎折貼設於該底部,以與該基座結合一體 構成所述散熱模組;所以透過本發明之該等散熱轉片之吸 熱端直接吸附熱量以將其傳遞至散熱端散熱,藉以減 少熱阻及提升祕效率’以有效達舰佳之散熱效果。 本發明另提供一種散熱模組製造方法,首先提供一具 有複數溝槽之基座及複數散熱鰭片,接著將該等散熱鰭片' 的一端對應貫穿該等溝槽,然後將該等散熱鰭片貫穿該等 騎Hf折並貼靠在該基座之底部,轉成所述散熱 模組;透過本發明此方法的設計,得有效減少熱阻及提升 整體熱傳效率,進而更有效達到絕佳之散熱效果。 【實施方式】… 本發明之上述目的及其結構與功能上的特性,將依據 所附圖式之較佳實施例予以說明。 本發明係一種散熱模組及其製造方法,請參閱第2A、 3、4圖係顯示本發明之第一較佳實施例之示意圖,該散熱 模組2係包括一基座21及一散熱鰭片組22,該基座Μ具 有複數溝槽211及-底部213,該等溝槽211係貫穿絲 201235824 座21 ’亦即該等溝槽211係貫設形成在該基座21上,且 其排列方式係為如第2A圖呈等距間隔排列設置,或如第 2B圖呈不等距間隔排列設置。 前述散熱鰭片組22具有複數散熱鰭片221,該每一散 熱鰭片221具有一散熱端223及一吸熱端224,該等散熱 鰭片221之散熱端223共同界定一散熱部226,用以將吸 收的熱1與外面空氣作熱交換散熱,該吸熱端224係對應 貫穿該溝槽211且彎折貼設於該底部213,即該等散熱鰭 片221之吸熱端224朝對應溝槽211貫穿,並突出於對應 的溝槽211外,並利用機械加工(諸如滾軋加工或沖壓加 工方式等)使前述突出在溝槽211外的吸熱端224彎折, 而緊貼靠在該基座21的底部213,以令該等散熱鰭片221 能穩固與該基座21結合成-體,進而構成所述散熱模組2。 續參閱第2A、3圖,從圖3中觀之前述突出於該溝槽 211外的吸熱端224係與散熱鰭片221呈垂直,且該等散 熱錯片221的吸熱端224共同界定一吸熱部挪,該^教 部227係貼設於一發熱元件3(如中央處理器、南北橋晶 片、顯示處理晶片或其他發熱源)上,其用以將吸收該發執 元件3所產生的熱量後’直接傳遞至其上的散熱部汹對 外擴散散熱。 因此透過本義之散_片221的鳩部撕直接將 吸附的熱量引導至其上散熱部226散熱的設計,俾使有效 減少熱阻及又可提升整體的熱傳效率,進而有效達到絕佳 夕私就抽类去。 201235824 • · · · · . · 續參閱第3、5圖示,其中第5圖係顯示本發明之第_ 較佳實施例之方塊流程示.意圖,該散熱模組之製造方法係 包括下列步驟: (200) 開始 (201) 提供一具有複數溝槽之基座及複數散熱鰭片; 係提供一具有複數溝槽211之基座21及複數散熱 鰭片221,其中該等溝槽211貫設在基座21上的排 參 列方式係為如第2A圖呈等距間隔排列設置,或如第 2B圖呈不等距間隔排列設置。 (202) 將該等散熱鰭片的一端對應貫穿該等溝槽; 將該等散熱鰭片221的一端(即為所述吸熱端224) 朝相對轉溝槽211 向貫穿’直到該等吸熱端224 凸伸出該基座21之底部213外(亦即突出於該溝槽 211 外)。 (203) 將該等散熱鰭片貫穿料賴之—端彎折並貼靠在 該基座之底部; 將該等散熱鰭片221貫穿該等溝槽211之一端彎 折,亦即以機械加工(滚軋加工或沖壓加工其中任 一方式),對前述突出於該等溝槽211外之吸熱端 224形成彎折後,而緊貼靠在該基座μ之底部213, 7忒基座21與該等散熱鰭片22i結合成一體,進而 構成所述散熱模組2。 因此’藉由本發明此方法的設計,使得散熱模組2對 #熱7〇件3進仃散熱時’可有效聽熱阻的產生,以有效 201235824 提升整體熱傳效率,飾又有效達到紐之散熱效果。 -立請參閱第6、7、8圖係顯示本發明之第二較佳實施例 不忍圖,該較佳魏例的結構及連結關係及其元件符號大 致與前述第-較佳實施相同,故在此不重新贅述,其兩者 不同處在於:前述散熱模組2更包含至少-熱管26,並前 述基座21更包含複數結合槽24及至少一凹槽25 ,其中該 等結合槽24係凹設形成在對應該溝槽211與基座21外侧 之間,其用以提供對應的吸熱端224相插設固定,以輔助 固定該等散熱鰭片22卜該凹槽25係凹設在該底部213, 且對應連通該溝槽21卜令該吸熱端224 f折貼設於對鹿 的凹槽25内。 〜 於該較佳實施前述凹槽25係以四個凹槽25匹配四隻 熱管26做說明,但並不舰於此,於具體實施時,使用者 可以事先根據絲郎及餘效果的需求,選擇設計該凹 槽25及熱管26的數量,合先陳明。 *續參閱第7圖’辅以參閱第8圖,前述熱管26具有一 蒸發端261及-冷凝端262,其中該冷凝端脱係穿設前 述散熱部226,亦即冷凝端262 一端依序穿接該等散熱端 223 ’而该蒸發端261係容設固定在對應凹槽内,且其 具第-側2611及-第二側,該第—側腿係緊 貼靠該等吸熱端224(即前述吸熱部227),該第二侧2612 則與對應的發熱元件3相貼設。 所以當發熱元件3產生熱量時,前述熱管26之蒸發端 261會將吸收到的熱量傳送至該冷凝端脱上使冷凝端 201235824 ++ ' · • .‘ .... 262將接收的熱量傳遞給穿接其上的散熱部22 散熱:同-時間該賴部227也會魏並賴該蒸發端^ 其上部分熱量,即前述吸熱部227將吸附的部分熱 地傳,到該散熱部226上,然後透過該散熱部226將其上 的熱量與外面空氣作熱交換而達到散熱效果,因此,使得 有效達到雙重吸熱的效果,且又可避免熱阻產生,進而: 效制提升紐的熱傳鱗以及紐的散熱效果。 瞻以上所述,本發明相較於習知具有下列之優點: 1. 具有提升熱傳效率; 2. 具有避免熱阻的產生; 3·具有絕佳的散熱效果。 惟以上所述者,鶴本發明之健可行之實施例而 已,舉凡利用本發明上述之方法、形狀、構造、裝置所為 之變化,皆應包含於本案之權利範圍内。 > 【圖式簡單說明】 第1A圖係習知之組合立體示意圖; 第1B圖係習知之組合剖面立體示意圖; 第2A圖係本發明之第一較佳實施例之組合立體示意圖; 第2B圖係本發明之第一較佳實施例之另一組合立體示意 圖; 第3圖係本發明之第2A圖之組合剖面示意圖; 第4圖係本發明之第一較佳實施例之分解立體示意圖; 第5圖係本發明之第一較佳實施例之流程示意圖; 201235824 第6圖係本發明之第二較佳實施例之組合立體示意圖; 第7圖係本發明之第二較佳實施例之組合局部剖面示意 圖, 第8圖係本發明之第二較佳實施例之分解立體示意圖。 【主要元件符號說明】 散熱模組 … 2 吸熱部 … 227 基座 21 結合槽 … 24 溝槽 211 凹槽 -25 底部 213 熱管 … 26 散熱鰭片組 22 蒸發端 … 261 散熱鰭片 221 第一側 …2611 散熱端 223 第二側 …2612 吸熱端 224 冷凝端 … 262 散熱部 226 發熱元件 … 3
Claims (1)
- 201235824 七、申請專利範圍: 1· 一種散熱模組,包括: -基座’係具有複麟槽及—底部,該料槽係貫穿該 基座;及 -散熱鰭片組,係具有複數散熱鰭片,該每—散熱縛片 具有-散熱端’及-吸熱端係對應貫穿該溝槽且彎折貼 設於該底部。 • 2.如申請專利範圍第1項所述之散熱模組,其中該吸熱端 係與該散熱鰭片呈垂直。 3. 如申睛專利細第1項所述之散熱模組,其巾該等散熱 鰭片的吸熱端共同界定一吸熱部。 4. 如申轉利範圍第丨項所述之散熱模組,其巾該等散熱 鰭片的散熱端共同界定一散熱部。 5·如申請專利範圍第3項所述之散熱模組,其中該吸熱部 係貼設於姆-發熱元件上,翻以吸收該發熱元件的 ’ 熱量。 6. 如申請專娜圍第1項所述之散賴組,其巾該等溝槽 貝《•又形成在e玄基座上係呈等距間隔排列設置。 7. 如申請專利範圍第1項所述之散熱模組,其中該等溝槽 貫設形成在該基座上係呈不等距間隔排列設置。 8. 如申請專難ϋ第1項所述之散賴組,其中該基座更 包含複數結合槽,及至少-凹槽係凹設在該底部,且連 通前述溝槽,該吸熱端係彎折貼設於該凹槽内,該等結 合槽係凹設形成在對應該溝槽與該基座外側之間^… 201235824 9·如申請專利範圍第8項所述之散熱模組,其中更包輕 少二熱管,該熱管具有—蒸發端及一冷凝端,該蒸發端 係^設在對應凹槽内,且具有—第―侧係緊貼靠該等吸 熱端’及一第二側則與對應的-發熱元件相貼設,該冷 凝端係穿設於該等散熱端。 10. —種散熱模組製造方法,係包括: 基座及複數散熱續片; 將該等散熱鰭 的—端對應貫穿鮮溝槽;及 將該等散熱則貫穿該等溝槽之-端、騎並貼靠在絲 座之底部。 Π.如申★請專利範圍第10項所述之散熱模組製造方法,其 中該等散熱鰭片之-端彎折並貼靠在該基座之底部係以 機械加工形成。 U.如申5月專利範圍第11項所述之散熱模組製造方法,其 中該機械加工係為滾軋加工或沖壓加工其中任一方式 13.如申請專利範圍第10項所述之散熱模組製造方法,其 · 中該等溝槽貫設形成在該基座上係呈等距間隔排列設 ί。 μ.如申凊專利範圍第ίο項所述之散熱模組製造方法,其 中該等溝槽貫设形成在該基座上係呈不等距間隔排列設 篆0 12
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-
2011
- 2011-02-25 TW TW100106354A patent/TW201235824A/zh unknown
- 2011-04-12 US US13/084,557 patent/US20120216996A1/en not_active Abandoned
-
2017
- 2017-04-21 US US15/494,026 patent/US9905495B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20120216996A1 (en) | 2012-08-30 |
TWI447567B (zh) | 2014-08-01 |
US20170229376A1 (en) | 2017-08-10 |
US9905495B2 (en) | 2018-02-27 |
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