TW201213347A - Polymeric microparticles, conductive microparticles, and anisotropic conductive material - Google Patents

Polymeric microparticles, conductive microparticles, and anisotropic conductive material Download PDF

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Publication number
TW201213347A
TW201213347A TW100128489A TW100128489A TW201213347A TW 201213347 A TW201213347 A TW 201213347A TW 100128489 A TW100128489 A TW 100128489A TW 100128489 A TW100128489 A TW 100128489A TW 201213347 A TW201213347 A TW 201213347A
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TW
Taiwan
Prior art keywords
monomer
fine particles
conductive
polymer
microparticles
Prior art date
Application number
TW100128489A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuaki Matsumoto
Original Assignee
Nippon Catalytic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Catalytic Chem Ind filed Critical Nippon Catalytic Chem Ind
Publication of TW201213347A publication Critical patent/TW201213347A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW100128489A 2010-08-11 2011-08-10 Polymeric microparticles, conductive microparticles, and anisotropic conductive material TW201213347A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010180616 2010-08-11
JP2011025438 2011-02-08

Publications (1)

Publication Number Publication Date
TW201213347A true TW201213347A (en) 2012-04-01

Family

ID=45567761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100128489A TW201213347A (en) 2010-08-11 2011-08-10 Polymeric microparticles, conductive microparticles, and anisotropic conductive material

Country Status (5)

Country Link
JP (1) JP5245011B2 (ja)
KR (1) KR101469004B1 (ja)
CN (1) CN103097421B (ja)
TW (1) TW201213347A (ja)
WO (1) WO2012020799A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5956906B2 (ja) * 2012-10-29 2016-07-27 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
JP2014159549A (ja) * 2012-12-06 2014-09-04 Sekisui Chem Co Ltd 有機無機ハイブリッド粒子の製造方法、導電性粒子、導電材料及び接続構造体
KR101538904B1 (ko) * 2012-12-06 2015-07-22 세키스이가가쿠 고교가부시키가이샤 유기무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체
JP6231374B2 (ja) * 2012-12-31 2017-11-15 株式会社ドクサンハイメタル タッチスクリーンパネル用導電粒子、およびこれを含む導電材料
JP6306876B2 (ja) * 2013-01-24 2018-04-04 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP6438194B2 (ja) * 2013-01-24 2018-12-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP2014207193A (ja) * 2013-04-15 2014-10-30 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
JP6357413B2 (ja) * 2013-12-24 2018-07-11 積水化学工業株式会社 導電材料及び接続構造体
JP6737566B2 (ja) * 2014-01-14 2020-08-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP5996806B2 (ja) 2014-05-12 2016-09-21 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6737572B2 (ja) * 2014-08-14 2020-08-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP6734159B2 (ja) * 2015-09-30 2020-08-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
US11017916B2 (en) 2015-11-20 2021-05-25 Sekisui Chemical Co., Ltd. Particles, connecting material and connection structure
US11027374B2 (en) 2015-11-20 2021-06-08 Sekisui Chemical Co., Ltd. Particles, connecting material and connection structure
JP6959005B2 (ja) 2015-11-20 2021-11-02 積水化学工業株式会社 接続材料及び接続構造体
JP7453738B2 (ja) * 2016-11-04 2024-03-21 積水化学工業株式会社 基材粒子、導電性粒子、導電材料、接続材料及び接続構造体
KR20190132341A (ko) * 2017-03-30 2019-11-27 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6446514B2 (ja) * 2017-08-28 2018-12-26 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
JP6755991B2 (ja) * 2019-03-11 2020-09-16 宇部エクシモ株式会社 親水性粒子の製造方法
CN114730645A (zh) * 2019-11-15 2022-07-08 日本化学工业株式会社 导电性颗粒、其制造方法和包含导电性颗粒的导电性材料
CN113881084B (zh) * 2020-07-03 2024-02-06 宇部爱科喜模株式会社 亲水性粒子的制造方法以及亲水性粒子
CN118414371A (zh) * 2022-01-12 2024-07-30 积水化学工业株式会社 基材粒子、导电性粒子、导电材料和连接结构体
KR20240142404A (ko) 2022-01-27 2024-09-30 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503932A (en) * 1993-11-17 1996-04-02 Nippon Shokubai Co., Ltd. Organic-inorganic composite particles and production process therefor
JP3088069B2 (ja) * 1994-07-12 2000-09-18 株式会社日本触媒 有機質無機質複合体粒子の製造方法
JP3294146B2 (ja) * 1997-03-21 2002-06-24 早川ゴム株式会社 金属被覆微粒子及び導電性材料
JP2003308728A (ja) * 1998-07-16 2003-10-31 Sony Chem Corp 異方性導電接着剤用導電性粒子
JP5367931B2 (ja) * 2001-09-11 2013-12-11 株式会社日本触媒 ビニル系架橋樹脂粒子、その製造方法およびその用途
JP4527495B2 (ja) * 2004-10-22 2010-08-18 株式会社日本触媒 重合体微粒子およびその製造方法、導電性微粒子
KR100667374B1 (ko) * 2004-12-16 2007-01-10 제일모직주식회사 이방전도성 접속부재용 고분자 수지 미립자, 전도성 미립자 및 이를 포함한 이방 전도성 접속재료
WO2006109556A1 (ja) * 2005-03-31 2006-10-19 Nisshinbo Industries, Inc. 球状ポリマー微粒子およびその製造方法
JP5466022B2 (ja) * 2010-01-19 2014-04-09 株式会社日本触媒 導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体

Also Published As

Publication number Publication date
CN103097421B (zh) 2015-05-20
KR20130054324A (ko) 2013-05-24
JPWO2012020799A1 (ja) 2013-10-28
CN103097421A (zh) 2013-05-08
KR101469004B1 (ko) 2014-12-04
WO2012020799A1 (ja) 2012-02-16
JP5245011B2 (ja) 2013-07-24

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