TW201213347A - Polymeric microparticles, conductive microparticles, and anisotropic conductive material - Google Patents

Abstract

Conductive microparticles with which a broad connection area can be obtained at a low pressure are provided. The purpose of the present invention is to provide an anisotropic conductive material containing conductive microparticles such as those mentioned above. In addition, polymeric microparticles that can be suitably used as cores for such conductive microparticles are provided. These polymeric microparticles are characterized in that the breaking point load is not more than 9.8 mN (1.0 gf). These conductive microparticles are characterized by having a conductive metal layer on the surfaces of the polymeric microparticles. This anisotropic conductive material is characterized by containing the conductive microparticles.

Description

201213347 6. Technical Field: The present invention relates to polymer microparticles; electroconductive microparticles forming a conductive metal layer on the surface of the polymer microparticles; and an anisotropic conductive material containing the electroconductive microparticles . [Prior Art]

The electronic equipment is being miniaturized and thinned every year and is being highly functionalized. Therefore, for example, an electronic device such as a connection between an IT 〇 (indium tin oxide) electrode of a liquid crystal display panel and an LSKUrge Scale lntegrati® for driving, a connection between an LSI wafer and a circuit board, and a connection between fine electrode terminals is performed. The electrical connection between the minute parts of the class is electrically connected by an anisotropic conductive material containing conductive fine particles. There are various proposals for using such electrically conductive fine particles. For example, when there is a compression load, the conductive fine particles having a bending point where the compression deformation rate is sharply increased in the range of the compression deformation ratio of 5 to 4% (refer to Patent Document 1 (application patent item i)) The conductive particles having a maximum compressive deformation ratio of the acrylic resin as a main component of 60% or more and 60% of the compressive deformation required to adhere to the surface of the resin particles of 60 mN or less (refer to Patent Document 2 (Patent No. 13 of the patent application) ()) Conductive particles having a compressive strength at a compression displacement of 7. 〇kgf/mm2 (68. 6N/_2) or less (refer to Patent Document 3 (Patent Document No. i)); in the glass transition temperature of the individual polymer (1^) is _7〇. (The conductive particles in which the conductive layer is formed on the surface of the core material particles composed of the (meth)acrylic (co)polymerized 201213347 compound of the reverse unit derived from the (meth)acrylic monomer (refer to Patent Document 4) (Patent Document No. i)), etc. [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. 2/3/4285 [Patent Document 2] [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 8-31-9467. [Problems to be Solved by the Invention] As described above, the conductive fine particles are used as a core material. When the surface of the polymer fine particles is formed into a conductive metal layer, the particles which become the core material are hard, and when the electrodes or the like are pressure-bonded, the conductive fine particles are extruded into the body to form an indentation and increase the connection area. In addition, the pressurization connection t "excludes the conductive microparticles present in the core between the conductive microparticles and the adherend to bond the tree with such a hard f as the core material, and the second 'larger connection area needs to be connected to the galeri Time The present invention has been made in view of the above circumstances, and aims to provide conductive fine particles which can serve a large connection area with a small force P. In addition, the present invention provides a polymer microparticle of a core material of the conductive microparticles as described above as a means for solving the problem. 201213347 The polymer microparticle of the present invention which solves the above-mentioned problems is characterized in that the breaking point load is 9.8 mN (l. 〇gf) or less, and the polymer microparticle of the present invention having a breaking point load of 9.8 mN or less is used as a core. Since the conductive fine particles of the material can be easily broken in the direction of the positive direction of the compression direction by breaking the core material with a small pressure, a large connection area can be obtained with a small pressure. The above-mentioned polymer fine particles, 1% by mass The κ value is preferably 7350 N/mm 2 (750 kgf/mm 2 ) to 49000 N/mm 2 (5000 kgf/mm 2 ). As long as the polymer microparticles have such a high compressive elastic coefficient, the connection resistance value can be made lower. The average particle diameter of the fine particles is preferably at least 25%, and the compression load at the time of displacement of the polymer fine particles of 3% by volume is preferably 1.96 mN (〇, 2 gf) or more. Further, the present invention also includes conductive fine particles having a conductive metal layer on the surface of the polymer fine particles, and an anisotropic conductive material containing the conductive fine particles. [Effect of the Invention] According to the present invention, a small pressure can be obtained. Conductive fine particles having a large connection area are obtained. Further, by using an anisotropic conductive material containing the conductive fine particles, a connection structure having a low connection resistance value can be obtained even when connected under a low pressure condition. [Embodiment] 5 201213347 1. Polymer fine particles 1-1·Mechanical characteristics The polymer fine particles of the present invention, the basin column, are characterized in that the breaking point load is 9.8 Å (1.0 or less) or less. The polymer body is inclined as 7 „ $ The volume of the capsule microparticles is compressed and the compression direction is reduced, and it expands in a direction orthogonal to the I contraction method. At this time, when the polymer fine particles are not broken and the elastic particles are only elastically deformed, the polymer fine particles are broken and the J扪 expansion in the direction orthogonal to the compression direction is large. That is, the conductive microparticles of the present invention having the breaking point load of 9. 8 m N or less as the core particles of the present invention can destroy the core material with a small pressure. It is easy to expand in the direction orthogonal to the compression direction, so that a large connection area can be obtained with a small pressure. The above-mentioned breaking point load u 7.84 inN (〇.8gf) or less is preferably 'being 6.86 mN (0·7 gf ) or less. Another _士 &, ruler on the other side, the above-mentioned damage point load is better than 98.98mN (〇.lgf), to! _〇如) The above step is preferably 2.94mN (0.3gf) or more. In addition, the method of measuring the compression load value when the polymer microparticles are broken, when the polymer microparticles are compressed and deformed, will be described later. The polymer microparticles of the present invention preferably have a compression displacement of 25% or more, more preferably 30% or more, more preferably more than 3 %, more preferably 5 (10) or less, more preferably 48% or less, and further 46. % below is better. As long as the breaking compression displacement is within the above range, the indentation for forming the indentation by the object can be formed, and the joint area at the time of pressurization connection can be balanced. In addition, the compression displacement is a compression displacement when the polymer microparticles are compressed and deformed, and the measurement method will be described later. 6 201213347 The 10% compression load of the polymer fine particles of the present invention is preferably 588 mN (G.G6gf) or more, more preferably G686mN (QG7gf) or more, further preferably 〇.784mN (0. 〇8gf) or more. It is preferably 1·96_({)· 2gf ) or less, more preferably 丨 shoulder (10), and further preferably 1.568 mN (〇.16 gf) or less. When the 1% by weight compression load is in the above range, and the polymer fine particles are used as the substrate particles for conductive fine particles, it is possible to form an indentation on the connected medium such as an electrode, and to secure a connection area without practical problems. . - The 1 〇% compression load of the poly- sigma microparticles is preferably adjusted according to the desired characteristics. For example, in particular, when the connection area obtained by the conductive fine particles becomes large, it is preferable that the polymer fine particles have a 10% compression load of 588.588 mN (0. 〇 6 gf) or more. ._·〇·〇¥) The above is better, further preferably 〇.784mN (0.08gf) or more, preferably 1. 〇78mN (0.11gf) or less, and 〇98mN (〇l〇gf) or less. Further, it is preferably 0.88 mN (0. 〇 9 gf) or less. The smaller the compression load of the polymer microparticles, the smaller the compression load, and the greater the expansion of the elastic deformation in the direction of the positive direction in the compression direction. Therefore, the amount of deformation of the conductive fine particles remaining without being destroyed is also increased, so that the total connection area is also increased. On the other hand, regarding the conductive fine particles, in particular, it is desired to increase the formation of the indentation, in which the 1% by weight compression load of the polymer fine particles exceeds 1.OMmfKO.ligf), and it is better to use 1176 inN (〇12gf)a. 1.274mN (〇.13gf) or more is preferable, i 96〇mN (〇2 or less) is preferable, and 1.764mN (0. 18gf) or less is more preferable, and further preferably 201213347 1.568mN (0.16gf) or less. . The larger the ι〇% compression load of the polymer fine particles, the greater the resistance at the initial stage of deformation, so that the ability to form an indentation on the object is increased. Further, the 1% by weight compression load is a load required to deform the polymer fine particles by 10%. The 30% compression load of the polymer fine particles of the present invention is preferably 1.96 mN (G.2 () gf) or more, more preferably 2 45 mN (Q25 gf) or more, further preferably 2.94 mN (0.30 gf) or more. 7.35mN (〇75gi) The following is preferred, preferably 6.86mN (0.70gf) or less, and further preferably 5.88mN (0.60gf) or less. When the 3 〇% compression load is within the above range, the use of the polymer fine particles as the electro-microparticles for the @substrate particles can form an indentation on the connected medium such as an electrode, and can secure a connection area without practical problems. Further, the 3〇% compression load of the polymer fine particles of the present invention is preferably adjusted in accordance with the desired characteristics in the same manner as the above-described 1%% shrinkage load. For example, in particular, when the connection area obtained by the conductive fine particles is increased, the 30% compression load of the polymer fine particles is preferably 196 mN (〇2〇gf) or more, more preferably 2·45_(0.25 gf) or more, further. It is preferably 2 94 mN (〇. 3〇gf) or more, preferably 4.90 mN (0.50 gf) or less, more preferably 4 41 mN (〇45 gf) or less, further preferably 3.92 mN (0.40 gf) or less. On the other hand, regarding the conductive fine particles, in particular, when it is desired to increase the indentation forming energy, the 30% compression load of the polymer fine particles is preferably more than 49 μmN (〇.5〇gf), preferably 5.00 mN (0.51 gf) or more. Preferably, it is preferably 5.1〇mN (0.52gf) or more, preferably 7.35mN (〇.75gf) or less, more preferably 6.86mN (0.70gf) or less, further 5 88mN(〇6〇gf) 8 201213347 The combined microparticle pressure is preferably below. Furthermore, the 30% compression load is the load required to deform the condensation by 30%. The polymer microparticles of the present invention have a compressive elastic modulus at 10% compression deformation of 7350 N/mm2 (750 kgf/mm2), preferably μ4 from Μ, to 7840 N/mm2 (800 kgf/mm2) or more, and further to 8036N. /mm2( 820kgf/ mm2) to first Majia, to 49000N/mm2 (5000kgf/mm2) or less a, "two good, to 39200N/mm2 (4000kgf/mm2) or less f 4 . ruler 1 main ' further to 29400N/mm2 (3000kgf/fflm2) is better, and further 乂25480N/minz (2600kgf/min2) or less s from "Wenjia, especially below 21560N/mm2 (2200kgf/mm2). That is, compression compression, initial compression It is preferable that the elastic modulus is high. When the particles of the core material are soft, it is compressed and deformed at a small pressure due to the pressure connection, so that it is easy to obtain a large connection area. However, since it is soft, it cannot be In addition, since the indentation is formed in the body, it is difficult to remove the bonding resin existing between the conductive fine particles and the object, and it is difficult to lower the connection resistance value. However, as long as the polymer microparticles have a high compressive elastic coefficient at the initial stage of deformation, The gathering As the conductive fine particles of the core material, the fine particles can be extruded into the object when the electrode or the like is pressed, and an indentation can be formed. Further, when the pressure is connected, it is easily excluded from the conductive fine particles and being exposed. Gluing resin between the bodies. Therefore, the connection resistance value can be made lower. Further, the compression elastic modulus of the polymer microparticles can be based on the compression, the compression displacement, and the particle diameter below the compression of the granules. Further, in the following, the compressive elastic coefficient (K value) of the displacement amount of 10%, 20%, 30% or 40% is referred to as ι〇%κ value, 20%K value, 30%K, respectively. Value, 40% Κ value. [Formula 1]

K = 3xF 2^xS^xR^ where K is the compression elastic modulus (ν/πππ2), F: compression load (N), S: compression displacement (mm), r: particle radius (_). Further, the relationship between the pure value, the value, and the value of the polymer microparticles of the present invention is such that the value of 1〇%Κ>2〇%κ is good, and further, the value of 3〇%κ is satisfied>20%Κ The value is good. Furthermore, the value of 1〇%κ is satisfied >2〇%1 (value and 3〇%κ value > 20%Κ value is good, satisfying 10% threshold value > 30% kappa value > 20% k value is more The particle size of the polymer microparticles of the present invention is determined by the number average particle diameter.

When the particle k is smaller than 0, 5 // m, the surface is covered with a conductive metal layer as a conductive

Less tendency. When the polymer microparticles of the present month are used as the conductive fine particles of the substrate, when used for an anisotropic conductive material,

'The particle size of the polymer microparticles is equal to 1. 0 // m or more, further -· 0 is more than m, especially 4. 〇" m is 10 201213347 is better, to 3.5# More preferably, it is preferably 3. 2 / zm or less, further preferably 3. 0 / m or less, particularly preferably 2. 8 " m or less, and preferably 2. 5 # m or less. The fineness of the connected medium is reduced, the gap is reduced, and the conductive fine particles are required to have a small particle diameter. In addition, the low connection resistance required to be connected at a low voltage is required for the thinning of the object or the substrate to be used. When the particle diameter of the polymer fine particles of the present invention which can be broken by the pressure is within the above range, the conductive fine particles obtained from the polymer fine particles are further, in particular, the number average particle diameter is & The compression elastic modulus (10% K value) at the time of minute deformation becomes high, and the formation of the indentation of the object is further enhanced, and a stable connection state energy is easily obtained. Further, the coefficient of variation of the particle diameter is 2 (). % is better, and ιη is better than 'more than 7%. Further The coefficient of variation of the particle diameter is obtained by the following formula because of the number average particle diameter and the standard deviation. The standard deviation of the diameter of the diameter of the particle diameter / the number of average particles 1 - 2 · The polymer microparticles constituting the present invention, σ and the helmet are particularly 卩卩^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The monomer having the polymer microparticles has a non-bridging monomer in the case of the microparticles, or has one polymerizable group in the i molecule, and has two or more polymerizable groups 11 201213347 In the present invention, the addition polymerization type polymerizable group (radical polymerizable group) reaction type polymerizable group, such as a vinyl group, may be used. 1-2-2. Examples of the organic inorganic polymer fine particle organic-inorganic polymer fine particles include (3) a metal oxide such as cerium oxide-aluminum or titanium dioxide, a metal nitride, or a metal sulphide: Inorganic fine particles such as metal carbides are dispersed in an organic two-phase; (b) metal oxygenated (organic-oxygen-metal)-bonded molecules such as (organic) polysulfide oxide 6 The chain and the organic molecule are in the form of a molecule & grade = two; and (c) a layer composed of an organic-inorganic polymer microparticle comprising a vinyl polymer skeleton and a polyoxyalkylene skeleton: Among these, the aspect of (c) is preferred. In a preferred embodiment of the polymer microparticles of the present invention, at least one of the monomers constituting the polymer microparticles (organic f-polymer microparticles 'organic-inorganic composite particles) includes a specific trifunctional monomer to be described later. (4) '...(.)) 4乍 is a bridging decane-based monomer used to form a polymer. The particles containing ethylene-three-oxygenated money are in a state of 22 or higher. (11) "Number average particle diameter is "..., (4) at least i kinds of monomers of the fine particles (organic polymer microparticles), and 2 g of this monomer, the content of the specific bifunctional monomer A state in which all of the 1C α precursors of the structural polymer microparticles are 15% by mass or more (state i (iii ) ) 〇 1 - 3. The state of the polymer microparticles 3-1. Aspect (i) 12 201213347, for example, the specific 3 a characteristic of the above formula (1) can be a monomer represented by the formula (2) or the formula (3). H2C^V/R1

(1) 'A hydrogen atom or a methyl group, an R2 group group, and 'R' in the formula (1) contained in the dioxin group are independently represented independently of -0-, -Co- or alkane-- CH2- 'can also be replaced by 〇- or _c〇_.

(2) ch2 In the formula (2), the 'R3 series are independently expressed independently of each other, and _c〇_ or annoying _CH2' may be replaced by -C〇. Hydrogen atom or methyl group, R4 group, contained in the alkanediyl group 13 (3) 201213347

In the formula (3), R5 is independently represented and independently represented, and the single bond - 〇, 鲁, or phenotype, "the group -CH2-, may also be replaced by -0- or -C0-. The alkane is in the formula (3), in the 1-bit, 3-position, and 5-position of the three RSs of the benzene ring; the bond is in the position, the position of the bond, and the bond is bonded; The 1st, 2nd, and 4th positions can be used, and the 2, 3, and 3, 5 positions are preferred. It is preferred to bond the monomer to the 1 position. ) the monomer shown by formula (4) H2C\ /R5

(4) In the formula (4), R5 is independently represented by - independently, a single bond, τ, an argon atom or a methyl group, a -CH2- group of the R6 group, or -〇- or -c〇 ~Substituted or calcined diyl' contained in the alkane is in the above formula ', r2, 卩4 6 methyl, ethylene, triterpene, or an alkanediyl group, which may be referred to as sub-tetramethylene | a linear alkanediyl group such as a sulfhydryl group, a hexamethylene group, a hexamethylene group, an octadecyl group, a ninth methyl group, a decamethylene group, etc.; Trisinyl, 2-methyltrimethylene, methyltetradecyl, 2-mercaptotetramethylene, 1-decylpentamethylene, 2-methylpentenylene, 3-methyl A branched alkanediyl group such as a ruthenium group. The alkanediyl group is preferably a carbon number of 1 or more, more preferably 10 or less, more preferably 5 or less, still more preferably 3 or less, and particularly preferably a methylene group. Further, -CH2 of the above alkanediyl group is substituted by -0- or -C0-, and examples thereof include -(CH2)2-〇-, _(CH2)5_c〇_〇_, _(〇_(CH2). 2) i_〇_c〇_(i is an integer of 5), _(〇_(CH2)5)m_〇_c〇_ (integer of 5), and the like. The specific monomer represented by the above formula (1) may be a trisuccinate or a di(meth)acrylic acid cyanurate. Specific monomers represented by the above formula (2) include triallyl isocyanate, trimeric isocyanate, and triisoisocyanate ethylene oxide-denatured tris(methyl)propyl Phthalate ester, ethoxylated tris(iso)isocyanate tri(meth)acrylate, £-caprolactone denatured tris-(2-propenyloxyethyl)trimeric isocyanate, and the like. The specific monomer represented by the above formula (3) may, for example, be trivinylbenzene or triphenylhexacarboxylate. Among these, it is preferred to use triallyl cyanurate or triallyl isocyanurate. In the present case, the term "(meth)acrylic acid" means acryl oxime, methacrylic acid, and the like, and the term "yinyl" (tetra) acid means acrylate, methacrylate, and the like. mixture. The polymer microparticles ' of the above aspect (i) may contain, as a constituent component, another bridging monomer other than the above specific trifunctional monomer. As the above-mentioned bridging monomer, for example, mono(methyl)acrylic acid (meth) acrylic acid ethylene glycol s|, (meth) propyl, etc. Dilute acid two 15 201213347 butanediol diester, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(indenyl)acrylate, di(indenyl)acrylic acid 1,10 - an alkylene di(meth)acrylate such as decyl glycol ester or 1,3-butylene bis(mercapto)acrylate; diethylene glycol di(meth)acrylate, di(meth)acrylic acid Triethylene glycol ester, bis(indenyl) decyl acrylate, pentadecyl bis(mercapto)acrylate, hexadecyl glycol di(meth)acrylate, polydi(methyl) a di(methyl) group such as a polyalkylene glycol di(indenyl)acrylate such as ethylene glycol acrylate, polypropylene glycol di(meth)acrylate or polytetrabutylene bis(mercapto)acrylate. ) acrylates; trimethylolpropane tris(mercapto) acrylate, isovaerythritol tetra(meth) acrylate, diisopentaerythritol hexa(meth) acrylate vinegar, etc. Polyfunctional acrylates; aromatic divinyl compounds such as divinylbenzene, diethylene naphthalene, and the like; N,1 diphenyl sulfenylamine, diethylene basal, diethylene A bridging agent such as a sulphide or a divinyl sulphate; a polybutadiene, a polyisoprene unsaturated polyester, or the like. These bridging monomers may be used alone or in combination of two or more. Among these, a bridging monomer having 2 or more vinyl groups in one molecule is preferable, and a bridging monomer having 2 or more (meth)acryl fluorenyl groups in one molecule, aromatic diethylene Dilute compounds are preferred. In the above-mentioned bridging monomer having 2 or more (meth)acryl fluorenyl groups in the molecule, a monomer having two methacryl fluorenyl groups in the fluorene molecule (dimethacrylic acid vinegar (five) is more preferable. - The step is preferably an alkylene glycol methacrylate. Among the above aromatic divinyl compounds, α-diethyl is preferred. When diethyldiphenyl is used, high hardness and excellent heat resistance are obtained. Polymeric microparticles. It can also contain non-bridging. In addition, the above-mentioned aspect (i) of the polymer microparticles 16 201213347 styrenes: on a certain 芏7. wilderness ft ΛΑ β,,.χ

A monomer is used as a constituent component. The above non-bridging monomer may, for example, be (fluorenyl)acrylic acid; (mercapto)methyl acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, ( Isobutyl methacrylate, tert-butyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (mercapto) acrylate Ester, decyl (meth) acrylate, decyl acrylate, glycerol (meth) acrylate, stearyl (meth) acrylate, 2-ethyl hexyl (meth) acrylate, etc. Methyl) acrylic vinegar; (fluorenyl) cyclopropyl acrylate, (meth) acrylate cyclopentate, cyclohexyl (meth) acrylate, cyclooctyl (meth) acrylate, (meth) acrylate ring (decyl)acrylic acid naphthenic acid such as undecyl ester, cyclodecyl (decyl) acrylate, isobornyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate Ester; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, ( 2-Hydroxybutyl acrylate, etc. (hydroxyalkyl methacrylate; phenyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, (meth) acrylate a propylene-based monomer such as phenyl ester or the like containing an aromatic fluorene (meth) acrylate; styrene, o-methyl styrene, m-methyl styrene, p-nonyl styrene, mercapto styrene, o-ethyl Styrene 1 ethyl stupid ethylene, oxime ethyl stupid ethylene, p-tert-butyl styrene and other alkyl styrene; p-phenyl styrene and other aromatic rings containing stupid vinyl; _ styrene, methane styrene And a vinyl ether containing a halogen such as a chlorostyrene, a vinyl group having a hydroxyl group; a hydroxy group-containing allyl ether such as 2-hydroxyethyl butyl allylic ether, etc. 17 201213347 If you are a non-bridging monomer, you can also partially neutralize it with an inert metal. The above non-bridging monomers can be used alone or in combination. When the polymer fine particles of the above aspect (1) are organic inorganic polymer fine particles, The monomer of the polymer fine particles may be added with the above-mentioned bridging monomer and any non-bridging monomer, and the Si Xiyuan monomer may be used. For example, the hydrolyzable compound of the following formula (5) and its derivative, etc. R?nSiX4-n (5) "Formula", which means that the substituent may also be selected from the hospital The group consisting of a group consisting of a base group, an aromatic group, an aralkyl group and an unsaturated aliphatic group, and an alkyl group having a hydroxyl group, an alkoxy group and a decyloxy group, is an integer of '0'. The decane-based monomer represented by the above formula (5) is, for example, a tetrafunctional ceramsite-based monomer such as a brothel or a tetraethoxy zeshi, or a methyl-oxygen compound or a methyl group. Ethoxylated sulphuric acid, etc. & trifunctional sulphate = body, dimethyl methoxy decane, dimethyl ', oxime oxane, etc. Methyl methoxy decane, trimethyl succinyl monofunctional decane monomer, and the like. ▲ $ 矽 矽 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 ▲ 以 以 ▲ ▲ ▲ ▲ The above-mentioned money compound = a low condensate or the like. The knife hydrolyzes the above-mentioned Shi Xixuan monomer, and has a Sixiyuan monomer having a poly 18 201213347 hydrolytic reaction group capable of forming an organic polymer skeleton (these are particularly called bridge bridging monomers, including bridging properties) Monomer) is preferred. Examples of the above-mentioned polymerizable reactive group include the radical polymerizable group, an epoxy group, a hydroxyl group, an amine group, and the like, which are exemplified by the following formulas (6), (7), and (8). CH2=C(-Ra)-C00Rb-(6) represents a divalent organic group having 1 to 20 carbon atoms which may have a hydrogen atom or a methyl group in the formula "Ra". CH2 = C(-Rc)- (7) where Re represents a hydrogen atom or methyl CH2 = C(-Rd)-r- (8) c is a substituent in which the ' Rd system represents a hydrogen atom or The carbon number of the methyl group is a two-valent organic group of 20. The radical polymerizable group represented by the above formula (4) may, for example, be a acryloyl group or a methacryloxy group. The radical polymerizable group of the above formula (7) may, for example, be a vinyl group or an isopropyl group. The radical polymerizable group of the above formula (8) may, for example, be a vinylphenyl group or an isopropenylphenyl group. The above-mentioned bridging-based sinter-fired monomer may, for example, be 3-methyl propylene oxypropyltrimethoxy sulphur, 3-methylpropenyloxypropyltriethoxy sulphur, 3-methyl Propylene methoxypropyl methyl dimethoxy ketone, ethylene trimethoxy sulphate, ethylene triethoxy hydride, p-phenylethylene trimethoxy decyl, ethionyl trimethoxy (four) , Buyi County, three ethoxy money, etc. with free radical polymerizable base; 3 'glycidyl hydroxypropyl trimethoxy valence 3-glycidyl hydroxy propyl methyl diethoxy sulphur, 3 shrink a group containing a epoxide such as glyceryl ether oxypropyl diethoxy sulphide; 3 propyl propyl methoxy hydrazine 19 201213347 or the like containing a base; 3-aminopropyltrimethoxy sylvestre An amine group such as 3-aminopropyl-triethoxy (tetra) or the like. It is possible to use only one type of these bridging system, and it is also possible to use two or more types together. Among these bridging stones: among the calcined monomers, those having a radical polymerizable group are preferred. Specifically, a 3-functional bridge of 3-(methyl) propylene sulfonium oxide, trimethoxy methoxy sulfonium, vinyl trimethoxy fluorene, U3, 4-oxocyclohexyl)ethyltrimethoxy, etc. It is preferable that the monolithic monolithic monomer is a trifunctional group such as 3-(methyl) propylene sulfoxypropyltrimethoxy (tetra) having a radical polymerizable reactive group, and ethylene trimethoxy sulphate. The erected bridge stone courtyard is a good unit. Further, among the compounds represented by the formula (5), a preferred decane-based monomer having a bridging-type monomer is 2, and a trifunctional group such as methyl oxy decane or styrene-methoxy oxysulphate is exemplified. In addition, as the monomer of the Shixi firing system, only the Shishi compound and its derivative of W in the above formula (5) cannot be used to obtain the skeleton of the polystone. When the particles are introduced into the polyoxyalkylene skeleton, it is necessary to contain the compound of the above formula (5), and the derivative of the compound of the above formula (1). The monomer combination of the polymer microparticles constituting the above aspect (1) is only composed of a bridging type of monoclitax. (1)) Both the bridging monomer and the non-monomer may be used together. Here, in the case of any -, a di-functional trifunctional monomer is included, and the above-mentioned specificity is... When the combination of bridging monomers, = (4) only by the combination of specific trifunctional monomers; (the two bodies with the bridging and firing unit monomer; (C) combined with a specific 3 heart (four) A:) C The pattern of a rare bridging monomer; (4) combined with a specific body, bridging, and monomeric (meth) propionate bridging single 20 201213347 The amount of the above-mentioned special trifunctional monomer is preferably in the mass portion of the total mass of the constituent fine particles, and is preferably lf or more, more preferably 5 parts by mass or more, and further 1 part by mass or more. Preferably, it is preferable to use the mass portion or less, and it is more preferably 6 parts by mass or less, and more preferably 55 parts by mass or less. As long as the specific trifunctional monomer is used in an amount of 1 part by mass or more, the specific use can be effectively utilized. The characteristics of the trifunctional monomer can make the particle breakage of the polymer microparticles lower. In the above-mentioned aspect (1), the polymer microparticles are easy to be weighed and loaded into a weight of 588 mN (〇.〇6gf).1. 78mN(〇_llgf)^||a〇jtb^> It is easy to control the compression load at ^6mN(0.2〇gf)^9〇mN(〇5〇gf)^||〇#^^^^ Value 20 The relationship between the 〇Κ value and the value of 30% K is controlled to satisfy the value of 1〇%κ> and the value of 3 is >2. Therefore, the polymer microparticles of the aspect (1) are used as the basis of the conductive microparticles. In the case of the material particles, it is easy to ensure a particularly large connection area. Bu 3-2. Aspect (U), the polymer microparticles of the above aspect (ii), the organic inorganic polymer microparticles will be packaged The particles of the vinyl trialkoxy decane are heat-treated at a temperature of not less than C as a bridging (tetra)-based monomer forming a polymer. Here, the particles of the ethoxylates of the Emergence III are contained: a particle containing the ethylene-triosyloxy money (Ha); and a particle (1)b) comprising a skeleton composed of a (tetra)-based monomer (co)hydrolyzed condensate comprising a thiophene A particle (iic) containing a polymer skeleton of a vinyl-containing monomer (tetra) from a polymerizable monomer (vinyl-based i-type precursor, a decane-based monomer) from 21 201213347. (iib) or (iic) is preferred, further comprising (llb) and satisfying (llc) of the particles, that is, consisting of a hydrolyzed condensate comprising a vinyl trioxyloxyl (4) monomer (4): The skeleton 'i contains a polymer skeleton of a radical polymerizable monomer (vinylic monomer, Shih-Xing monomer) containing a vinyl trialkoxy decane, which is a good Burning, preferably based on the ethylene-based trimethyl gas base stone court. , the state ("(four) composite microparticles +, as a monomer constituting the polymer microparticles" plus vinyl trialkoxy decane, bridging I. raw monomer exemplified in the aspect (1), non-bridging monomer, B It is also possible that the above-mentioned bridging monomer is more than 2 in the i molecule: the bridging monomer of the ethyl group is preferable, and 2 or more is a bridging type monomer having a (fluorenyl) acryloxy group-containing olefinic group and an aromatic divinyl compound having at least 2 (meth) acryloxy groups in one molecule; It is preferable that a monomer having two methyl propylene oxide oxy groups in the i molecule (dimethyl propyl phthalic acid) is preferable, and further, the ethane diol dimethyl hydrazine is better than the above aromatic divinyl hydride. Among the compounds, divinylbenzene is also preferred. When divinylbenzene is used, polymer microparticles having high hardness and excellent heat retention can be obtained. In this case, the amount of the above-mentioned non-bridging monomer and bridging monomer is The amount of vinyl dialkoxy decane used is lower than that of non-bridging monomer + bridging monomer) / ethylene The trialkoxy decane is preferably 〇丨 or more, more preferably 〇. 2 or more, further preferably 〇. 3 or more, preferably 2 or less, more preferably u 22 201213347 or less, further preferably 1 or less. In the case of the polymer microparticles of the aspect (ii), it is easy to control the 1 〇% compression load to be more than 1. 〇78 mN (0· llgf), 1. 960 mN (0.2 gf) or less. The compression load is controlled to be in the range of more than 4.90 mN (0.5 〇gf), 7.35 mN (〇. 75 gf) or less. Therefore, the polymer microparticles of the aspect (ii) are used for the substrate particles as the conductive fine particles. In particular, the indentation formation ability is excellent. The bridging element is the amount of the polymerizer used in the above aspects (i) and (ii) (including the bridging decane-based monomer), and constitutes the polymer microparticles. Among the mass parts of the monomer 100, it is preferably 20 parts by mass or more, more preferably 4 parts by mass or more, and more preferably 6 parts by mass or more, more preferably more than the mass portion. (1) The polymer microparticles of (1) are also composed of a bridging monomer alone. When the non-bridging monomer is used as the polymer microparticles in the above (1) and (ii), the amount of the polymer microparticles is 100 mass parts or more, preferably 10 mass parts or less, preferably 80 mass parts. The mass portion is more preferably 5% or less. Further, in the case of polymerizing the polymer microparticles of the above aspects (i) and (ii), the above-mentioned 矽";-organic inorganic body (four); into -70糸 early body The amount of use 'constitutes the polymer micro-pulse all the early 胄100 mass ri 1 η枋曰* is preferably 5 or more, more preferably 1. The quality of the Dong or above is better, and further 15 20f (four) n99# is better. It is preferable to use 〇 / , , δ , and 里冲 , and to use 90 mass ° 'step - step to 80 mass parts or less, preferably 60 masses. In the case of the polymer fine particles of 23 201213347 - u(1), (11), the particle diameter is not particularly limited. When the conductive fine particles are used, the number average particle diameter is preferably used. In addition, when the conductive fine particles having the polymer fine particles as the base material are used for the anisotropic conductive connecting material, the number of the polymer fine particles having a low resistance value is easily obtained, and the number average particle diameter of the polymer fine particles is 3 〇 or less. Preferably, it is more preferably 2.bra or less, and further preferably 2 or less. In addition, the formation of a metal coating layer in the form of a polymer fine particle is obtained by easily obtaining a conductive fine particle which suppresses aggregation, and the number average particle diameter is 〇 Preferably, 5#m or more is preferably 1. 0 ym or more. 1 - 3 - 3. Aspect (iii) The polymer microparticles of the above aspect (iii) are constituting the polymer microparticles (organic polymer microparticles) At least one of the monomers includes a specific bifunctional monomer described later. The specific bifunctional monomer has two vinyl groups in one molecule and one to 14 atoms through the two ethyl thio groups. The above-mentioned specific bifunctional monomer may be an aromatic divinyl group such as o-divinylbenzene [2], m-divinylbenzene [3] or p-divinyl strepene [4]; Methyl) acetoxyacetate S [6], mono(methyl) acrylate Glycol g is intended to be [7"|, _(mercapto)acrylic acid 1,4-butanediol ester [8], bis(indenyl)acrylic acid 1,5-pentanediol ester [9], di(indenyl) 1,6-hexanediol [1], 1,7-heptanediol di(meth)acrylate [U], 1,8-octanediol di(meth)acrylate [12] Alkane bis(mercapto)acrylate such as 1,9-nonanediol di(meth)acrylate [13] or 1,10-decanediol diester (14) ; Diethylene glycol vinegar [9], tris (meth) acrylate glycol 24 24 201213347 [12] and other polyalkylene glycol binary values, which are expressed in: methyl In addition, the number of functional monomers in the parentheses can be = the number of atoms between the individual women's bases. These specific 2, .U are used alone, 'can also be more than two kinds. In the case of the polymer microparticles of the sample (111), the content of the above-mentioned special composition is on the 迩 2 s opaque body, and it is preferable to use 15 mass 篁 / or more of the total monomer of 3. P. More preferably, it is 40% by mass or more. In particular, the number of atoms between the above specific 2 um.m ^ is 2 The production is all. (Under, there is a specific bifunctional monomer (a), preferably 15% by mass or more, and 4% of the total amount of the "microparticles" is preferably 40% by mass or more. The step is preferably 60% by mass or more, preferably less than or equal to 5% by weight, more preferably 90% by mass or less, and more preferably 8% by mass or less. Specific 2-functional monomer (4) to ethylene Preferably, the specific 2 is used as a functional monomer, and the number of atoms existing between the two ethylene groups is 7] 4 (hereinafter, it is called The case of the monofunctional monomer (1). In the case of the total monomer constituting the fine particles of the polymer, it is preferably 35% by mass or more, more preferably 4% by mass or more, more preferably 45% by mass or more, and most preferably 8% by mass or less. It is more preferable to be π mass% or less 'more preferably 7 〇 mass% or less. Specific bifunctional monomer (b), preferably bis(meth)acrylic acid diol vinegar, terephthalic benzene, polyalkylene glycol mono(meth) acrylate, especially di(meth)acrylic acid It is preferred that 1,6-hexanediol vinegar or diyl)acrylic acid L 9-decanediol ester. When the specific bifunctional monomer is used in combination with the specific bifunctional monomer (a) and the specific bifunctional monomer (b), the mass ratio (specific bifunctional monomer (a" 25 201213347 specific bifunctional monomer Λ ^ . η )), preferably 〇.5 or more, and 0.7 or more f is estimated to be more than U, preferably less than 2, and the following is better than "5 or less. It is more preferably 1.5 or less, and further, in this case, divinylbenzene is preferably contained. Divinyl stupid people, 勹2 旎2 旎 旎 early (a), 3, in a specific bifunctional monomer (50% by mass or more is preferable, and in the body (a), 70% by mass or more The amount of % or more is better. Wen Jiajin-step is a 90-state (iii) poly-octagonal throwing monomer, plus ±#胄2 j # '丨 as the structure of the combined microparticles = two monomers, can also contain Non-bridging monomer. Non-bridged early body, for example, as exemplified in the aspect (1) [body is not the above-mentioned non-bridging monomer, and has a smaller point load, and has a ring structure and a structure of the fine particles. k (Moon 曰 aliphatic ring structure, aromatic 斿 structure) is better. Such a non-bridging monomer, such as cycloalkyl acrylate and other aliphatic ring (9) " Ethylene, ethyl benzene Baked sulphur-like monomer, such as styrene monomer, methyl stupid, polycyclic aromatic vinyl compound, etc., such as a polycyclic aromatic vinyl compound, etc.: a 'non-bridging monomer having a cyclic structure' It is preferred to use a polymerizable group (preferably a vinyl group or a (meth) acryloxy group) to bond to a ring structure. In addition, in the case of styrene, methyl phenyl bromide, and the like, in the case of a ring structure, a substituent having no number of 2 or more in addition to the polymerizable group (for example, a carbon number) It is preferable that it is a base of 2 or more. If the styrene has no high-volume substituent other than the polymerizable group, the obtained polymer fine particles become harder, and the load can be easily destroyed by a lower load 26 201213347 In this case, since ethyl styrene is softened by the polymer microparticles having a high volume of ethyl 4, it tends to be less likely to be damaged by low load. Therefore, when a non-bridging monomer having a cyclic structure is used, The content of the monomer having a substituent having a carbon number of 2 or more other than the polymerizable group is preferably 70% by mass or less, more preferably 6% by mass or less, and further preferably 5% by weight of the total monomer of the conjugated fine particles. The amount of 〇% by mass or less is 隹. In addition, since the divinylbenzene of the market is containing ethyl styrene as an impurity and divinylbenzene as a specific bifunctional monomer, it is preferable to use high purity. When the above-mentioned annular structure is a non-bridging monomer, The total content of the non-bridging monomer and the specific bifunctional monomer having the cyclic structure 4 is preferably 5% by mass or more by mass based on 5% by mass of the total monomer constituting the fine particles of the polymer, and further preferably 7 〇% by mass or more is better: In addition to the human body, the total of the two-membered military, phenethyl hydrazine, and methyl styrene is in the total monomer constituting the fine particles of the polymer, and it is preferable to use Μ mass, 6 The amount of 〇% by mass or more is more preferably 7% by mass or more. In particular, the total content of the specific bifunctional monomer' and styrene is 50% by weight of the total monomer constituting the polymer fine particles. 6°% by mass or more is better, and the step-by-step is 7"«The above is the best non-two = fixed two-dimensional:,) and has the above-mentioned annular structure *. Eight has the braided structure of the non-bridging monomer 盥 specific 2 The total content of the functional green body (4) is preferably 5% by mass or more, and is preferably 5% by mass or more. More than % by mass, and more: % or more in quality. Further, the total content of the specific 2 urethane and the methyl phenyl hydrazine is preferably 5% by mass or more in the total of = 201213347 constituting the polymer (4), and is preferably 6. It is better to have a mass % or more, and it is preferable to use two or more. In particular, the specific bifunctional monomer (4) and the benzoic acid (3) are preferably 5 or more in the total monomer constituting the polymer fine particles, and more preferably 6 〇 吾 , , , , , , , , , Further, 7% by mass or more of Majia. It is preferable that the ratio of the amount of the specific bifunctional monomer (4) to the non-bridging precursor having a cyclic structure (the non-bridging monomer having a cyclic structure/specific monomer (4)) exceeds. More preferably .5 or less, the step is preferably 0.1 or less. When the mass ratio is within the above range, the obtained polymer fine particles can be made too hard. The above specific bifunctional monomer (8) is used in combination with the above cyclic structure non-bridge. In the case of a monomer, the total content of the non-bridging monomer having the cyclic structure and the =2 S energy (b) is 5 in the entire single sheet constituting the polymer fine particles. The mass % or more is better, to 6. More than or equal to 7% by mass or more. In addition, the total content of the specific bifunctional monomer (7) and benzene = 曱 basic ethylene is preferably 50% by mass or more, and 6% by mass or more by mass or more of the entire military body constituting the polymer fine particles. good. In particular, the "10" content of the monomer (8) and the "second" content is preferably 曰% or more in the total monomer constituting the polymer fine particles, and more preferably 60% by mass or more f #% $ or more. 7〇质量质量以上马佳. In this case, the mass ratio of the specific bifunctional monomer (1) to the ring structure precursor (the non-frame monomer (10) having a ring structure is preferably 0.5 or more, more preferably 2 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the above range, Zhaxianli is harder and can be easily destroyed by a lower load. U-particles, in addition, the state (iu) of polymer microparticles, the degree of effect, plus specific bifunctional monomers, Further, in addition to the monomer of the present invention and the monomer of the present invention, (4) a bridging monomer may be used as a constituent of the polymer microbody. In this case, a trifunctional or higher bridging monomer (except for a specific one) may be used to form a polymer microparticle. In the whole monomer, the mass is 5〇; : the next is better, the following 4. The quality is better, further 3 is better than the quality: In addition, the content of the trifunctional or higher bridging monomer is such that the increase in the breaking point load can be suppressed within the above range. In addition, the yttrium of the bifunctional bridging monomer other than the specific bifunctional monomer In the total monomer constituting the fine particles of the polymer, it is preferably 5% by mass or less, more preferably 40% by mass, more preferably 3% by mass or less, and more preferably a specific 2-functional monomer. When the content of the bifunctional bridging monomer is within the above range, the softening of the obtained polymer fine particles can be suppressed, and the low molecular weight can be easily broken. The monomer combination of the polymer fine particles constituting the above aspect (iii) can be mentioned. (I) a composition consisting only of a specific bifunctional monomer; (11) using a specific bifunctional monomer in combination with a non-bridging monomer having a cyclic structure; (丨丨丨) combining a specific bifunctional monomer The aspect of the bridging monomer other than the above; (IV) the combination of a specific bifunctional monomer, a bridging monomer other than the bridging monomer, and a non-bridging monomer having a cyclic structure. (1) Containing only specific 2-functional monomers (a) 29 201213347 a specific bifunctional monomer comprising divinylbenzene and/or bis(indenyl)acrylic acid ethylene glycol ester as a specific bifunctional monomer (a), comprising styrene as a non-bridging single having a cyclic structure Combination of bodies (the content of 'divinylbenzene and/or bis(indenyl))ethylene glycol acrylate in the whole monomer constituting the polymer fine particles is 15% by mass or more, divinylbenzene, di(meth)acrylic acid The total content of ethylene glycol vinegar and styrene is preferably 50% by mass or more.); (2) contains only a specific bifunctional monomer (b) as a specific bifunctional monomer, and is bis(indenyl)acrylic acid. Monohydric alcohol and/or polyalkylene di(meth)acrylate vinegar as a specific bifunctional monomer (b), containing styrene as a combination of non-bridging monomers having a cyclic structure (constituting polymer microparticles) In the all monomer, the content of the di(meth)acrylic acid diol vinegar and/or the polyalkylene glycol bis(indenyl) acrylate is 35 mass % or less, 80 mass % or less, and the alkanediol bis (indenyl group) Acrylate, polyalkylene glycol di(meth)acrylate, divinylbenzene and styrene Preferably in a total content of more than 50% by mass. a combination comprising a specific bifunctional monomer (a) and a specific bifunctional monomer (b) as a specific bifunctional monomer (in the all monomer constituting the polymer microparticles, the content of the specific bifunctional monomer (a) is 15% by mass or more, the content of the specific bifunctional monomer (b) is preferably 35% by mass or more. In addition, in the all-cell constituting the fine particles of the polymer, the content of the trifunctional or higher bridging monomer is preferably 3% by mass or less. The above-mentioned aspect (iii) has a number average particle diameter of 3. 0" m or less, preferably 2. 8 " m or less, with 2. 5 " the following is better, 〇.5" It is more preferable that the above is better than the 'w 1 〇 " ma. When the number average particle diameter is in the above range, the conductive fine particles having the polymer fine particles as a base material are excellent in dispersibility when used for an anisotropic conductive connecting material. And 30 201213347 谷 易. The connection structure with low connection resistance value is obtained. 1-4. Method for producing polymer microparticles The method for producing the polymer microparticles of the present invention may be emulsion polymerization, suspension polymerization, dispersion polymerization, or seed polymerization. The sol-gel seed crystal polymerization method, etc., and the seed crystal polymerization and the sol-gel seed crystal polymerization method can make the particle size distribution small and good. Furthermore, the sol-gel seed crystal polymerization method is a kind of seed crystal polymerization. In particular, it means that the crystal grains are synthesized by a sol-gel. For example, a polysiloxane obtained by a hydrolysis condensation reaction of an alkoxydecane is used as a seed crystal, etc. There are species: The case where the sub-composite is composed of an organic polymer and the composition of the composite organic matter and the inorganic material (the case where the sol-gel species is legal and legal). In addition, when emulsion polymerization, suspension polymerization, or dispersion polymerization is used, Wet classification 荨 'reducing the particle size distribution of the polymer microparticles. The polymer microparticles of the present invention include the above-described organic polymer microparticles, organic-inorganic composite particles, and the like, and then the organic-inorganic composite particles to contain the ethylene-based polymer. It is preferable that the skeleton and the organic inorganic polymer microparticles of the skeleton of the polystone compound are preferable, and in particular, the bridging money monomer of the polymerizable reactive group

Hydrolysis. Condensation reaction to prepare polymerizable (4) core particles, H polymerizable poly-bank particles, absorbing the above-mentioned specific monomer, the specific monomer of the above-mentioned bridging monomer (preferably (meth) propyl monomer It is preferred that the above-mentioned non-bridging monomer (preferably a styrene monomer) is polymerized. In addition, in the case of the above-mentioned ethylene-polyurethane-polymer and polyoxyalkylene skeleton = fused-incorporated microparticles, the bridging Shixiyuan monomer having a polymerizable reactive group is hydrolyzed. After the polymerizable polyaerobic granules 201213347 are prepared, the polymerizable polyoxo oxy-fired particles absorb the bridging monomer other than the specific monomer (preferably (meth) propyl monomer), It is preferred that the above-mentioned non-bridging precursor (preferably, the present vinyl monomer) is polymerized and then heat-treated. The above heat treatment is preferably carried out in air or in an inert gas, preferably in a nitrogen gas. The temperature of the above heat treatment was 2 Torr.匚 (more preferably 27 (TC is better) or more, thermal decomposition temperature (4 〇〇 = better, step - 37 to TC is better). The above heat treatment time is 〇 _ 3 hours (better than 5 hours, 'in step-step to 〇. 7 hours is better) above, preferably 1 hour (5 hours is better, 3.0 steps is better). The above-mentioned treatment is based on the fact that Du Cong Zuo a..., 蜒理的奴佳, is particularly useful for obtaining the fine particles of the morphology (alumina). 2. Conductive microparticles η μ丄It is assumed that the surface of the s and fine particles is coated with a conductive metal layer. Therefore, the conductive fine particles of the present invention are provided with the above-mentioned polymer fine particles, and the properties of the fine particles are reduced. The metal constituting the conductive gold layer is not particularly Restricted, you can slap, for example, 'gold, silver, copper, platinum, tin, sho, chrome', nickel, bismuth, pair, record, Syria, wrong, tin, start, and record, record - boron, etc. Among the metals, metal compounds, and alloys of (4), gold, nickel, and palladium, and the phase silver 'copper and tin are excellent in electrical conductivity. Point of cheap, nickel, a nickel alloy spiro ^ eight people, steel, copper alloy, silver alloy, tin, a tin alloy, preferably wherein Bingjia nickel, a nickel alloy (Ni-P, Ni-]

Ni-Zn, Ni-Sn, Ni-W, Ni-C〇, Ni_Tim soil 11) and the like are preferred. Further, when the conductive metal layer may be a single layer or a plurality of wattage layers, a combination of nickel/gold, nickel/palladium, nickel/palladium/gold, rhodium/spicy/silver may be exemplified. 32 201213347 The thickness of the above conductive metal layer is preferably α 0. 〇u m or more, more preferably 0.03. ...the next is better, and the best is 〇 15 (four). When the thickness of the conductive metal layer is in the above-described range β and the electrical microparticles are used as the anisotropic conductive material, a stable electrical connection can be maintained, and the mechanical properties of the polyparticles such as the breaking point load can be sufficiently effectively utilized. The conductive fine particles of the present invention may be attached to the surface of the conductive metal layer and further have an insulating resin layer. The insulating resin layer is not particularly limited as long as it can ensure the insulation between the particles of the conductive fine particles, and the insulating resin layer can be easily collapsed or peeled off by a predetermined pressure and/or heating. Examples thereof include polyolefins such as polyethyl amide; (meth) (tetra) vinegar polymers and copolymers such as poly(methyl) acrylate methyl vinegar; and thermoplastic resins such as polystyrene or the like. A thermosetting resin such as an epoxy resin, a resin or a melamine resin; a water-soluble resin such as a polyethylene material; and a mixture thereof. However, when the insulating resin layer is too hard compared to the polymer fine particles to be the substrate, the polymer fine particles themselves are broken before the insulating resin layer is broken. Therefore, the unsealed or bridge degree is used for the insulating resin layer. A relatively low resin is preferred. The insulating resin layer ' may be a single layer, or may be composed of a plurality of layers, for example, a single or plural film-like layer; and an insulating granular, spherical, massive, or scale-like layer may be adhered to the surface of the conductive fine particles. a layer of particles of other shapes; further, a layer formed by chemically modifying the surface of the electrical microparticles. The thickness of the above-mentioned resin insulating layer is preferably G·Gin〆m 33 201213347, and more preferably 0.1 1 to 〇· 5 # m. When the thickness of the resin insulating layer is within the above range, the conduction characteristics of the conductive fine particles can be favorably maintained, and the electrical insulation between the particles is good. The number average particle diameter of the conductive fine particles of the present invention is preferably 丨.丨m or more, more preferably 1.2/m or more, further preferably h 3 is m or more, and particularly preferably 1.4 ym or more. It is better to use & 5 #m below to be 3·3 #出以下以下, further to 3. 〇# m below, preferably to 2. 8 " m below, the number average particle size is within this range In addition, it can be an electrically conductive fine particle excellent in indentation formation. 2-1. Method for producing conductive fine particles The conductive fine particles of the present invention are obtained by forming a conductive metal layer on the surface of the above-mentioned polymer fine particles. The method of coating the surface of the polymer fine particles with the conductive metal layer is not particularly limited, and examples thereof include electroless plating instead of plating such as electroplating; and paste coating obtained by mixing the metal fine powder alone or with a binder. Method of bulk microparticles; vacuum evaporation clock, physical vapor deposition method such as ion plating, ion sputtering, and the like. Among these, the electroless plating method is preferable because a large-scale device is not required, and a conductive metal layer can be easily formed. When the conductive fine particles of the present invention have an insulating resin layer, the surface of the conductive metal layer is subjected to an insulating treatment with a resin after the electroless plating step. The method of forming the insulating resin layer is not particularly limited, and for example, interfacial polymerization, suspension polymerization, emulsion polymerization, and insulating resin of the raw material of the insulating resin layer are carried out in the presence of the conductive fine particles after the electroless plating treatment. A method of microencapsulating conductive fine particles; after the conductive micro 34 201213347, an insulating resin solution for dissolving an insulating resin in an organic solvent is previously known as a dipping method; a spray drying method, by a hybrid method Wait, the method of first and foremost can be used. 3. The conductive microparticles of the anisotropic conductive material can also be used as a structure of the anisotropic conductive material, and the conductive conductive particles are made of the conductive fine particles of the present invention. 'Also is a preferred embodiment of the invention. The above-mentioned conductive material is a conductive material which is obtained by using the conductive fine particles of the present invention. The shape of the conductive fine particles is, for example, an anisotropic conductive film, a lithium conductive paste, and a conductive material. #森' τ王等, /, a square conductive adhesive, an anisotropic conductive ink, etc., various forms. That is, the anisotropic conductive material can be electrically connected by being provided between the opposing substrate and the electrode terminal. Further, the method-specific conductive material using the conductive fine particles of the present invention includes a conductive material for a liquid crystal display element (a conductive spacer and a composition thereof). The anisotropic conductive material is produced by dispersing the conductive fine particles of the present invention in an insulating kneading resin to form a desired form, and it is also possible to use an insulating adhesive resin and conductive fine particles, and a linking group. There is also no # between the or the electrode terminals. The above-mentioned gluing tree is not particularly limited, and may be, for example, a thermoplastic resin such as an acrylic resin, an ethylene-vinyl acetate resin, or a styrene-butene-alkyl block copolymer; or a monomer or oligomer having a glycidyl group; A curable resin composition which is cured by a reaction with a curing agent such as an isocyanate, or a curable resin composition which is cured by light or heat.

[Comparative Example J] Hereinafter, the present invention will be described more specifically by way of examples, but the present invention is not limited to the following examples. The following examples are intended to be appropriately modified, and these are all included in the scope of the present invention. The technical scope of the invention. Furthermore, unless otherwise mentioned, "part" means quality, and Γ% means mass 0/〇. 1. Evaluation method 1 - 1. Average particle diameter The average particle diameter of the polymer microparticles was measured by a C〇ulter Multisizer 111 type (manufactured by Beckman Coulter Inc.), and the particle diameter of 300 00 particles was measured to obtain an average particle based on the number. The diameter is taken as the number average particle diameter. 1 - 2. Mechanical characteristics: Using a micro-compression tester (MCT W500, manufactured by Shimadzu Corporation), at room temperature (25〇c), i particles scattered on a sample table (material: sks plate) The load was applied to the center of the particle at a constant load speed (2.2295 mN/sec) using a circular plate press (material: diamond) having a diameter of 5 。. Then, the compression displacement was measured to be 1 (U, 20). The load at %, 30%, and 4Q%. The load when the particle is destroyed is "when the break point (mN)". The displacement at this time is "breaking the compression displacement ("heart", "destroying the compression displacement ( In addition, in the measurement system, the average value is used as the measured value for each of the different samples (four), and the K value is calculated from the measured compression load, the compression displacement of the particles, and the particle diameter. 3. Evaluation of the anisotropic conductive material, the conductivity is followed by the paste, and the glass substrate is formed by sandwiching the electrode, and the adhesive is cured by i 8 (rc). Structure of an anisotropic conductive sheet composed of a substance sandwiched between electrodes 36 201213347 Connect the structure.) For the obtained test piece, connect the resistance value (Ω) with a four-terminal Ling/疋, and use this as the initial resistance value. In addition, the test piece is magnified by a microscope (magnification: 1 000 times) Observe that there is no indentation on the surface of the electrode on the side of the anisotropic conductive sheet. It is confirmed that the indenter is evaluated as 〇, and the indentation is not confirmed as x. 2. Manufacturing of the polymer microparticle manufacturing example 1 The four-necked flask of the condenser, the thermometer and the drip inlet was placed in 804 parts of deionized water, 1.2% of ammonia water, and 336. 6 parts of methanol. The mixture was added with 3_mercapto propylene by the drip inlet. Propyl trimethoxy zeshi shochu ("KBM503" manufactured by Shin-Etsu Chemical Co., Ltd.) 80 parts of a mixture of methanol 59.4 parts was used to hydrolyze 3-methyl propylene oxypropyl tridecyl decane. - Reaction „Essence of a polyoxanthene-fired particle (polymerizable polyoxo-fired particle) having a methyl propyl decyloxy group by a week. After the reaction is started for 2 hours, the obtained polyoxyxane particle is milk. The turbid liquid was sampled and the particle size was determined, and the number average particle diameter was 2.25 # m. Polyoxyethylene styrene phenyl ether sulphate as an emulsifier - Recording of a 20% aqueous solution of "High Tenor" ("High Tenor") is dissolved in 8 parts of deionized water. The solution was added to dissolve 80 parts of triallyl cyanurate (TAC), 2, 2,-azo (2,4-methylvaleronitrile) ("V-65" manufactured by Wako Pure Chemical Industries, Ltd.) 1.6 邛 / 谷 谷 谷 , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 One hour after the addition of the emulsion, the mixture was sampled and observed under a microscope to confirm that the polymerizable polychlorinated particles absorbed the monomer and was enlarged. Then, '8 parts of 20% aqueous solution of polyoxyethylene styrene phenyl ether sulfate ammonium salt and 20. 6 parts of deionized water were added to raise the temperature of the reaction liquid to 65 ° C under nitrogen atmosphere, and kept at 65 ° C 2 The radical polymerization of the monomer component was carried out in an hour. The emulsion obtained by radical polymerization was subjected to solid-liquid separation, and the obtained cake was washed with deionized water and decyl alcohol, and then vacuum-dried at i 2 Torr for 2 hours to obtain a polymer fine particle No. 1. Production Example 2 Polymer microparticles No. 2 was obtained in the same manner as in Production Example 1 except that the amount of the trially reacted cyanuric cyanurate was changed to 56. Production Example 3 A monomer fine particle was obtained in the same manner as in the production example except that 80 parts of triallyl cyanurate was changed to 56 parts of triallyl cyanurate (TAIC). 3. Production Example 4 With respect to the monomer component, 40 parts of triallyl cyanurate was changed to 40 parts of triallyl cyanurate and DVB960C manufactured by Nippon Steel Chemical Co., Ltd., and divinyl stupid was contained in 96% by mass. In the same manner as in Production Example 1, the polymer fine particles were obtained in the same manner as in Production Example 1. The production example 5 was changed to the trimeric cyanuric acid triene sulfonate in the monomer component. Part, styrene (the 〇 96 part and the dimercaptopropyl acid 38 201213347 hexanediol ester (16HX) 96 part of the combined fine particles N 〇. 5. Production Example 6 In the same manner as in Production Example 1, the polymerization was obtained. Polymeric poly; 5 oxime oxygenated particles into the four-necked flask from time to time, the formula k is more than 1800 deionized water, 25% ammonia, 9/1 plus feng shui 24, methanol 510, under stirring The formulation of 3_A, its T-based propylene oxypropyltrimethoxy oxime and decyl alcohol was changed to 3-methyl and propylene oxypropyltrimethoxy decane 80 and sterol 90 The polymerizable fine particle No. 6 was obtained in the same manner as in the case of the 〃 le 例 5 5 5 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The polymer was obtained in the same manner as in Production Example i except for the portion of the divinyl group 56. Particle No. 7. Production Example 8 The monomer component was changed to the styrene 120 portion of the triallyl cyanurate. Polymeric fine particles N〇. 8 were obtained in the same manner as in Production Example 1 except that the fluorene was partially di(methyl) acrylate or 6-hexanediol. The production example 9 methyl methacrylate (MMA) 90. The monomer mixture consisting of 90 parts of ternary methacrylate (TMPTMA) IO is suspended and polymerized 2 to obtain polymer microparticles N. 9. Production example 1 曱Methyl methacrylate The monomer mixture of 95 parts and 5 parts of ethylene glycol dimethacrylate was suspended and polymerized, and then fractionated to obtain polymer fine particles 39 201213347 Sub No. 10 Splitting Example 11 Isocyanuric isocyanurate (ΤΑIC) 15 parts and a monomer mixture composed of 35 parts of diisopropyl acetonate were suspended and polymerized, and then polymerized fine particles No. 11 were obtained by classification. Production Example 1 2 Four layers having a condenser tube, a thermometer, and a drip inlet The flask is filled with 720 parts of deionized water and 2% of 25% ammonia water. 480 parts of methanol were kept at 25 ° C. The bridged hard surface was dropped into the 6G part of the monomeric ethylene triacetate (KBM1GG3), and the internal temperature was kept at 25t for 15 knives. After the clock, add 32 parts of 20% aqueous solution of polyoxyethylene styrene phenyl ether sulfate ammonium salt ("High Ten〇r NF-08" manufactured by Daiichi Kogyo Co., Ltd.). Minute 'hydrolysis condensation reaction of ethylene triacetate calcination' to prepare an emulsion of a group of polychlorinated particles (polymeric polyoxo-fired particles) having an ethylene group. The emulsion of the polyoxyalkylene particles was sampled and the average particle size of the particle size was 2.25". Next, as the emulsification of the 丨 丨 取 ^ ^ 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一Ethylene vinyl ether bismuth sulphate - "High Tenor NF," manufactured by Pharmaceutical Co., Ltd.) 20% of the aqueous solution of 水溶液·〇 parts in 42 parts of deionized water. Then 960 (Nippon Steel Chemical Co., Ltd.) is added to the dissolution section. Polymerization starting agent 2 2, even s thin basic content 96 quality medicine industry company ^ ^ ^ double (8) dimethyl valeronitrile run light pure machine chemical industry company two:: solution 'to (four) quality mixed J table The monomer emulsion was transferred to the mother's minute 8 rpm. The monomer nipple was prepared for 5 minutes...the mixture was further stirred in the emulsion 40 201213347. The monomer latex was added for 1 hour. Then, the sampled reaction liquid was observed by a microscope to confirm that the specific polysiloxane particles absorbed the monomer composition and was enlarged. Next, the temperature was raised to 65 ° C in a nitrogen atmosphere, and radical polymerization was carried out by holding at 65 t: for 2 hours. After cooling the reaction solution, the obtained emulsion is solid-liquid separated, and the filter cake is deionized water and connected. After washing with decyl alcohol, heat treatment was carried out at 280 ° C for 1 hour under i 2 (drying at 2 hours' to obtain a polymer fine particle No. 1 2 . Production Example 13 was not subjected to a nitrogen atmosphere at 2 80. (: The polymer fine particles were obtained in the same manner as in Production Example 1 2 except that the heat treatment was performed for 1 hour. J 3 ^ Production Example 14 The formulation of the four-necked flask was changed to 68 parts of deionized water, In the same manner as in Production Example 2, the polymerized polyoxoxane particles were produced in the same manner as in Production Example 2, except that the ammonia water was used in the second portion and the methanol portion was changed to DVB 960 (Nippon Steel Chemical Co., Ltd. The monomer component was absorbed and the radical polymerization was carried out in the same manner as in Production Example 12 except that the content of the divinylbenzene (10) mass/〇2 was changed. After the reaction liquid was cooled, the obtained emulsion was subjected to solid-liquid separation. The filter cake was deionized water, followed by washing with methanol, and then dried at 12 Torr for 2 hours, and heat-treated at 350 ° C for 3 hours under a nitrogen atmosphere to obtain a polymer microparticle N 〇 14. Production Example 15 As an emulsifier, polyoxyethylene stupidated ethylene Acid and vinegar salt 41 201213347 (The first industrial pharmaceutical company, "υ· . Technology HighTenor (registered trademark) NF_08) 20% aqueous solution 1 part of the "^ < Long ion water 300 dissolved solution, added to dissolve two 50 parts of mercaptoacrylic acid 1,9-nonanyl alcohol ester, 50 parts of styrene, 2, 2,-azobis (2, 4-dimethyl valerate, hydrazine) (manufactured by Wako Pure Chemical Industries, Ltd.: "V -65") A solution of 2.0 parts, emulsifying and emulsifying the emulsion of the monomer component. The obtained emulsion was placed in a four-necked flask equipped with a condensation chelate, a ▲ meter, and a drip inlet, and diluted with 500 parts of deionized water. The reaction solution was heated to 65 ° C under a nitrogen atmosphere and kept at 65 C for 2 hours to carry out radical polymerization of the monomer component. The obtained emulsion was subjected to solid-liquid separation, and the mixture was washed with deuterated M deionized water and decyl alcohol, and then subjected to wet classification to obtain a polymer microparticle N. 15 by TC dry 焯. Production Example 16 Regarding the monomer component, a U 9 壬 壬 壬 二 与 与 与 与 与 50 50 50 50 50 50 50 X X X X X X X X X X X X X X The polymer fine particle No. 16 was obtained in the same manner as in the production example η 1 5 except for the first portion. Production Example 17 About the monomer component '1,9-nonanediol dimethacrylate 50 phenylene 50 In the same manner as in Production Example 15, the polymer microparticles were obtained in the same manner as in Production Example 15 except that the product was changed to DVB960 (manufactured by Nippon Steel Chemical Co., Ltd., divinylbenzene 3, 96 mass%). The 50 parts of the 1,9-nonanediol dimethacrylate and the 5G part of the ethylene group were changed to DVB57q (manufactured by Nippon Steel Chemical Co., Ltd., the basic content of diethyl ether was 57% by mass), and the other part was In the same manner as in Production Example 15, 5 μM fine particles N〇 were obtained. n 42 201213347 Production Example 1 9 Regarding the monomer component, 50 parts of 1,9-nonanediol methacrylate and phenylethyl group were used. The polymer microparticles N〇 were obtained in the same manner as in Production Example 15 except that 50 parts were changed to 25 parts of trimethylolpropane triacrylate and DVB960 (manufactured by Nippon Steel Chemical Co., Ltd., having a divinyl stear content of 96% by mass).丨9. Production Example 2 0 For the monomer component, 50 parts of 1,9-nonanediol dimercaptoacrylate and 50 parts of styrene were changed to 75 parts of trimethylolpropane triacrylate, DVB960 (New 曰The polymer fine particle No. 20 was obtained in the same manner as in Production Example 15 except that the content of the divinylbenzene was 96% by mass. The production example 21 gave 1,9-nonanediol dimercapto acrylate. 50 parts of the ester and 50 parts of styrene were changed to 50 parts of 1,6-hexanediol di(meth)acrylate, and 50 parts of DVB9 60 (manufactured by Nippon Steel Chemical Co., Ltd., divinylbenzene content: 96% by mass) The polymer fine particle No. 2:1 was obtained in the same manner as in Production Example 15. Production Example 22 The monomer component was changed to 50 parts of 1,9-nonanediol dimercaptoacrylate and 50 parts of styrene to dimethacrylic acid. 40 parts of ethylene glycol ester, 40 parts of styrene, and 20 parts of butyl methacrylate Example 1 5 The polymer fine particles N〇. 22 were obtained in the same manner. Production Example 23 The formulation in which a polymerized polysiloxane atom was placed in a four-necked flask was changed to 1 part of deionized water and 24 parts of 25% ammonia water. In the same manner as in Production Example 2, the polymerizable fine particles No. 23 were obtained in the same manner as in Production Example 2. Production Example 24 A formulation in which a polymerized polysiloxane atom was placed in a four-necked flask was changed to deionized water 750. The polymerizable fine particles No. 24 were obtained in the same manner as in Production Example 2 except that the portion was 25% aqueous ammonia and 2. 3. Production of Conductive Fine Particles After the polymer fine particles were etched with sodium hydroxide, they were sensitized with a dithigenated tin solution. Further, activation is carried out with a digastric palladium solution to form a palladium core. Next, the polymer fine particles forming the palladium core were immersed in an electroless nickel plating bath to form a nickel plating layer until the film became 0.1 μm, and then a gold substitution bond was applied to form a gold layer of 0.02//m. After washing with deionized water, it was replaced with alcohol and vacuum-dried to obtain conductive fine particles. 4. Production of an anisotropic conductive material 2 g of the conductive fine particles obtained above was mixed in an epoxy resin (manufactured by Mitsui Chemicals Co., Ltd.: "STRUCTBOND (registered) Trademark) XN_5A") 1〇〇g is dispersed to produce a conductive paste. With respect to the polymer fine particles No1 to 24 obtained above, the average particle diameter was measured, and the mechanical properties were evaluated. The results are shown in Table 3. Furthermore, in Tables i and 2, the evaluation of the breaking point load of the polymer microparticles N〇9~U, 13 is expressed as "unknown", even if the load is applied to 49fl]N (5gf), the damage point cannot be confirmed (4). The meaning. Further, the displacement-load curve of the polymer fine particles Ν〇·2, 5, 7, 8, 12, Μ is shown in Fig. 3. Further, the evaluation results of the anisotropic conductive material containing the conductive fine particles obtained above are collectively shown. 44 201213347 in Tables 1 to 3. [Table 1] c? 〇卜' OJ unknown 1 CT> 05 CO CD CM LO 1 1 CO 3757 1637 1008 Τ"Η CCNI Τ"* ο CO C<1 X ◦ o LO Bu CO Unknown 1 Η 〇 〇 1. 18 2· 16 4. 90 29751 17531 17495 25825 OJ ο 03⁄4 ο οα 〇Οϊ o 〇 (NJ o Unknown 1 0. 89 1. 96 5. 39 oo in o CO 21148 1 16190 24422 90562 <ΝΙ Ο OJ (ΝΙ 〇οο o 〇CO CO CO 00 LO (NI 卜 LO CO CO 〇ο CM C5 T—H 1—^ CO 6794 3800 3825 5577 (Γνί « _ι Ο 卜 eg X 卜 o 〇CO oo 〇·〇 〇〇LO ' Η 〇 2. 08 OJ CO 7. 86 1 0690 7779 1 8808 10404 (ΝΙ C3 »—« CO 〇ς〇LO 05 o CO 4. 69 but LO CO UO OO 〇 3.60 Destruction 1 21337 15434 1 7322 1 οα Τ~Η Ο CO cn 〇LO lo 00 C^I oo csi CO OO CO to LO CD 〇1.12 CO ,··< OJ 00 CO 8233 i 4880 5126 6765 CSJ Ο oo oo Oops LO oa CO CSI CD CO 〇ΙΛ 00 ο Csl CD 1-H CO CO CO 5. 98 8695 5830 6540 7621 CN3 1—^ Ο oo 〇 CO CO CN1 CN3 CO LO 卜 CO CO CO ο οο (Nl 2. 60 Destruction 9653 6201 6934 1 (ΝΙ Τ-Η Ο Bu 03⁄4 〇CM ο CO (=5 CO 4. 90 呀CO CO oo oo ο CO oo 3. 79 Destruction 9297 ”:6830 7694 1 CN1 C5 oo 〇T—^ S r—Η CO CD CO 1—Η CNI OO 寸 · CO CM oo o LO 1—^ CO CO Destruction 8286 5476 6056 1 οα 1—^ ο LO 05 〇 Conductive granules No. Specific monomer ratio (% by mass) Average particle size (//m), granules Variation coefficient of the diameter (%) Breaking point load (mN) Breaking compression displacement (%) 10% displacement 203⁄4 displacement 30% displacement 40% displacement 10% K 1 ! 20% Κ 30% Κ 40% Κ Metal layer film thickness (/ / m) Next resistance value (Ω) Indentation compression load value (mN) \ Substrate particle evaluation 45 201213347 [Table 2] Conductive fine particles No. 12 13 14 Substrate particles DVB960/KBM1003C mass ratio) 0. 7 0. 7 0. 4 Heat treatment temperature (°C) 280 - 350 Average particle size ("m) 2. 9 3. 0 2. 8 Particle size variation coefficient (%) 2. 8 2. 9 3. 0 Break point load (mN) 6. 53 Unknown 7. 60 Destructive compression displacement (%) 39. 5 - 41. 7 Compressed load value (mN) 10% displacement 1. 33 0. 76 1. 40 20% displacement 2. 80 1. 29 3. 10 30% displacement 5. 14 2. 12 5. 79 40% displacement damage 3. 22 7. 55 K value (N/mm2) 10%K 14544 8305 17554 20%Κ 10869 4939 13705 30°/〇Κ 10836 4434 13945 40°/〇Κ - 4368 11805 Evaluation of metal film thickness m) 0. 12 0 12 0. 12 Then the resistance value (Ω) 8. 7 13. 0 8. 5 Indentation 〇X 〇46 201213347 [Table 3]

Cvl 1 CO <>J Bu (M 3. 40 CO CO 1—^ oo o Bu 1—^ 3. 54 Destruction 10442 7795 8714 1 CNJ o LO Buddy CO οα 1 inch · 03 Τ~Η LT> 05呀 in 呀 oo o 2. 08 CO inch OJ oo 6235 4248 4963 6306 Cv3 〇> Ο Τ**Η 〇<ΝΙ <Nl c=> 05 r-1 OO OJ 5. 10 CO D- CO Oo 卜 o LO 3. 16 destruction 19967 13590 15467 I Cv3 o 05 OO 〇100 05 oo (N1 7. 16 LO LO oo o CO LO 1 - CD OJ CO 7. 06 21715 14031 1 5995 22462 Csl <=&gt CD OO 〇s 〇> o 1—^ mr^H OJ CO Bu Cvl CO LO CO but 05 o 1. 80 00 Bu co LO CM LO 1 36319 25549 29126 26244 (N1 —h 〇LO σ> 〇05 C5 <o ^ < LO o CO 3. 24 LO CO 呀<=> CO (N1 2. 00 3. 20 29793 ! 17325 15391 16024 OJ o LO OO 〇oo 卜 LO LO CNI oo OJ 卜co ς 〇CO 卜卜oo 2. 91 CNI LO 11752 7521 8502 9706 oa o σ> CO卜CO CT> LO (N1 c- CNI 5. 39 o CM CM oo oo o oo 2. 96 5. 18 ! 12495 7941 8646 9836 CNI C5 oo 〇CO 〇> 〇LO T~HT-H CO CS3 CO 03⁄4 o CO 00 o 00 卜 3. 43 CO LO CD 34 890 25225 26405 32635 <N1 〇LO CD 〇LO o LO LO 1—H CO ς〇f-< CNI CO in o 2. 58 5. 59 Destruction 41946 36452 43003 1 (N1 oo oo 〇 conductive microparticles No. Bridge agent ratio (3⁄4) Average particle size (ym) Particle size variation coefficient (%) Break point load (mN) Destruction compression displacement (%) 10% displacement 20% displacement 30% displacement 40% displacement 1-! 10 %K 20%K 30%K 40%K Metal layer film thickness (μ m) Next resistance value (Ω) Indentation compression load value (mN) Substrate particle evaluation 47 201213347 As shown in Table 3, in the substrate particles The conductive fine particles N?. 6, 12, 14, and 1 5 to 24' of the polymer fine particles having a breaking point load of 9.8 mN or less were used to obtain a very low connection resistance value. In contrast, in the case where the substrate particles are used, the conductive fine particles of the polymer fine particles having a breaking point load of more than 9.8 mN are used, and the conductive fine particles of the polymer fine particles which cannot clearly confirm the breaking point load are used for the substrate. Ν〇·9, 1〇, u, 13, the connection resistance value is high. Further, in the substrate particles, conductive microparticle ribs of 7, 10, ≤, 12, 14, and 15 to 24, which are polymer microparticles having a κ value of 735 〇N/mm 2 or more, are used as the object. An indentation was confirmed on the aluminum electrode. Further, when the conductive fine particles No. 2, 23, and 24 were compared, it was found that the smaller the average particle diameter, the lower the connection resistance value. [Industrial Applicability] The polymer fine particles of the present invention can be destroyed at a very low pressure of 9. W or less. When <' uses the polymer fine particles of the present invention as the conductive fine particles of the substrate particles, when the electrodes and the like are added together, the :::: force can be transmitted to the large connection area. The conductive fine particle-shaped conductive material of the present invention. Special film anisotropy conduction _ etc. _ [Simple diagram of the diagram] Fig. 1 shows the polymer microparticles. Fig. 2 shows the polymer microparticles. Fig. 3 shows the polymer microparticles.

No. 2, 7 displacement load curve. N〇. 5, 8 displacement load curve. (10)· 12, 13 displacement load 48 201213347 line. [Main component symbol description

Claims (1)

201213347 VII. Patent application scope: 1. A kind of polymer microparticles, characterized in that the load at the breaking point is 9.8 mN (l. 〇gf) or less. 2. For example, the polymer microparticles described in the scope of patent application 帛i are 10°/〇K ^^N/nnnHTSOkgf/mm^^gooON/m^csoookgf/ mm2) 〇3. If the application scope is i or 2 The average particle diameter of the polymer microparticles is 〇. 5/im~12v m. 4. The polymer microparticles according to claim 1 or 2, wherein the breaking compression displacement is 25% or more. 5. If you apply for a patent scope! Or the polymer microparticles according to item 2, wherein the compression load at 30% displacement is 丨.96 mN (〇. 2gf) or more. 6. If you apply for a patent scope! Or the polymer microparticles according to item 2, wherein the average particle diameter is 4 G.5#m to 12^m, and the deformation shrinkage is 25%", and the compression load at 30% displacement is 196mN (〇2gf) or more. A conductive microparticle having a conductive gold layer on the surface of the polymer microparticles according to claim 1 or 2, wherein the anisotropic conductive material is characterized by - The conductive fine particles described in claim 7 of the patent application. 50