TW201133687A - Substrate transfer apparatus, substrate transfer method and storage medium - Google Patents

Substrate transfer apparatus, substrate transfer method and storage medium Download PDF

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Publication number
TW201133687A
TW201133687A TW099142821A TW99142821A TW201133687A TW 201133687 A TW201133687 A TW 201133687A TW 099142821 A TW099142821 A TW 099142821A TW 99142821 A TW99142821 A TW 99142821A TW 201133687 A TW201133687 A TW 201133687A
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
holding
strain
transfer
Prior art date
Application number
TW099142821A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Douki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201133687A publication Critical patent/TW201133687A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW099142821A 2010-02-04 2010-12-08 Substrate transfer apparatus, substrate transfer method and storage medium TW201133687A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010023502A JP5083339B2 (ja) 2010-02-04 2010-02-04 基板搬送装置及び基板搬送方法並びに記憶媒体

Publications (1)

Publication Number Publication Date
TW201133687A true TW201133687A (en) 2011-10-01

Family

ID=44342330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099142821A TW201133687A (en) 2010-02-04 2010-12-08 Substrate transfer apparatus, substrate transfer method and storage medium

Country Status (5)

Country Link
US (1) US20110190927A1 (enExample)
JP (1) JP5083339B2 (enExample)
KR (1) KR20110090753A (enExample)
CN (1) CN102163571A (enExample)
TW (1) TW201133687A (enExample)

Cited By (1)

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TWI628733B (zh) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 基板搬送裝置及基板搬送機器人之教示方法

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JP5566669B2 (ja) * 2009-11-19 2014-08-06 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
JP5609856B2 (ja) * 2011-12-20 2014-10-22 株式会社安川電機 搬送ロボット
CN102569142B (zh) * 2012-02-03 2017-04-26 上海华虹宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
JP5884624B2 (ja) * 2012-05-02 2016-03-15 東京エレクトロン株式会社 基板処理装置、調整方法及び記憶媒体
KR102098596B1 (ko) * 2013-01-11 2020-04-09 삼성디스플레이 주식회사 기판 이송 장치 및 그 구동 방법
US9349643B2 (en) * 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
JP6190692B2 (ja) * 2013-10-22 2017-08-30 日本電産サンキョー株式会社 産業用ロボット
WO2016129102A1 (ja) * 2015-02-13 2016-08-18 川崎重工業株式会社 基板搬送ロボットおよびその運転方法
CA2981800C (en) * 2015-04-13 2023-09-26 Henrik Falk A lifting jig for lifting elements along the facade of a building
WO2017116709A1 (en) * 2015-12-30 2017-07-06 Mattson Technology, Inc. Substrate support in a millisecond anneal system
JP6671993B2 (ja) 2016-02-01 2020-03-25 東京エレクトロン株式会社 基板受け渡し位置の教示方法及び基板処理システム
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
US10115687B2 (en) * 2017-02-03 2018-10-30 Applied Materials, Inc. Method of pattern placement correction
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN106826927B (zh) * 2017-03-28 2019-09-13 芯导精密(北京)设备有限公司 一种半导体机械手机架
JP6789384B2 (ja) * 2017-04-06 2020-11-25 東京エレクトロン株式会社 基板処理装置および基板搬送方法
TWI622777B (zh) * 2017-07-07 2018-05-01 Electronic component picking test classification equipment
CN109273391B (zh) * 2017-07-17 2021-10-26 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
JP7064885B2 (ja) * 2018-01-05 2022-05-11 東京エレクトロン株式会社 基板把持機構、基板搬送装置及び基板処理システム
WO2020117201A1 (en) * 2018-12-03 2020-06-11 Lam Research Corporation Pin-lifter test substrate
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
JP7607395B2 (ja) * 2020-12-09 2024-12-27 川崎重工業株式会社 基板搬送ロボット
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법
KR102767876B1 (ko) * 2022-10-27 2025-02-19 세메스 주식회사 티칭 방법, 티칭 방법을 실행하는 매체에 저장된 프로그램 및 반송 시스템

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Publication number Priority date Publication date Assignee Title
TWI628733B (zh) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 基板搬送裝置及基板搬送機器人之教示方法

Also Published As

Publication number Publication date
CN102163571A (zh) 2011-08-24
KR20110090753A (ko) 2011-08-10
US20110190927A1 (en) 2011-08-04
JP5083339B2 (ja) 2012-11-28
JP2011161521A (ja) 2011-08-25

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