TW309502B - - Google Patents

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Publication number
TW309502B
TW309502B TW085106744A TW85106744A TW309502B TW 309502 B TW309502 B TW 309502B TW 085106744 A TW085106744 A TW 085106744A TW 85106744 A TW85106744 A TW 85106744A TW 309502 B TW309502 B TW 309502B
Authority
TW
Taiwan
Prior art keywords
substrate
heat treatment
transfer
supporting
support
Prior art date
Application number
TW085106744A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW309502B publication Critical patent/TW309502B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085106744A 1995-06-07 1996-06-05 TW309502B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7140653A JPH08335622A (ja) 1995-06-07 1995-06-07 基板搬送装置

Publications (1)

Publication Number Publication Date
TW309502B true TW309502B (enExample) 1997-07-01

Family

ID=15273656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085106744A TW309502B (enExample) 1995-06-07 1996-06-05

Country Status (6)

Country Link
US (1) US6032083A (enExample)
EP (1) EP0836225A1 (enExample)
JP (1) JPH08335622A (enExample)
KR (1) KR19990021969A (enExample)
TW (1) TW309502B (enExample)
WO (1) WO1996041371A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI894624B (zh) * 2022-10-17 2025-08-21 日商平田機工股份有限公司 機械手、基板搬送裝置、及保持單元

Families Citing this family (31)

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Publication number Priority date Publication date Assignee Title
TW319751B (enExample) * 1995-05-18 1997-11-11 Toshiba Co Ltd
JP3977485B2 (ja) * 1997-04-24 2007-09-19 東京エレクトロン株式会社 アームアクセス位置検出方法及び真空処理装置
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
US6405101B1 (en) 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
US6168066B1 (en) * 1999-04-21 2001-01-02 Lockheed Martin Corp. Friction stir conduction controller
JP4402811B2 (ja) * 2000-05-26 2010-01-20 東京エレクトロン株式会社 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法
JP2002062105A (ja) * 2000-08-23 2002-02-28 Sunx Ltd ヘッド分離型センサ、静電容量式センサ及びウエハ検出装置
US20040052631A1 (en) * 2002-09-13 2004-03-18 Chan Kun Yuan Mechanical arm device for carrying and detecting wafer
US7572092B2 (en) * 2002-10-07 2009-08-11 Brooks Automation, Inc. Substrate alignment system
JP4124449B2 (ja) * 2003-03-28 2008-07-23 大日本スクリーン製造株式会社 基板処理装置
US6944517B2 (en) 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
JP4255791B2 (ja) * 2003-09-22 2009-04-15 大日本スクリーン製造株式会社 基板処理装置
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
CN101223010A (zh) 2005-07-15 2008-07-16 株式会社安川电机 晶片位置示教方法及示教夹具装置
JP4993614B2 (ja) * 2008-02-29 2012-08-08 東京エレクトロン株式会社 搬送手段のティーチング方法、記憶媒体及び基板処理装置
JP5131094B2 (ja) 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体
JP5635270B2 (ja) * 2009-02-13 2014-12-03 株式会社日立国際電気 基板処理装置及び基板処理システム及び基板処理装置の表示方法及び基板処理装置のパラメータ設定方法及び記録媒体
US8238017B2 (en) 2009-12-18 2012-08-07 Alcatel Lucent Photonic match filter
JP6196870B2 (ja) * 2013-10-09 2017-09-13 株式会社ディスコ ウエーハの搬送装置
US9666465B2 (en) 2013-12-12 2017-05-30 Seagate Technology Llc Positioning apparatus
JP6468856B2 (ja) * 2015-01-20 2019-02-13 リンテック株式会社 移載装置
WO2020116510A1 (ja) * 2018-12-07 2020-06-11 川崎重工業株式会社 基板搬送装置及びその運転方法
KR102700312B1 (ko) 2018-12-11 2024-08-30 로제 가부시키가이샤 정전 용량 센서
CN110931409A (zh) * 2019-11-26 2020-03-27 武汉新芯集成电路制造有限公司 晶圆位置识别系统及方法
JP7565184B2 (ja) 2020-10-14 2024-10-10 東京エレクトロン株式会社 基板処理装置、状態判定方法及びコンピュータ記憶媒体
JP2022132087A (ja) * 2021-02-26 2022-09-07 東京エレクトロン株式会社 搬送システム、搬送装置及び搬送方法
JP7576500B2 (ja) 2021-03-29 2024-10-31 東京エレクトロン株式会社 基板搬送装置、状態判定方法及びコンピュータ記憶媒体
US20230143537A1 (en) * 2021-11-11 2023-05-11 Taiwan Semiconductor Manufacturing Company Limited Semiconductor processing tool and method of operation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5044752A (en) * 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices
JP3272481B2 (ja) * 1992-05-15 2002-04-08 東京エレクトロン株式会社 被処理物の移載装置の制御方法および移載方法
US5409348A (en) * 1992-05-15 1995-04-25 Tokyo Electron Limited Substrate transfer method
KR940006241A (ko) * 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
JPH06120321A (ja) * 1992-10-06 1994-04-28 Tokyo Electron Tohoku Ltd 基板ハンドリング装置
JPH06244268A (ja) * 1993-02-16 1994-09-02 Tokyo Electron Tohoku Ltd 移載装置
JP3319012B2 (ja) * 1993-03-09 2002-08-26 株式会社ダイヘン ウエハ搬送制御方法
KR100283851B1 (ko) * 1994-07-11 2001-04-02 기리야마 겐지 모니터 장치 및 모니터 방법
TW319751B (enExample) * 1995-05-18 1997-11-11 Toshiba Co Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI894624B (zh) * 2022-10-17 2025-08-21 日商平田機工股份有限公司 機械手、基板搬送裝置、及保持單元

Also Published As

Publication number Publication date
KR19990021969A (ko) 1999-03-25
EP0836225A1 (en) 1998-04-15
WO1996041371A1 (fr) 1996-12-19
US6032083A (en) 2000-02-29
JPH08335622A (ja) 1996-12-17

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