JP7352572B2 - 静電容量センサ - Google Patents
静電容量センサ Download PDFInfo
- Publication number
- JP7352572B2 JP7352572B2 JP2020559914A JP2020559914A JP7352572B2 JP 7352572 B2 JP7352572 B2 JP 7352572B2 JP 2020559914 A JP2020559914 A JP 2020559914A JP 2020559914 A JP2020559914 A JP 2020559914A JP 7352572 B2 JP7352572 B2 JP 7352572B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer transfer
- capacitance
- sensor
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/086—Proximity sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
- B25J15/0057—Gripping heads and other end effectors multiple gripper units or multiple end effectors mounted on a turret
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/027—Electromagnetic sensing devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R17/00—Measuring arrangements involving comparison with a reference value, e.g. bridge
- G01R17/10—AC or DC measuring bridges
- G01R17/16—AC or DC measuring bridges with discharge tubes or semiconductor devices in one or more arms of the bridge, e.g. voltmeter using a difference amplifier
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0023—Measuring currents or voltages from sources with high internal resistance by means of measuring circuits with high input impedance, e.g. OP-amplifiers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/22—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using conversion of ac into dc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Description
1a、1a´ 検出部
1b、1b´ アンプモジュール
2 ウエハ搬送ロボット
2a 基台
2b 昇降旋回部
3 ウエハ搬送装置
4 ウエハ搬送処理装置
5 ロードポート
6 X軸テーブル
6a 移動部
7 FOUP(Front-Opening Unified Pod)
8 フレーム
9 カバー
11 内部空間
12 FFU
12a ファン
12b フィルタ
13 除電装置
14、15 アーム体
14a、15a 第1アーム
14b、15b 第2アーム
16、17 ウエハバンド
18、18´ フィンガ
18a 上側の板状部材
18b 下側の板状部材
18c 吸着スペーサ
18d 支持スペーサ
18e 基準面
18a、18b 板状部材
19 流路
21、22 孔
23 保護膜
24 第1のガード電極層
24a 第1のガード電極
24b、25b、26b 回路パターン
25 センサ電極層
25a センサ電極
26 第2のガード電極層
26a 第2のガード電極
27 シールドアース層
28 演算増幅器
29 交流供給源
30 第1のBPF
31 第2のBPF
32 キャパシタ
33 寄生容量補償回路
34 差動アンプ
35 位相検波手段
36 LPF(Low-Pass Filter)
37 出力端子
W ウエハ
Claims (3)
- 検出部と被検出体との間の距離を測定する静電容量センサであって、前記検出部に交流電圧を供給する交流供給源と、寄生容量補償回路と、演算増幅器と、差動アンプと、位相検波手段と、ローパスフィルタと、を備え、
前記演算増幅器の出力端子は第1のバンドパスフィルタを介して前記差動アンプの反転入力端子に接続され、前記交流供給源は第2のバンドパスフィルタを介して前記差動アンプの非反転入力端子に接続され、前記差動アンプの出力端子は前記位相検波手段の入力端子に接続され、前記位相検波手段は、前記交流供給源から出力される交流信号を参照信号としていることを特徴とする、静電容量センサ。 - 前記検出部は、半導体ウエハを所定の位置まで搬送するウエハ搬送ロボットのウエハハンドに備えられていることを特徴とする請求項1に記載の静電容量センサ。
- 前記ウエハ搬送ロボットはウエハ搬送装置の内部空間に設置され、
前記ウエハ搬送装置は、少なくとも、
前記内部空間を清浄な状態に維持するFFUと、前記半導体ウエハを収納する収納容器を載置して、前記収納容器の蓋を開閉するロードポートと、前記ウエハ搬送装置の天井付近に設置され前記内部空間を除電する除電装置とを備え、
前記交流供給源から出力される搬送波の周波数は、前記除電装置のエミッタに印加される電源の周波数よりも高い周波数であることを特徴とする請求項2に記載の静電容量センサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018231906 | 2018-12-11 | ||
JP2018231906 | 2018-12-11 | ||
PCT/JP2019/045737 WO2020121778A1 (ja) | 2018-12-11 | 2019-11-22 | 静電容量センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020121778A1 JPWO2020121778A1 (ja) | 2021-10-28 |
JP7352572B2 true JP7352572B2 (ja) | 2023-09-28 |
Family
ID=71076907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020559914A Active JP7352572B2 (ja) | 2018-12-11 | 2019-11-22 | 静電容量センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US11688617B2 (ja) |
EP (1) | EP3896385B1 (ja) |
JP (1) | JP7352572B2 (ja) |
KR (1) | KR102700312B1 (ja) |
CN (1) | CN113167564B (ja) |
TW (1) | TWI826609B (ja) |
WO (1) | WO2020121778A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202238803A (zh) * | 2021-02-26 | 2022-10-01 | 日商東京威力科創股份有限公司 | 搬運系統、搬運裝置及搬運方法 |
JP2022152691A (ja) * | 2021-03-29 | 2022-10-12 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送位置調整方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001132747A (ja) | 1999-08-25 | 2001-05-18 | Ebara Corp | 磁気軸受装置 |
JP2006084318A (ja) | 2004-09-16 | 2006-03-30 | Oki Electric Ind Co Ltd | 静電容量型距離センサ |
JP2011153581A (ja) | 2010-01-27 | 2011-08-11 | Isuzu Motors Ltd | Pm検出装置 |
US20130106779A1 (en) | 2011-10-31 | 2013-05-02 | Analog Devices, Inc. | Noise compensation techniques for capacitive touch screen systems |
DE102013204494A1 (de) | 2013-03-14 | 2014-10-02 | Carl Zeiss Smt Gmbh | Positionssensor, sensoranordnung und lithographieanlage mit positionssensor |
US20170351897A1 (en) | 2014-11-25 | 2017-12-07 | Cypress Semiconductor Corporation | Methods and Sensors for MultiPhase Scanning in the Fingerprint and Touch Applications |
JP2018500146A (ja) | 2014-12-19 | 2018-01-11 | ティ・オ・ドォッブルビィ・エンジニアリング・アー/エス | チョッパ変調を用いる閉ループ・ユニットゲイン・アンプを有するアクティブ電極 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4958129A (en) * | 1989-03-07 | 1990-09-18 | Ade Corporation | Prealigner probe |
JPH0797009B2 (ja) * | 1989-12-29 | 1995-10-18 | 株式会社荏原製作所 | インダクタンス形変位センサ |
JPH08335622A (ja) | 1995-06-07 | 1996-12-17 | Tokyo Electron Ltd | 基板搬送装置 |
JP4413562B2 (ja) * | 2003-09-05 | 2010-02-10 | 東京エレクトロン株式会社 | 処理システム及び処理方法 |
US7256588B2 (en) * | 2004-04-16 | 2007-08-14 | General Electric Company | Capacitive sensor and method for non-contacting gap and dielectric medium measurement |
JP2009519181A (ja) * | 2005-12-13 | 2009-05-14 | ティーケー ホールディングズ インコーポレーテッド エレクトロニクス | 信号処理システムおよび方法 |
US8446158B1 (en) * | 2007-11-09 | 2013-05-21 | Cypress Semiconductor Corporation | Compensation for parasitic capacitance of a capacitive sensor |
KR101677752B1 (ko) * | 2008-06-13 | 2016-11-18 | 코닌클리케 필립스 엔.브이. | 용량성 근접 디바이스 및 용량성 근접 디바이스를 포함하는 전자 디바이스 |
JP2010140975A (ja) * | 2008-12-10 | 2010-06-24 | Panasonic Corp | 基板除電装置および基板除電方法 |
CN102072737B (zh) * | 2009-11-25 | 2012-07-04 | 中国科学院电子学研究所 | 一种带温度补偿的高精度电容读出电路 |
US8638109B2 (en) * | 2009-12-31 | 2014-01-28 | Mapper Lithography Ip B.V. | Capacitive sensing system with differential pairs |
KR20110112128A (ko) * | 2010-04-06 | 2011-10-12 | 삼성전자주식회사 | 터치 패널의 기생 커패시턴스 보상 방법 및 장치 |
CN102110588B (zh) * | 2010-12-31 | 2012-08-01 | 北京七星华创电子股份有限公司 | 半导体晶圆传递及工艺前预处理设备 |
JP6559976B2 (ja) * | 2015-03-03 | 2019-08-14 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板処理システム |
JP6545519B2 (ja) * | 2015-04-27 | 2019-07-17 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板検出方法 |
NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
CN108562217B (zh) * | 2018-06-05 | 2020-07-10 | 华中科技大学 | 一种实时优化信噪比的电容位移传感器 |
US10847393B2 (en) * | 2018-09-04 | 2020-11-24 | Applied Materials, Inc. | Method and apparatus for measuring process kit centering |
-
2019
- 2019-11-22 CN CN201980081887.2A patent/CN113167564B/zh active Active
- 2019-11-22 EP EP19895439.8A patent/EP3896385B1/en active Active
- 2019-11-22 JP JP2020559914A patent/JP7352572B2/ja active Active
- 2019-11-22 WO PCT/JP2019/045737 patent/WO2020121778A1/ja unknown
- 2019-11-22 KR KR1020217014816A patent/KR102700312B1/ko active IP Right Grant
- 2019-11-22 US US17/299,840 patent/US11688617B2/en active Active
- 2019-12-10 TW TW108145046A patent/TWI826609B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001132747A (ja) | 1999-08-25 | 2001-05-18 | Ebara Corp | 磁気軸受装置 |
JP2006084318A (ja) | 2004-09-16 | 2006-03-30 | Oki Electric Ind Co Ltd | 静電容量型距離センサ |
JP2011153581A (ja) | 2010-01-27 | 2011-08-11 | Isuzu Motors Ltd | Pm検出装置 |
US20130106779A1 (en) | 2011-10-31 | 2013-05-02 | Analog Devices, Inc. | Noise compensation techniques for capacitive touch screen systems |
DE102013204494A1 (de) | 2013-03-14 | 2014-10-02 | Carl Zeiss Smt Gmbh | Positionssensor, sensoranordnung und lithographieanlage mit positionssensor |
US20170351897A1 (en) | 2014-11-25 | 2017-12-07 | Cypress Semiconductor Corporation | Methods and Sensors for MultiPhase Scanning in the Fingerprint and Touch Applications |
JP2018500146A (ja) | 2014-12-19 | 2018-01-11 | ティ・オ・ドォッブルビィ・エンジニアリング・アー/エス | チョッパ変調を用いる閉ループ・ユニットゲイン・アンプを有するアクティブ電極 |
Also Published As
Publication number | Publication date |
---|---|
WO2020121778A1 (ja) | 2020-06-18 |
EP3896385C0 (en) | 2024-01-17 |
EP3896385B1 (en) | 2024-01-17 |
EP3896385A4 (en) | 2022-03-16 |
JPWO2020121778A1 (ja) | 2021-10-28 |
KR102700312B1 (ko) | 2024-08-30 |
CN113167564A (zh) | 2021-07-23 |
CN113167564B (zh) | 2023-06-27 |
KR20210101208A (ko) | 2021-08-18 |
TW202108971A (zh) | 2021-03-01 |
TWI826609B (zh) | 2023-12-21 |
US11688617B2 (en) | 2023-06-27 |
US20220037177A1 (en) | 2022-02-03 |
EP3896385A1 (en) | 2021-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7352572B2 (ja) | 静電容量センサ | |
KR100674624B1 (ko) | 센서기판, 기판처리방법 및 기판처리장치 | |
JP4447631B2 (ja) | 位置検出用治具 | |
JP4562762B2 (ja) | 静電容量型センサ及びその製造方法 | |
WO2007061047A1 (ja) | ウェハレベルパッケージ構造体およびその製造方法 | |
JP2009054993A (ja) | 位置検出用治具 | |
US10627206B2 (en) | Sensor module for detecting a process environment in semiconductor equipment, a semiconductor manufacturing apparatus, and a method of manufacturing a semiconductor device | |
JP2012064702A (ja) | ダイボンダ及び半導体製造方法 | |
JP3948325B2 (ja) | フィルム基板処理方法 | |
JP6474275B2 (ja) | 加工装置 | |
JP5913876B2 (ja) | ダイボンダ | |
JP3005426B2 (ja) | 半導体ウェハ電気的測定装置 | |
JPH05343507A (ja) | 静電吸着方法 | |
JP7281885B2 (ja) | 静電チャック装置およびその制御方法 | |
JP2015026700A (ja) | センサ一体型吸着チャック及び処理装置 | |
TW202017084A (zh) | 製程裝置 | |
TW202339088A (zh) | 測定器 | |
JP2005123373A (ja) | 基板搬送用トレイ、基板搬送装置および電子部品実装装置 | |
JP2008147241A (ja) | ロボットハンド及びウェーハハンドリング装置 | |
JP2012134359A (ja) | 吸着部材、ピックアップ装置およびピックアップ方法 | |
JP2011192810A (ja) | コレット、半導体チップ搭載装置、半導体チップ搭載方法 | |
JP6570386B2 (ja) | 製造装置 | |
JP4393782B2 (ja) | 静電浮上型ジャイロ装置 | |
JP2022046096A (ja) | 実行装置及び実行方法 | |
JP2019179939A (ja) | 製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20210517 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220929 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230711 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230807 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230912 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230915 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7352572 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |