JPWO2020121778A1 - 静電容量センサ - Google Patents
静電容量センサ Download PDFInfo
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- JPWO2020121778A1 JPWO2020121778A1 JP2020559914A JP2020559914A JPWO2020121778A1 JP WO2020121778 A1 JPWO2020121778 A1 JP WO2020121778A1 JP 2020559914 A JP2020559914 A JP 2020559914A JP 2020559914 A JP2020559914 A JP 2020559914A JP WO2020121778 A1 JPWO2020121778 A1 JP WO2020121778A1
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- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R19/22—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using conversion of ac into dc
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Human Computer Interaction (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
1a、1a´ 検出部
1b、1b´ アンプモジュール
2 ウエハ搬送ロボット
2a 基台
2b 昇降旋回部
3 ウエハ搬送装置
4 ウエハ搬送処理装置
5 ロードポート
6 X軸テーブル
6a 移動部
7 FOUP(Front−Opening Unified Pod)
8 フレーム
9 カバー
11 内部空間
12 FFU
12a ファン
12b フィルタ
13 除電装置
14、15 アーム体
14a、15a 第1アーム
14b、15b 第2アーム
16、17 ウエハバンド
18、18´ フィンガ
18a 上側の板状部材
18b 下側の板状部材
18c 吸着スペーサ
18d 支持スペーサ
18e 基準面
18a、18b 板状部材
19 流路
21、22 孔
23 保護膜
24 第1のガード電極層
24a 第1のガード電極
24b、25b、26b 回路パターン
25 センサ電極層
25a センサ電極
26 第2のガード電極層
26a 第2のガード電極
27 シールドアース層
28 演算増幅器
29 交流供給源
30 第1のBPF
31 第2のBPF
32 キャパシタ
33 寄生容量補償回路
34 差動アンプ
35 位相検波手段
36 LPF(Low−Pass Filter)
37 出力端子
W ウエハ
Claims (3)
- 検出部と被検出体との間の距離を測定する静電容量センサであって、前記検出部に交流電圧を供給する交流供給源と、寄生容量補償回路と、演算増幅器と、差動アンプと、位相検波手段と、ローパスフィルタと、を備え、
前記演算増幅出力端子は第1のバンドパスフィルタを介して前記差動アンプの反転入力端子に接続され、前記交流供給源は第2のバンドパスフィルタを介して前記差動アンプの非反転入力端子に接続され、前記差動アンプの出力端子は前記位相検波手段の入力端子に接続され、前記位相検波手段は、前記交流供給源から出力される交流信号を参照信号としていることを特徴とする、静電容量センサ。 - 前記検出部は、半導体ウエハを所定の位置まで搬送するウエハ搬送ロボットのウエハハンドに備えられていることを特徴とする請求項1に記載の静電容量センサ。
- 前記ウエハ搬送ロボットはウエハ搬送装置の内部空間に設置され、
前記ウエハ搬送装置は、少なくとも、
前記内部空間を清浄な状態に維持するFFUと、前記半導体ウエハを収納する収納容器を載置して、前記収納容器の蓋を開閉するロードポートと、前記ウエハ搬送装置の天井付近に設置され前記内部空間を除電する除電装置とを備え、
前記交流供給源から出力される搬送波の周波数は、前記除電装置のエミッタに印加される電源の周波数よりも高い周波数であることを特徴とする請求項2に記載の静電容量センサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018231906 | 2018-12-11 | ||
JP2018231906 | 2018-12-11 | ||
PCT/JP2019/045737 WO2020121778A1 (ja) | 2018-12-11 | 2019-11-22 | 静電容量センサ |
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JPWO2020121778A1 true JPWO2020121778A1 (ja) | 2021-10-28 |
JP7352572B2 JP7352572B2 (ja) | 2023-09-28 |
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US (1) | US11688617B2 (ja) |
EP (1) | EP3896385B1 (ja) |
JP (1) | JP7352572B2 (ja) |
KR (1) | KR20210101208A (ja) |
CN (1) | CN113167564B (ja) |
TW (1) | TWI826609B (ja) |
WO (1) | WO2020121778A1 (ja) |
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TW202238803A (zh) * | 2021-02-26 | 2022-10-01 | 日商東京威力科創股份有限公司 | 搬運系統、搬運裝置及搬運方法 |
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US11688617B2 (en) | 2023-06-27 |
US20220037177A1 (en) | 2022-02-03 |
EP3896385C0 (en) | 2024-01-17 |
TWI826609B (zh) | 2023-12-21 |
WO2020121778A1 (ja) | 2020-06-18 |
EP3896385A1 (en) | 2021-10-20 |
EP3896385B1 (en) | 2024-01-17 |
CN113167564A (zh) | 2021-07-23 |
TW202108971A (zh) | 2021-03-01 |
JP7352572B2 (ja) | 2023-09-28 |
CN113167564B (zh) | 2023-06-27 |
KR20210101208A (ko) | 2021-08-18 |
EP3896385A4 (en) | 2022-03-16 |
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