TW201113389A - Method of coating substrate - Google Patents

Method of coating substrate Download PDF

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Publication number
TW201113389A
TW201113389A TW099133856A TW99133856A TW201113389A TW 201113389 A TW201113389 A TW 201113389A TW 099133856 A TW099133856 A TW 099133856A TW 99133856 A TW99133856 A TW 99133856A TW 201113389 A TW201113389 A TW 201113389A
Authority
TW
Taiwan
Prior art keywords
layer
substrate
zinc oxide
glass
plasma
Prior art date
Application number
TW099133856A
Other languages
English (en)
Inventor
Daniel Borrello
Evelyne Vallat-Sauvain
Jerome Steinhauser
Ulrich Kroll
Johannes Meier
Original Assignee
Oerlikon Solar Ip Ag Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Solar Ip Ag Truebbach filed Critical Oerlikon Solar Ip Ag Truebbach
Publication of TW201113389A publication Critical patent/TW201113389A/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0227Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/407Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/022466Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
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    • H01L31/022466Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
    • H01L31/022483Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
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    • H01L31/0236Special surface textures
    • H01L31/02366Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
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    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884Manufacture of transparent electrodes, e.g. TCO, ITO
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02E10/545Microcrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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    • Y02E10/548Amorphous silicon PV cells

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201113389 六、發明說明: 【發明所屬之技術領域】 本發明係關於薄膜塗層之領域。特定言之,本發明係關於在基 材上塗覆氧化鋅膜,其係特別用於製造太陽能電池及/或太陽能面 板之目的。 【先前技術】 光伏打裝置(photovoltaic devices)或太陽能電池係為能將光(特 別是曰光)轉換成直流(DC)電能之裝置。針對低成本、大規模 之生產而言,薄膜太陽能電池之益處在於其可使用玻璃、玻璃陶 究、或其他剛性或可撓性基材來取代矽晶或多晶矽,以作為基礎 材料或基材。至今,已有多種可自市面上購得之太陽能電池技術。 在低溫下且大規模地處理此種電池之可行性乃為此種技術之主要 優點。 太~此電池之結構(即,層序列(layer sequence))為掌控或 促成光伏打效應之要素。該等層可各別藉由習知之真空沉積技術 (例如物理氣相沉積(PVD)、化學氣相沉積(CVD)、電漿辅 助化學氣相沉積(PECVD)、常壓化學氣相沉積(APCVD),上 述技術皆可用於半導體技術中)來塗覆或沉積成薄層。 傳統之薄膜太陽能電池通常係包含一沉積在基材上之透明電極 層(亦稱為前電極(front electrode))。在此第一電極層之頂端 上通常係沉積有一由薄的非晶質矽膜及/或薄的微晶矽膜所形成之 ♦费 .十 将換平導體層(photoelectric conversion semiconductor ayer) 以及一背電極層(back electrode layer)。該背電極可再 201113389 包含一透明導電層、一反射體層、及一導電併反射之金屬層或與 其技術相當者。 詳言之,第1圖(習知技術)所示為一基本、簡單的光伏打電 池10,包含一透明基材12,其上沉積有一透明導電氧化物 (transparent conductive oxide ’ TCO ) 14。此層亦稱為前觸點(fr〇nt contact)且係作為該光伏打元件之第一電極。基村12與前觸點14 之結合亦稱為覆層(superstrate)。其下之層16係作為活性光伏 打層(active photovoltaic layer)並呈現出三層形成p-i-n接面 (junction)的「次層」。該層16係包含氫化之微晶矽、奈米晶 矽、非晶質矽或前述之組合。次層18 (鄰接TC0前觸點14)為 正電性摻雜(positively doped ),鄰接之次層20為本質性的 (intrinsic ),而最後之次層22為負電性摻雜(negativeiy doped )。 在另一實施態樣中’如上所述之層序列ρ·ί_η可反轉成n_i_p。此 時’層16即為負電性摻雜層(n層),層20 —樣為本質性的,而 層22則為正電性摻雜層(ρ層)。 最後,該電池含有一後觸點(rear contact)層24 (亦稱為背觸 點)。此外,再提供一反射層26。或者,可具有一金屬背觸點 (metallic back contact),其可結合背反射體26與背觸點%之物 理特性。為達例示之目的’箭頭代表照射光。 一般所知,當光(例如太陽輻射)照射在光電裝置(如太陽能 電池)上時,會在i層中生成電子電洞對(eleetrGn_hGle ρ—)。 所生成對中之電洞會朝ρ區域移動,而電子會朝η區域移動。觸 點通常係直接或間接地接觸ρ區域及η區域。只要光持續產生電 子電洞對,電流就會流過與該等觸點所連接之外部電路。 201113389 , · · · 透明導電(transparent conducting’ TC)層(如前述用作層14 及/或層24者)為結合可見光範圍之光學穿透性及導電性的薄膜材 料,其適合用在光電應用。 已有多種應用係使用到透明導電層,例如平面顯示器之除霜窗 或透明電極及太陽能電池。在這些應用中,通常會要求將其透明 導電層之電導度(conductance )及穿透率(transmittance )最大化。 有多種程序可製造透明導電層。其中最常用的技術有:濺鑛 (PVD)、化學氣相沉積(CVD)、脈衝雷射沉積、喷霧熱解及 蘸濕(wet dip)沉積。該等程序係採用不同材料來作為基材,例 如玻璃、塑膠薄片等。該等材料可為可撓性或剛性。 為提升光伏打裝置之電轉換效能’應盡量使活性妙層中吸收儘 可能多的照射光。 透明導電材料之特性或與南穿透率結合之高導電率通常係難以 同時實現’原因在於在可見光範圍内之光學透明度通常係需要能 帶間隙(bandgap)大於3.3電子伏特之材料,然而,此種大能帶 間隙之材料使載體推雜難以實現’因此難以達到高導電率。 除此基本限制外,通常,製作過程會於層中誘發缺陷,此亦限 制透明度及導電率。此缺陷為例如孔隙、晶界(grain b〇undary) 及雜質汙染。 美國專利第6,420,644 B1號揭露一種具有—板之太陽能電池, 該板係具有一表面且具有複數個自板表面外突而出之球截形 (spherical segments)。為界定出該複數個球截形,可在板表面上 進行壓印。其中,可在板之頂端提供一由路所製成之第一電極。 美國專利第US 2005/0022860 A1號揭露—種薄膜光伏打模組。 201113389 其中,為挺升此模組之利用性,係在基材上提供複數個實質上呈 半球狀之突起物。在基材為金屬基材之情況下,該突起物係藉由 壓印金屬基材形成。而在提供塑膠基材之情況下,該突起物可藉 由射出成型形成。 【發明内容】 本發明之一目的在於提供一種塗覆基材之方法,其克服上述缺 陷中之至少一者。 本發明之另一目的在於提供一種塗覆基材之方法,其可用來形 成太陽能電池,使該太陽能電池效能提升。 此目的可藉由如請求項Γ之方法實現。此目的更可藉由如請求 項9之太陽能電池實現。附屬項係列出多種有利之實施態樣。 【實施方式】 本發明係關於一種在基材上塗覆氧化辞膜之方法,該方法係包 含_以下步驟: 费 -提供一具有至少一實質上平坦表面之基材; c -將至少部分之該表面進行一電漿蝕刻程序; -在該經#刻之表面上沉積一層,該層係包含氧化鋅。 由於電漿蝕刻程序,故可在基材上具有一經結構化之表面。其 可為形成太陽能電池或太陽能模組之基礎。詳言之,該經結構化 之基材可用來形成一薄膜太陽能電池。 相較於在平坦基材上沉積透明導電層,本發明係將基材蝕刻以 獲得一清楚的形貌,此同時會提升透明導電層之電導度而改變該 201113389 等透明導電層之成長。 因此,一平坦(或實質上平坦)之表面應係指未進行導入清楚 結構之處理的表面。詳言之,係未藉由如壓印或鑄模之方式導入 凹槽(deepenings)或突起物。 藉由使用電漿蝕刻程序,可在表面上獲得十分清楚之結構。此 可提供具有十分明確特性之經結構化的表面。詳言之,由於該基 材之結構化表面之作用,自基材傳送至活性層的光(特別是日光) 會被散射。此會提升活性相中光之吸收度,並藉此提升包含此經 結構化之基材之太陽能電池的效能。 令人驚訝地,經本案發明人發現,將基材之表面以電漿蝕刻程 序結構化,並隨後塗覆一氧化辞層,以此與基材結合可提升該氧 化辞層之導電率。不受特定理論限制下,假設此結果係藉由上述 特徵之有利協同效應所實現的。特定言之,根據本發明可實現絕 佳透明度及提升導電率之組合。 因此,由於採用電漿蝕刻程序及同時使用氧化鋅塗層之特殊組 合與其協同效應,透明度以及特別是在導電率上有所提升,故根 據本發明塗覆之基材係非常適合作為製造太陽能電池之基礎。 在本發明一較佳實施態樣中係使用玻璃基材。玻璃基材具有較 佳之特性,其可達到一有效的、十分明確的蝕刻程序(特別在使 用電漿蝕刻程序時)。特定言之,藉由使用玻璃基材,基材之表面 可藉由利用平滑蝕刻條件,以所欲且十分明確之方式進行結構化。 玻璃基材可為技藝人士所習知之任何適合用來製造薄膜裝置的 201113389 玻璃基材。本發明之薄膜層可藉由技藝人士所知之各種沉積技術 來進行沉積。 在本發明的另一較佳實施態樣中係使用-六氟化硫(· hex-odde ’ SF6)與氧(〇2) *例為%之混合物的電衆^ 合物可提供-可在基材表面上產生十分清楚的結構或形貌之電 紫。詳言之,尤其在結合玻璃基材之情況下,此氣體混合物因採 用六氟化硫作為蝕刻氣體而具有優勢。 在本發明之另-較佳實施態樣中,在電聚钱刻程序中所使用之 功率為丨瓦/平方公分。此功率係相當低的,得以實現節能反應條 件。然而,使用如上述定義讀刻功率仍可產生反應錄刻氣體 或钮刻電漿以實現有效關料’俾使在更理想之條件下進行該 程序。 在本發明之另-較佳實施態樣中,在餘刻程序期間所使用之壓 力為30毫托。此壓力可在電漿姓刻基枓時實現特別順利且有效的 反應條件。特定言之,此壓力對_破縣材係較佳的。 Λ 在本發明之另—較佳實施態樣中,刻時間係持續3 0分鐘。對 於結構化基材表面,即使對工業製程而言,特別是對製造太陽能 電池或太陽能模組而言,此段時間係合理的。然而,此時間仍可 適合用來實現基材表面所要求之蝕刻程度或形貌。 在本發明之另一較佳實施態樣中,氧化鋅係藉由低壓氣相沉積 (low pressure vapour deposition,LPCVD)沉積。此程序對在基 材上塗覆尤其是氧化鋅而言係較佳的。此塗覆程序可提供高純度 201113389 且同時呈薄膜形式(即具有非常薄之厚度)之氧化鋅膜。此外, 由於氧化辞係用作為透明導電氧化層,因此除上述導電性之外, 使透明度達到所要求之值亦為相當重要的。此可藉由使用氧化鋅 之低壓氣相沉積來實現。 然而,根據本發明,其他塗覆技術亦為可行的,特別是化學氣 相沉積(CVD)或如真空濺鍍程序之物理氣相沉積(PVD)。更佳 地,該氣相沉積程序為電漿輔助化學氣相沉積(plasma enhanced CVD,PEC VD)及 /或常壓化學氣相沉積(atmospheric pressure CVD,APCVD)。 在本發明之另一較佳實施態樣中,氧化辞係摻雜有硼。塗覆該 具有經塗覆之氧化鋅的基材可進一步提升導電性。此外,藉由該 摻雜程序,係可尤其將氧化鋅層之電子特性調整至所要求之應 用,特別是針對太陽能電池或太陽能模組之應用。 本發明更關於一太陽能電池,其包含一根據本發明方法塗覆有 氧化辞之基材。特定言之,藉由在太陽能電池中提供經本發明塗 覆之基材,可實現之協同效應係有利的。詳言之,該氧化鋅層可 用作為透明導電氧化層。關於此,導電率及透明度業經提升之氧 化鋅層係特別佳的。特定言之,本發明係提升太陽能電池中之氧 化鋅層的導電率。此可使本發明之光伏打電池、或太陽能電池及 太陽能模組之效能提升。 因此,本發明之方法可有利地實現一容易但極為有效的方法, 以增加製造薄膜裝置時(較佳係在製造太陽能電池時)之效能、 產率及產量。 201113389 在本發明之一較佳實施態樣中,氡化鋅塗層之導電度為14.5歐 姆-平方(Ohm-square)或更低。根據本發明,該等數值可容易地 實現。此特徵可提供包含一導電率經特別提升,且因而特別有效 率之透明導電氧化層的太陽能電池。 如技藝人士所明瞭,本發明方法之較佳實施態樣可自前述本發 明之創新方法的詳細說明中推導而得。然而,下文將明確揭露本 發明方法之更佳的實施態樣。 參照於下文中所述之實施態樣以說明並闡述本發明彼等及其他 之方面。 第2a圖所示為一習知技術之塗覆有氧化辞之玻璃基材的橫截面 掃描式電子顯微影像。可發現該基材之表面為平坦,此表示其不 具任何突起物或凹槽。詳言之,該表面係未藉由如麼印或鑄造之 方式進行過表面修飾。在該平坦表面上沉積有一氧化鋅(ZnO )層。 與上述相反,第2b圖所示為本發明之塗覆有氧化鋅之玻璃基材 的橫截面掃描式電子顯微影像。沉積在該玻璃基材上之氧化辞層 的上部分較沉積在平坦玻璃上之層(第2a圖)呈現較大之晶粒。 該等較大晶粒可說明此基材上之氧化辞層之增加的電導度。事實 上’大晶粒之材料較小晶粒之材料展現較尚的導電率。再者’大 晶粒減少光學穿透性之損失。 在基材與透明材料間存在一粗糖界面時將使光漫射 (diffusion),該界面係藉由本發明之電漿蝕刻程序所獲得。在太 陽能電池應用中,此光漫射為所欲的,以捕捉光進入電池之活化 層中。再者,此粗糖界面亦減少照入光於玻璃表面與氧化辞層間 之界面上之反射,使透明度增加。 201113389 ' · · 該等結果顯示本發明之基材表面形貌的修飾影響了氧化鋅層的 成長且明顯增加其電導度、均質性及透明性。 實施本發明之方法所實現之效果、以及玻璃基材表面之形貌對 二種類型之氧化鋅層(沉積在基材表面上)之導電率的影響係詳 示於第3圖及第4圖中。 詳言之,係實施以下本發明之實施例。 在所有實驗中,係於一反應離子蝕刻機(RIE)中,以氧(〇2) 與六氟化硫(SFe)混合之電漿對Schott Borofloat 33玻璃之表面 進行蝕刻。在RIE程序中所採用之參數如下: 氣體流率SF6/02 壓力 功率 5 30毫托 1000瓦(約1瓦/平方公分) 具有經30分鐘蝕刻衝擊之表面形貌的玻璃稱為「破璃a」,而 具有經120分鐘蝕刻衝擊者稱為「玻璃b」。 待在基材表面上導入結構或形貌後,藉由低壓化學氣相沉積 (LPCVD)沉積二種類型之氧化鋅。類型丨為沉積在平坦基材上、 厚度約500奈米、未搀雜之氧化鋅(Zn〇)的薄層,以及另外沉積 在「玻璃A」基材上者❶類型2為沉積在「玻璃A」基材上、厚 度約1000奈米、摻雜硼之氧化辞(Zn〇:B)的薄層,以及另外一 積在「玻璃B」基材上者。各類型係於相同之沉積操作下同時沉 積在平坦玻璃基材及經#刻之玻璃基材上。 以四點探針(four probe )法對所有層測量薄膜電阻( resistances,Rsq)。該薄膜電阻與導電度之關係如下方程式所示. 201113389 G=l/R=w/(Rsq χ) 其_ G為電導度,R為電阻,且界及[各別為層寬度及層長度。 第3圖所示為同時沉積在平坦玻璃及「玻璃A」上之類型^氧 化鋅之薄膜電阻值。在使用「玻璃A」取代平坦玻璃時,該層之 薄膜電阻從11.5ΧΠΤ6歐姆·平方下降至4 5xlQ.6歐姆_平方。 第4圖所示為同時沉積在平坦玻璃、「玻璃Aj及「玻璃Bj上 之類型2氧化狀薄膜電難y目較於沉積在平坦麵上之氧化 辞’/儿積在「玻璃A」上之層的薄膜電阻從2〇 3歐姆-平方下降至 14.5歐姆平方,而沉積在「玻璃B」上之層的薄膜電阻從20.3歐 姆-平方下降至10.2歐姆·平方。 此顯示藉由實施本發明之方法,氧化鋅層之導電度可顯著地提 升。本發明之方法因而可特別適用於製造效能提升之光伏打元件 或太陽能電池。 當以圖式及上述說明詳細描述及說明本發明時,該描述及說明 應當視為示範及例示所用,而非用以限制本發明。本發明並不限 於所揭露之實施態樣。本領域之-般技藝人士於實際應用本發明 時,可經由圖示、揭露内容及隨附申請專利範圍之教示而了解並 實現所揭露實施態樣之其他變化。於申請專利範圍中,「包含乙 詞係不排除其他元件或步驟’而不定冠詞「_」係不排除複數形 式。單獨記載於相互不同之附屬項中之特定方法並不代表不可有 利地使用彼等方法之組合。申請專利範圍中之任何參考符號係不 應視為限定本發明之範圍。 【圖式簡單說明】 第1圖所示為根據習知技術之薄膜太陽能電池的示意圖. 12 201113389 第2a圖所示為,, R嫁習知技術之經塗覆之基材的橫截面掃描式 電子顯微影像; 第2b圖所示為柄姑· χ據本發明之經塗覆之基材的橫截面掃描式電子 顯微影像; $ 3圖所7^為根據習知技術與本發明之氧化鋅塗層的薄膜電阻 之比較結果;以及 第圖所不為根據習知技術與本發明之氧化辞塗層的薄膜電阻 之另一比較結果。 【主要元件符號說明】 10 光伏打電池 12 基材 14 前觸點 16、20 層 18、22 次層 24 觸點層 26 反射層 13

Claims (1)

  1. 201113389 七、申請專利範圍: 1. 一種在基材上塗覆氧化鋅膜之方法,該方法包含以下步驟: 提供一具有至少一實質上平坦表面之基材; 將至少部分之該表面進行一電漿蝕刻程序; 在該經蝕刻的表面上沉積一層,該層係包含氧化鋅。 2. 如請求項1之方法,其中係使用一玻璃基材。 3. 如請求項1或2之方法,其中係使用一六敗化硫(sulphur hexafluoride)與氧比例為5/1之混合物的電漿。 4. 如請求項1或2之方法,其中在該電漿蝕刻程序中所使用之功 率為1瓦/平方公分。 5. 如請求項1或2之方法,其中在該蝕刻程序期間所使用之壓力 為30毫托® 6. 如請求項1或2之方法,其中該蝕刻之時間係持續30分鐘。 7. 如請求項1或2之方法,其中氧化鋅係以低壓氣相沉積法沉積。 8. 如請求項1或2之方法,其中氧化辞係摻雜有硼。 9. 一種太陽能電池,其係包含一根據請求項1至8中任一項之方 法塗覆有氧化鋅之基材。 10. 如請求項9之太陽能電池,其中該氧化鋅塗層之導電度為14.5 歐姆-平方(Ohm-square)或更低。 14
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