TW201108336A - Manufacturing method of semiconductor integrated circuit device - Google Patents

Manufacturing method of semiconductor integrated circuit device Download PDF

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Publication number
TW201108336A
TW201108336A TW099107105A TW99107105A TW201108336A TW 201108336 A TW201108336 A TW 201108336A TW 099107105 A TW099107105 A TW 099107105A TW 99107105 A TW99107105 A TW 99107105A TW 201108336 A TW201108336 A TW 201108336A
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TW
Taiwan
Prior art keywords
wafer
integrated circuit
semiconductor integrated
manufacturing
circuit device
Prior art date
Application number
TW099107105A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Maki
Makoto Ise
Original Assignee
Renesas Tech Corp
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Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW201108336A publication Critical patent/TW201108336A/zh

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Die Bonding (AREA)
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TW099107105A 2009-04-09 2010-03-11 Manufacturing method of semiconductor integrated circuit device TW201108336A (en)

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JP5559452B2 (ja) * 2006-12-20 2014-07-23 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP5032231B2 (ja) 2007-07-23 2012-09-26 リンテック株式会社 半導体装置の製造方法
JP5222508B2 (ja) * 2007-09-07 2013-06-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5538682B2 (ja) * 2008-03-06 2014-07-02 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11172600B2 (en) 2017-09-29 2021-11-09 Shinkawa Ltd. Mounting device
TWI746888B (zh) * 2017-09-29 2021-11-21 日商新川股份有限公司 封裝裝置
TWI807348B (zh) * 2021-06-21 2023-07-01 矽品精密工業股份有限公司 覆晶作業及其應用之接合設備

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US20100261312A1 (en) 2010-10-14
US20130330879A1 (en) 2013-12-12

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