TW200910434A - Dicing apparatus and dicing method - Google Patents

Dicing apparatus and dicing method Download PDF

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Publication number
TW200910434A
TW200910434A TW97118139A TW97118139A TW200910434A TW 200910434 A TW200910434 A TW 200910434A TW 97118139 A TW97118139 A TW 97118139A TW 97118139 A TW97118139 A TW 97118139A TW 200910434 A TW200910434 A TW 200910434A
Authority
TW
Taiwan
Prior art keywords
wafer
tape
cutting
light
irradiation device
Prior art date
Application number
TW97118139A
Other languages
English (en)
Chinese (zh)
Inventor
Yusuke Arai
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200910434A publication Critical patent/TW200910434A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW97118139A 2007-05-18 2008-05-16 Dicing apparatus and dicing method TW200910434A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007133088 2007-05-18

Publications (1)

Publication Number Publication Date
TW200910434A true TW200910434A (en) 2009-03-01

Family

ID=40031690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97118139A TW200910434A (en) 2007-05-18 2008-05-16 Dicing apparatus and dicing method

Country Status (3)

Country Link
JP (1) JPWO2008142975A1 (ja)
TW (1) TW200910434A (ja)
WO (1) WO2008142975A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171076A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
JP5420916B2 (ja) * 2009-01-20 2014-02-19 リンテック株式会社 光照射装置及び光照射方法
JP5386232B2 (ja) * 2009-05-26 2014-01-15 日東電工株式会社 紫外線照射装置
JP6132571B2 (ja) * 2013-02-05 2017-05-24 株式会社ディスコ 紫外線照射装置
JP5690909B2 (ja) * 2013-11-21 2015-03-25 リンテック株式会社 光照射装置及び光照射方法
JP6277021B2 (ja) * 2014-03-12 2018-02-07 株式会社ディスコ ウエーハ処理装置及びウエーハの処理方法
JP5906291B2 (ja) * 2014-08-28 2016-04-20 リンテック株式会社 光照射装置及び光照射方法
JP6475076B2 (ja) * 2015-05-11 2019-02-27 株式会社ディスコ チャックテーブル
JP7356289B2 (ja) * 2019-08-15 2023-10-04 株式会社ディスコ 紫外線照射装置及び環状凸部除去装置
WO2023108449A1 (zh) * 2021-12-15 2023-06-22 厦门市芯颖显示科技有限公司 寻址转移设备和寻址转移方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616529B2 (ja) * 1986-02-17 1994-03-02 ウシオ電機株式会社 粘着シ−ト処理装置
JP3146028B2 (ja) * 1991-09-24 2001-03-12 株式会社東芝 光応用基板処理装置
JP3076179B2 (ja) * 1993-07-26 2000-08-14 株式会社ディスコ ダイシング装置
JP2002299286A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd Ｕｖ照射装置付ダイシング装置
JP2003203887A (ja) * 2002-01-10 2003-07-18 Disco Abrasive Syst Ltd 切削装置
JP2005293826A (ja) * 2004-03-08 2005-10-20 Kitano:Kk 光ディスクの紫外線照射装置及び光ディスクへの紫外線照射方法
JP4279738B2 (ja) * 2004-07-22 2009-06-17 リンテック株式会社 紫外線照射装置
JP4841939B2 (ja) * 2005-11-22 2011-12-21 株式会社ディスコ 半導体ウェハの加工装置
JP2007329300A (ja) * 2006-06-08 2007-12-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた切削機

Also Published As

Publication number Publication date
WO2008142975A1 (ja) 2008-11-27
JPWO2008142975A1 (ja) 2010-08-05

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