TW200843608A - Metal-plated laminated board, multilayer laminated board and method for manufacturing the same - Google Patents

Metal-plated laminated board, multilayer laminated board and method for manufacturing the same Download PDF

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Publication number
TW200843608A
TW200843608A TW97110355A TW97110355A TW200843608A TW 200843608 A TW200843608 A TW 200843608A TW 97110355 A TW97110355 A TW 97110355A TW 97110355 A TW97110355 A TW 97110355A TW 200843608 A TW200843608 A TW 200843608A
Authority
TW
Taiwan
Prior art keywords
pressure
temperature
forming
laminate
metal
Prior art date
Application number
TW97110355A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377891B (enrdf_load_html_response
Inventor
Chikara Hamatsu
Shouichi Yosida
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200843608A publication Critical patent/TW200843608A/zh
Application granted granted Critical
Publication of TWI377891B publication Critical patent/TWI377891B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Moulding By Coating Moulds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
TW97110355A 2007-03-27 2008-03-24 Metal-plated laminated board, multilayer laminated board and method for manufacturing the same TW200843608A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007082937 2007-03-27
JP2007130132 2007-05-16

Publications (2)

Publication Number Publication Date
TW200843608A true TW200843608A (en) 2008-11-01
TWI377891B TWI377891B (enrdf_load_html_response) 2012-11-21

Family

ID=39788447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97110355A TW200843608A (en) 2007-03-27 2008-03-24 Metal-plated laminated board, multilayer laminated board and method for manufacturing the same

Country Status (3)

Country Link
JP (1) JP5017158B2 (enrdf_load_html_response)
TW (1) TW200843608A (enrdf_load_html_response)
WO (1) WO2008117711A1 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080281A (zh) * 2014-07-04 2014-10-01 华进半导体封装先导技术研发中心有限公司 一种印刷电路板的压合方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163279B2 (ja) * 2008-05-20 2013-03-13 住友ベークライト株式会社 積層板の製造方法、積層板、回路板、半導体パッケージ用基板および半導体装置
GB2489508B8 (en) * 2011-03-31 2016-03-16 Plasyl Ltd Improvements for electrical circuits
TWI501715B (zh) 2012-12-11 2015-09-21 Mitsui Mining & Smelting Co Multilayer printed circuit board and manufacturing method thereof
JP6331433B2 (ja) * 2014-02-04 2018-05-30 日立化成株式会社 金属張り積層板の製造方法及び金属張り積層板
CN105228374B (zh) * 2015-08-13 2018-01-19 江苏博敏电子有限公司 一种印制电路板混合压合的方法
JP6368748B2 (ja) * 2016-08-17 2018-08-01 株式会社日本製鋼所 繊維強化樹脂を成形する成形加工方法
JP6368874B1 (ja) * 2017-07-25 2018-08-01 アイティテクノ 株式会社 成形品の製造方法
US11524495B2 (en) * 2019-03-20 2022-12-13 Nike, Inc. Closed loop feedback press
EP4081005A1 (en) 2021-04-23 2022-10-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5751423A (en) * 1980-09-12 1982-03-26 Hitachi Chem Co Ltd Preparation of thermosetting resin laminated plate
JPS59131426A (ja) * 1983-01-17 1984-07-28 Hitachi Chem Co Ltd 積層板の製造法
JPS6228245A (ja) * 1985-07-30 1987-02-06 新神戸電機株式会社 積層板の製造法
JP2000156566A (ja) * 1998-11-20 2000-06-06 Matsushita Electric Ind Co Ltd プリント配線基板の製造方法および電子部品実装配線基板の製造方法
JP2001030279A (ja) * 1999-07-27 2001-02-06 Matsushita Electric Works Ltd 積層板の製造方法
JP2002067061A (ja) * 2000-08-29 2002-03-05 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002079538A (ja) * 2000-09-08 2002-03-19 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002264157A (ja) * 2001-03-09 2002-09-18 Risho Kogyo Co Ltd 積層板の製造方法
JP4715017B2 (ja) * 2001-04-13 2011-07-06 パナソニック電工株式会社 多層積層板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080281A (zh) * 2014-07-04 2014-10-01 华进半导体封装先导技术研发中心有限公司 一种印刷电路板的压合方法
CN104080281B (zh) * 2014-07-04 2017-01-25 华进半导体封装先导技术研发中心有限公司 一种印刷电路板的压合方法

Also Published As

Publication number Publication date
WO2008117711A1 (ja) 2008-10-02
TWI377891B (enrdf_load_html_response) 2012-11-21
JP2008307886A (ja) 2008-12-25
JP5017158B2 (ja) 2012-09-05

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