TW200837858A - Anisotropic electroconductive film - Google Patents
Anisotropic electroconductive film Download PDFInfo
- Publication number
- TW200837858A TW200837858A TW097102311A TW97102311A TW200837858A TW 200837858 A TW200837858 A TW 200837858A TW 097102311 A TW097102311 A TW 097102311A TW 97102311 A TW97102311 A TW 97102311A TW 200837858 A TW200837858 A TW 200837858A
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- Taiwan
- Prior art keywords
- temperature
- organic
- conductive film
- peroxide
- anisotropic conductive
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- 239000012789 electroconductive film Substances 0.000 title abstract description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 34
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- 238000000354 decomposition reaction Methods 0.000 claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 18
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- 239000000758 substrate Substances 0.000 claims description 23
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- 238000000034 method Methods 0.000 claims description 7
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- QPIRYFWCAHUZTB-UHFFFAOYSA-N 3,5,5-trimethyl-1-(3,5,5-trimethylhexylperoxy)hexane Chemical compound CC(C)(C)CC(C)CCOOCCC(C)CC(C)(C)C QPIRYFWCAHUZTB-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007011592A JP5013067B2 (ja) | 2007-01-22 | 2007-01-22 | 異方性導電フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200837858A true TW200837858A (en) | 2008-09-16 |
| TWI347645B TWI347645B (enExample) | 2011-08-21 |
Family
ID=39644367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097102311A TW200837858A (en) | 2007-01-22 | 2008-01-22 | Anisotropic electroconductive film |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8067514B2 (enExample) |
| JP (1) | JP5013067B2 (enExample) |
| KR (1) | KR101098205B1 (enExample) |
| CN (1) | CN101589514B (enExample) |
| TW (1) | TW200837858A (enExample) |
| WO (1) | WO2008090791A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8715833B2 (en) | 2008-07-11 | 2014-05-06 | Sony Chemical & Information Device Corporation | Anisotropic conductive film |
| TWI456595B (zh) * | 2009-09-30 | 2014-10-11 | 迪睿合股份有限公司 | 異向性導電膜及其製造方法 |
| TWI506114B (zh) * | 2012-11-06 | 2015-11-01 | 第一毛織股份有限公司 | 各向異性導電膜及半導體裝置 |
| TWI548719B (zh) * | 2008-09-30 | 2016-09-11 | Dexerials Corp | An anisotropic conductive adhesive, and a method of manufacturing the same |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008521954A (ja) * | 2004-11-29 | 2008-06-26 | フリッツ・ナウアー・アーゲー | ポリウレタンフォーム |
| KR100920611B1 (ko) | 2007-12-06 | 2009-10-08 | 제일모직주식회사 | 2-스텝 열경화형 이방 도전성 접착 조성물 및 이방 도전성접착 필름 |
| JP4590473B2 (ja) * | 2008-12-10 | 2010-12-01 | 大日本塗料株式会社 | 型内被覆組成物及び型内被覆成形体 |
| JP2011040297A (ja) * | 2009-08-12 | 2011-02-24 | Iinuma Gauge Seisakusho:Kk | 基板と基板を接続する方法および装置 |
| KR20130073200A (ko) * | 2011-12-23 | 2013-07-03 | 삼성전기주식회사 | 스핀들 모터 |
| JP6029922B2 (ja) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
| JP6437323B2 (ja) * | 2014-02-14 | 2018-12-12 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
| WO2019226641A1 (en) * | 2018-05-21 | 2019-11-28 | Kaneka Americas Holding, Inc. | Varnish of polyimide having high heat resistance and excellent mechanical strength |
| CN117878092A (zh) * | 2022-10-11 | 2024-04-12 | 联华电子股份有限公司 | 半导体封装及其制作方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
| JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
| JP2001031916A (ja) | 1999-07-22 | 2001-02-06 | Bridgestone Corp | 異方性導電フィルム |
| JP4351348B2 (ja) * | 2000-01-27 | 2009-10-28 | リンテック株式会社 | 保護層を有するｉｃカードの製造方法 |
| JP2002184487A (ja) * | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
| JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
| DE10259451A1 (de) * | 2002-12-19 | 2004-07-08 | Tesa Ag | Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung |
| JP4444632B2 (ja) | 2003-11-11 | 2010-03-31 | リンテック株式会社 | 光学用フィルム |
| CN101831247B (zh) * | 2004-06-09 | 2012-06-06 | 日立化成工业株式会社 | 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置 |
| JP4780647B2 (ja) * | 2004-12-02 | 2011-09-28 | 日東電工株式会社 | 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置 |
| JP2006199825A (ja) * | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
| JP5524531B2 (ja) * | 2009-07-31 | 2014-06-18 | 北海製罐株式会社 | 溶接缶体 |
-
2007
- 2007-01-22 JP JP2007011592A patent/JP5013067B2/ja active Active
-
2008
- 2008-01-17 KR KR1020097001050A patent/KR101098205B1/ko active Active
- 2008-01-17 US US12/227,164 patent/US8067514B2/en active Active
- 2008-01-17 CN CN2008800028476A patent/CN101589514B/zh active Active
- 2008-01-17 WO PCT/JP2008/050483 patent/WO2008090791A1/ja not_active Ceased
- 2008-01-22 TW TW097102311A patent/TW200837858A/zh unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8715833B2 (en) | 2008-07-11 | 2014-05-06 | Sony Chemical & Information Device Corporation | Anisotropic conductive film |
| TWI456018B (zh) * | 2008-07-11 | 2014-10-11 | Dexerials Corp | 異向性導電膜 |
| TWI548719B (zh) * | 2008-09-30 | 2016-09-11 | Dexerials Corp | An anisotropic conductive adhesive, and a method of manufacturing the same |
| TWI456595B (zh) * | 2009-09-30 | 2014-10-11 | 迪睿合股份有限公司 | 異向性導電膜及其製造方法 |
| TWI506114B (zh) * | 2012-11-06 | 2015-11-01 | 第一毛織股份有限公司 | 各向異性導電膜及半導體裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008090791A1 (ja) | 2008-07-31 |
| KR20090045196A (ko) | 2009-05-07 |
| TWI347645B (enExample) | 2011-08-21 |
| HK1135803A1 (en) | 2010-06-11 |
| CN101589514A (zh) | 2009-11-25 |
| KR101098205B1 (ko) | 2011-12-23 |
| US8067514B2 (en) | 2011-11-29 |
| CN101589514B (zh) | 2011-04-06 |
| JP5013067B2 (ja) | 2012-08-29 |
| JP2008174687A (ja) | 2008-07-31 |
| US20090107625A1 (en) | 2009-04-30 |
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