WO2008090791A1 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

Info

Publication number
WO2008090791A1
WO2008090791A1 PCT/JP2008/050483 JP2008050483W WO2008090791A1 WO 2008090791 A1 WO2008090791 A1 WO 2008090791A1 JP 2008050483 W JP2008050483 W JP 2008050483W WO 2008090791 A1 WO2008090791 A1 WO 2008090791A1
Authority
WO
WIPO (PCT)
Prior art keywords
anisotropic electroconductive
pressure bonding
electroconductive film
decomposition
polymerization initiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050483
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kouichi Miyauchi
Yasushi Akutsu
Yasunobu Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to HK10102236.8A priority Critical patent/HK1135803B/xx
Priority to US12/227,164 priority patent/US8067514B2/en
Priority to CN2008800028476A priority patent/CN101589514B/zh
Publication of WO2008090791A1 publication Critical patent/WO2008090791A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2008/050483 2007-01-22 2008-01-17 異方性導電フィルム Ceased WO2008090791A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
HK10102236.8A HK1135803B (en) 2007-01-22 2008-01-17 Anisotropic electroconductive film
US12/227,164 US8067514B2 (en) 2007-01-22 2008-01-17 Anisotropic conductive film
CN2008800028476A CN101589514B (zh) 2007-01-22 2008-01-17 各向异性导电膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-011592 2007-01-22
JP2007011592A JP5013067B2 (ja) 2007-01-22 2007-01-22 異方性導電フィルム

Publications (1)

Publication Number Publication Date
WO2008090791A1 true WO2008090791A1 (ja) 2008-07-31

Family

ID=39644367

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050483 Ceased WO2008090791A1 (ja) 2007-01-22 2008-01-17 異方性導電フィルム

Country Status (6)

Country Link
US (1) US8067514B2 (enExample)
JP (1) JP5013067B2 (enExample)
KR (1) KR101098205B1 (enExample)
CN (1) CN101589514B (enExample)
TW (1) TW200837858A (enExample)
WO (1) WO2008090791A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110250457A1 (en) * 2008-12-10 2011-10-13 Dai Nippon Toryo Co., Ltd. In-mold coating composition and in-mold-coated molded product

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2005308923A1 (en) * 2004-11-29 2006-06-01 Fritz Nauer Ag. Polyurethane foam
KR100920611B1 (ko) 2007-12-06 2009-10-08 제일모직주식회사 2-스텝 열경화형 이방 도전성 접착 조성물 및 이방 도전성접착 필름
JP5549103B2 (ja) * 2008-07-11 2014-07-16 デクセリアルズ株式会社 異方性導電フィルム
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP2011040297A (ja) * 2009-08-12 2011-02-24 Iinuma Gauge Seisakusho:Kk 基板と基板を接続する方法および装置
JP5398455B2 (ja) * 2009-09-30 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR20130073200A (ko) * 2011-12-23 2013-07-03 삼성전기주식회사 스핀들 모터
JP6029922B2 (ja) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
KR101535600B1 (ko) 2012-11-06 2015-07-09 제일모직주식회사 이방성 도전 필름 및 반도체 장치
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
WO2019226641A1 (en) * 2018-05-21 2019-11-28 Kaneka Americas Holding, Inc. Varnish of polyimide having high heat resistance and excellent mechanical strength
CN117878092A (zh) * 2022-10-11 2024-04-12 联华电子股份有限公司 半导体封装及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2001031916A (ja) * 1999-07-22 2001-02-06 Bridgestone Corp 異方性導電フィルム
WO2005121266A1 (ja) * 2004-06-09 2005-12-22 Hitachi Chemical Co., Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2006199825A (ja) * 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10338860A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP4351348B2 (ja) * 2000-01-27 2009-10-28 リンテック株式会社 保護層を有するｉｃカードの製造方法
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP4158434B2 (ja) * 2001-07-05 2008-10-01 株式会社ブリヂストン 異方性導電フィルム
DE10259451A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
JP4444632B2 (ja) * 2003-11-11 2010-03-31 リンテック株式会社 光学用フィルム
JP4780647B2 (ja) 2004-12-02 2011-09-28 日東電工株式会社 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置
JP5524531B2 (ja) * 2009-07-31 2014-06-18 北海製罐株式会社 溶接缶体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2001031916A (ja) * 1999-07-22 2001-02-06 Bridgestone Corp 異方性導電フィルム
WO2005121266A1 (ja) * 2004-06-09 2005-12-22 Hitachi Chemical Co., Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2006199825A (ja) * 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110250457A1 (en) * 2008-12-10 2011-10-13 Dai Nippon Toryo Co., Ltd. In-mold coating composition and in-mold-coated molded product

Also Published As

Publication number Publication date
KR20090045196A (ko) 2009-05-07
HK1135803A1 (en) 2010-06-11
US20090107625A1 (en) 2009-04-30
JP2008174687A (ja) 2008-07-31
CN101589514B (zh) 2011-04-06
CN101589514A (zh) 2009-11-25
US8067514B2 (en) 2011-11-29
JP5013067B2 (ja) 2012-08-29
TWI347645B (enExample) 2011-08-21
TW200837858A (en) 2008-09-16
KR101098205B1 (ko) 2011-12-23

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