TWI347645B - - Google Patents

Info

Publication number
TWI347645B
TWI347645B TW097102311A TW97102311A TWI347645B TW I347645 B TWI347645 B TW I347645B TW 097102311 A TW097102311 A TW 097102311A TW 97102311 A TW97102311 A TW 97102311A TW I347645 B TWI347645 B TW I347645B
Authority
TW
Taiwan
Application number
TW097102311A
Other languages
Chinese (zh)
Other versions
TW200837858A (en
Inventor
Kouichi Miyauchi
Yasushi Akutsu
Yasunobu Yamada
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200837858A publication Critical patent/TW200837858A/zh
Application granted granted Critical
Publication of TWI347645B publication Critical patent/TWI347645B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
TW097102311A 2007-01-22 2008-01-22 Anisotropic electroconductive film TW200837858A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007011592A JP5013067B2 (ja) 2007-01-22 2007-01-22 異方性導電フィルム

Publications (2)

Publication Number Publication Date
TW200837858A TW200837858A (en) 2008-09-16
TWI347645B true TWI347645B (enExample) 2011-08-21

Family

ID=39644367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097102311A TW200837858A (en) 2007-01-22 2008-01-22 Anisotropic electroconductive film

Country Status (6)

Country Link
US (1) US8067514B2 (enExample)
JP (1) JP5013067B2 (enExample)
KR (1) KR101098205B1 (enExample)
CN (1) CN101589514B (enExample)
TW (1) TW200837858A (enExample)
WO (1) WO2008090791A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1817358A1 (en) * 2004-11-29 2007-08-15 Fritz Nauer AG Polyurethane foam
KR100920611B1 (ko) 2007-12-06 2009-10-08 제일모직주식회사 2-스텝 열경화형 이방 도전성 접착 조성물 및 이방 도전성접착 필름
WO2010004793A1 (ja) * 2008-07-11 2010-01-14 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム
KR101683312B1 (ko) * 2008-09-30 2016-12-06 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법
JP4590473B2 (ja) * 2008-12-10 2010-12-01 大日本塗料株式会社 型内被覆組成物及び型内被覆成形体
JP2011040297A (ja) * 2009-08-12 2011-02-24 Iinuma Gauge Seisakusho:Kk 基板と基板を接続する方法および装置
JP5398455B2 (ja) * 2009-09-30 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR20130073200A (ko) * 2011-12-23 2013-07-03 삼성전기주식회사 스핀들 모터
JP6029922B2 (ja) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
KR101535600B1 (ko) * 2012-11-06 2015-07-09 제일모직주식회사 이방성 도전 필름 및 반도체 장치
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
WO2019226641A1 (en) * 2018-05-21 2019-11-28 Kaneka Americas Holding, Inc. Varnish of polyimide having high heat resistance and excellent mechanical strength
TW202214806A (zh) * 2020-09-30 2022-04-16 日商太陽油墨製造股份有限公司 各向異性導電連接材料及使用各向異性導電連接材料之電子元件的安裝方法
CN117878092A (zh) * 2022-10-11 2024-04-12 联华电子股份有限公司 半导体封装及其制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10338860A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP2001031916A (ja) 1999-07-22 2001-02-06 Bridgestone Corp 異方性導電フィルム
JP4351348B2 (ja) * 2000-01-27 2009-10-28 リンテック株式会社 保護層を有するｉｃカードの製造方法
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP4158434B2 (ja) * 2001-07-05 2008-10-01 株式会社ブリヂストン 異方性導電フィルム
DE10259451A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
JP4444632B2 (ja) 2003-11-11 2010-03-31 リンテック株式会社 光学用フィルム
EP1754762A4 (en) * 2004-06-09 2009-07-22 Hitachi Chemical Co Ltd ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE
JP4780647B2 (ja) 2004-12-02 2011-09-28 日東電工株式会社 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置
JP2006199825A (ja) * 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体
JP5524531B2 (ja) * 2009-07-31 2014-06-18 北海製罐株式会社 溶接缶体

Also Published As

Publication number Publication date
KR20090045196A (ko) 2009-05-07
US20090107625A1 (en) 2009-04-30
CN101589514A (zh) 2009-11-25
TW200837858A (en) 2008-09-16
JP2008174687A (ja) 2008-07-31
WO2008090791A1 (ja) 2008-07-31
CN101589514B (zh) 2011-04-06
US8067514B2 (en) 2011-11-29
JP5013067B2 (ja) 2012-08-29
HK1135803A1 (en) 2010-06-11
KR101098205B1 (ko) 2011-12-23

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