TW200814257A - Electronic components mounting adhesive and electronic components mounting structure - Google Patents

Electronic components mounting adhesive and electronic components mounting structure Download PDF

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Publication number
TW200814257A
TW200814257A TW96134544A TW96134544A TW200814257A TW 200814257 A TW200814257 A TW 200814257A TW 96134544 A TW96134544 A TW 96134544A TW 96134544 A TW96134544 A TW 96134544A TW 200814257 A TW200814257 A TW 200814257A
Authority
TW
Taiwan
Prior art keywords
adhesive
electronic component
thermosetting resin
hardening material
component mounting
Prior art date
Application number
TW96134544A
Other languages
English (en)
Inventor
Tadahiko Sakai
Hideki Eifuku
Kouji Motomura
Original Assignee
Matsushita Electric Ind Co Ltd
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Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200814257A publication Critical patent/TW200814257A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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Description

200814257 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種用於接合電子組件之電子組件 用黏著劑’及-種藉由使用該電子組件安裝用黏著： 合該等電子組件而獲得的電子組件安裝構造體。 【先前技術】 於電子組件安裝構造體中，一電子組件(諸如，半 晶片或電路板）係與另一電子組件接合，其中一者之電極 係經由:焊料而彼此電結合及機械結合，且同時該兩= 子組件係藉由在該兩個電子組件間的空間中被敎硬化: 熱固性樹脂的硬化材料強力結合。在此電子組件安裝構告 體中’即使在賦予熱循環測試時之溫度巨大變化，敎固= 樹脂之全部硬化材料可接收由該兩個電子組件之線性膨 脹係數的差異而產生的熱應力；因此，電極之接合表面： 之熱應力之集中可被避免。在此狀況下，該熱固性樹脂係 作為結合兩個電子組件之電子組件安裝用黏著劑。在兩個 电子組件之電極彼此連接時或在電極彼此連接之後，熱固 性樹脂係被饋入至該兩個電子組件之間並被熱硬化。… [專利文獻1]JP-A第2006-169395號 [專利文獻2] JP-A第2004-323777號 【發明内容】 現今作為有機材料之熱固性樹脂之硬化材料係通常具 有物理性質急劇改變之玻璃轉移溫度。當溫度被升高到超 過玻璃轉移溫度時，雖然線性膨脹係數迅速增大，但縱向 312XP/發明說明書(補件)/96^ 1/96134544 200814257 彈性模數（揚氏模數）迅速減小。亦即，熱固性樹脂之硬化 材料在被加熱超過其玻璃轉移溫度時軟化並傾向於熱膨
脹。然而，線性膨脹係數迅速增大（熱膨脹）之溫度及二I 彈性模數迅速減小（軟化）之溫度未必一致。在線性膨脹係 數迅速增大之溫度低於縱向彈性模數迅速減小之溫度之 狀況下，當在電子組件安裝構造體之熱循環測試中=性 樹脂之硬化材料被加熱超過其玻璃轉移溫度時，硬化材料 開始在硬狀態下迅速熱膨脹；因此，在硬化材料及電子級 件之接合表面上，大的熱應力在一些狀況下接 合表面上產生裂縫及剝落。 风在接 本發明欲提供―種可抑财藉由使電子組件 :皮=:而獲得的電子組件安裝構造體中發生裂缝及剝 子料安裝用黏著劑，及一種藉由使用此電子組件 ::用黏者劑來接合電子組件而獲得的電子組件安裴構 樹==電子組件安裝用黏著劑可藉由在熱固性 祐二：I、有焓化溫度低於熱固性樹脂之硬化材料之 玻肖輅私溫度的金屬顆粒而獲得。 本發明之電子組件安裝用黏著劑較佳 20%或以下之金屬顆粒。 丁艾 m組件安裝用黏著劑較佳包括由含 金製成的金屬顆粒。 "主少孟屬之合 本發明之電子_彳生立# m 、、牛女衣用黏著劑較佳包括一分散於熱 312XP/發明說明書(補件娜七細34544 7 200814257 固性樹脂中的無機填料。 本發明之電子組件安裝用斑 m ，ιν ^ 衣用黏者劑較佳包括具有30 # 或以下之顆粒直徑的金屬顆粒。 ::明之電子組件安裳用黏著劑較佳包括溶化溫度比 :广脂之硬化材料之破璃轉移溫度低 金屬顆粒。 J —本發明之電子組件安裝構造體包括：―具有—電極之第
接：dr具有一電極之第二電子組件，該電極電連 :弟一电子組件之電極；及-黏著劑硬化材料，該黏著 Γ化材料藉由使主要由熱固性樹脂製成之電子組件ί =黏著劑硬化而獲得且連接兩個電子組件，其中，該黏 者刎硬化材料中含有具有熔化溫度低於熱固性樹脂之硬 化材料之玻璃轉移溫度的金屬顆粒。 本务明之電子組件安裝構造體較佳包括溶化溫度比熱 固性樹脂之硬化材料之玻璃轉移溫度们或以上 屬顆粒。 在本發明之電子組件安裝用黏著劑之硬化材料（黏著劑 硬化材料）被加熱之狀況下，#黏著劑硬化材料之溫度ς 近於普通熱固性樹脂之硬化材料（樹脂硬化材料）之^璃 轉移溫度時’黏著劑硬化㈣之線性雜絲迅速增大以 使黏著劑硬化材料很大程度地熱膨脹。然而，因為黏著劑 硬化材料中所含有之金屬顆粒在黏著劑硬化材料之溫^ 達到樹脂硬化材料之破璃轉移溫度之前熔化，所以黏著劑 硬化材料之表觀縱向彈性模數減小且藉此黏著劑硬化& 3 ϊ2Χρ/發明說明書(補件)/96-11/96134544 8 200814257 料開始軟化。亦即，當黏著劑 化材料之玻璃轉移溫度時，黏 後大程度地熱膨脹。 硬化材料被加熱超過樹脂硬 著劑硬化材料開始軟化且此 組乂：精由使用本發明之電子組件安裝用黏著劑，電子 材料接：。在本發明之電子組件安裝用黏著劑之硬化
子組件之間的電子組件安裝構造體中，即使 二：：，測試的巨大溫度變化時’作用於黏著劑硬化 /、/、电組件之接合表面上的熱應力不會變得過大，且 精此可抑制接合表面上之裂缝及剝落的發生。 【實施方式】 且：=參考圖式描述本發明之具體例，1為本發明之 :肢例中之電子組件安裝構造體的剖視圖，圖2A至圖2C 二二於衣1^本叙明之具體例之電子組件安裝構造體之流 私圖’圖3為展示本發明之具體例中的黏㈣硬化材料之 μ度與縱向彈性模數之間的關係之曲線圖。
在圖1中’在電子組件安裝構造體ι巾，第—電路板 11之電極12與第二電路板13之電極14電連接，且該兩 们私路板π及！ 3使用藉由使主要組份為熱固性樹脂21 之電子組件安裝用黏著劑（下文中簡稱為黏著劑）20孰硬 化，獲得的黏著劑硬化材料2〇，而接合。第一電路板Η 及第二電路板13分別為電子組件之例子。除電路板之 外，可使用半導體晶片、電阻器及電容器。 根據如圖2Α至圖2C所示 造程序，在開始時，將第一 之電子組件安裝構造體〗的 電路板11固持於固持台3i 製 之 312XP/發明說明書(補件)/%-11/96134544 9 200814257 、 使得電路板11之電極12可被向上定向，且藉 由使用配量11而將黏著劑2G塗佈至第-電路板u之# : ^ (圖2A)。此時，第一電路板n之所有電極 黏 劑20覆蓋。 反^者 在將黏著=20塗佈至第一電路板u之表面上之後，將 持有第一電路板13之熱壓結合頭32定位於第—電 路板π上方。接著，在將第—電路板u之電極u及第 =^板13之電極14對準之後，使第二電路板13相對 、弟—電路板11，使得第二電路板13之電極14可自 上方接近第-電路板u之電極12(藉由降低熱壓結合頭 )’接者將兩個電路板u及13加熱（圖2B)。藉此， 路板11與13之間的黏著劑2G被熱硬化成黏著劑 硬化材料20,以強力結合兩個電路板η &13。此外= 熱壓過程期間，被夾置於第—電路板11之電極12與第二 電=13之電極14之間的黏著劑2〇(黏著劑硬化材料 、:之金屬顆粒22熔化並在兩個電極12與14之間膨 脹以猎由金屬顆粒22來電連接兩個電極12及 示之部分擴大圖）。 ^所 在限疋^間經過之後，停止該兩個電路板1丨及丨3之 將該第，電路板13之吸持釋放，且將熱壓結合頭 ⑹口。上退出。藉此’完成電子組件安裝構造體i之製造（圖 2〇n述’電子組件安裝構造體1之黏著劑硬化材料 為猎由使藉由將金屬顆粒22分散於熱固性樹脂21中 312ΧΡ/^__(補件)/96·11/96134544 10 200814257 而形成的黏著劑2〇熱硬化而獲得 ，^ 材料20,位於第“踗舫劑硬化 結合兩個電路板U =:二電路板13之間以強力 於第-f路彳ί 含有之金屬難22裳設 ;弟：路板U之電極12與第二電路板13之電極
間以電連接兩個電極12及14。亦即，根 著劑嶋著劑硬化材請)作為所謂之各向里 材料以經由金屬顆粒22來電連接上下面向之電極12及 14並橫向地（亦即，在鄰近電極之間）電隔離。 熱固性樹脂21(其為黏著劑2〇之主要組份）例如由環氧 樹脂或丙烯酸系樹脂製成。金屬顆粒22具有熔化溫度 低於熱固性樹脂21之硬化材料之玻璃轉移溫度Tg，且例 如由含有Sn與選自Pb、Ag、Zn、Bi、^、訃及以中的 至少一種金屬的合金製成。具體言之，諸如SnZn、如以、
SnBiAg、SnAgBiln、SnAgCu、SnPb 及 Snln 之焊料可被用 作金屬顆粒22。 • 圖3為展示在熱固性樹脂21為環氧樹脂（咪唑型硬化劑 被混合）且金屬顆粒2 2為具有3 0 // m之平均顆粒直徑的 SnBi合金之情況下的黏著劑硬化材料2〇,之溫度與縱向 彈性模數（揚氏模數）之間的關係之曲線圖。此處，金屬顆 粒2 2在全部黏著劑2 0中之含量以體積計之〇 %、以體積 < 計之10%及以體積計之20°/。之三個含量變化。在該例子 • 中，熱固性樹脂21之硬化材料之玻璃轉移溫度Tg為大體 上165°C，且SnBi合金之熔化溫度Mp為大體上130°C。 自圖3之曲線圖發現當將該具體例之黏著劑硬化材料 312XP/發明說明書(補件)/96-11/96134544 11 200814257 1〇 I、加t熱4，在黏著劑硬化材料2〇,之溫度達到普通熱固 ㈤、 1之硬化材料（被稱為樹脂硬化材料）之玻璃轉移 Μ度、Tg之$，黏著劑硬化材料之表觀縱向彈性模數 -、、、咸丨亦即，軟化在低於樹脂硬化材料之玻璃轉移溫 .之溫度處開始。此被認為係因為由於分散於熱固性 树月曰21中之金屬顆粒22之熔化溫度Mp低於樹脂硬化材 料之，=轉移溫度Tg，所以在黏著劑硬化材料之溫度 _達到树脂硬化材料之玻璃轉移溫度Tg之前，金屬顆粒22 被熔化。 另方面，當黏著劑硬化材料20,之溫度接近於樹脂硬 化2料之破璃轉移溫度Tg時，黏著劑硬化材料20,之線 性，脹係數迅速增大且藉此黏著劑硬化材料20,很大程度 也/脹亦即，當將黏著劑硬化材料20,加熱超過樹脂硬 化材料之破璃轉移溫度Tg時，黏著劑硬化材料2〇，開始 軟化，接著报大程度地熱膨脹。 ·=’該具體例中之黏著劑2〇係藉由將具有低於熱固 性树脂21之硬化材料之破璃轉移溫度Tg的熔化溫度之金 屬=粒22分散於熱固性樹脂21中而形成，且該具體例中 之=子組件安裝構造體1係藉由使用黏著劑20來結合第 -，私路板11及第二電路板13而形成。在黏著劑硬化材料 胃2〇Y插入於第一電路板11與第二電路板13之間的電子組 件Ϊ裝構造體1中，即使當由熱循環測試而暴露至巨大溫 :义化％，不同於黏著劑硬化材料在硬狀態下迅速開始熱 ν脹的現有勒著劑硬化材料，作用於黏著劑硬化材料2 〇， 312ΧΡ/發明說明書(補件)/陈11/96134544 12 200814257 與兩個電路板UU3之間的接合表面§(圖】中之部八 擴大圖）上之熱應力不會變得過大；因此，接合表面s ; 之裂縫及剝離可被抑制發生。熱固性樹脂21之硬化材 之玻璃轉移溫度Tg在某一溫度範圍（寬度）上延伸.因 此，為了賦予在金屬顆粒22之溶化溫度與熱固性樹脂Μ 之硬化材料之玻璃轉移溫度之間的某一程度之溫度差異 (士容匕差），金屬顆粒22之溶化溫度較佳被設定成^固性 樹脂21之硬化材料之玻璃轉移溫度低l(rc或以上。 此處，金屬顆粒22在全部黏著劑2〇中之含量 體積計之m或以下。此係因為如自目3之曲線圖可^ 金屬顆粒22在全部黏著劑2〇中之含量與黏著劑硬化材料 之縱向彈性模數相關，當黏著劑硬化材料20,在以體 知σ十之20%或以下之情況下被加熱時，黏著劑硬化材料 20 ^之縱向彈性模數之降低速率較大，因為金屬顆粒以之 έ里車乂大且藉此作用於接合表面上之熱應力可被大程度 =減輕。然而，當金屬顆粒22之含量超過以體積計之 時，黏著劑20之黏度變得過大而難以用作黏著劑2〇且成° 本過高。在超過樹脂硬化材料之玻璃轉移溫度Tg之溫 度，即使當金屬顆粒22之含量為以體積計之〇%時，黏著 劑硬化材料20,之縱向彈性模數亦很大程度地減小。然 而，因為線性膨脹係數在該區域中迅速增大，所以為了使 黏者劑硬化材,料20,之縱向彈性模數之;^咸小與線性膨脹係 數之增大的比率（黏著劑硬化材料2〇’之軟化比率）足夠 大’金屬顆粒22在全部黏著劑20中之含量較佳為以體積 312XP/發明說明書(補件)/96-11 /96 B4544 13 200814257 計之3%或以上，亦g口如 ,.如 P，在以體積計之3%至20%之範圍内。 此外，在該具體例 圍内 分散於熱1Η±_21Φ f j ^填純佳被 ^ 中。备無機填料被分散於熱固性樹 敫鹏、士二黏著劑硬化材料2〇,之線性膨脹係數可作為 正：而?減小’且藉此施加於接合表面s上之埶應力可被
當無機填料在全部黏著劑2q中之含 ::大時，黏著劑20之黏度變得極高而難以使用；因此， …、从填料之含1較佳為以重量計之5〇%或以下。 9卜S該具⑯例中之黏著劑20中，分散於熱固性樹 曰/之金屬顆粒22之顆粒直徑較佳為3〇 以下。 此係因為’在黏著劑20(黏著劑硬化材料20,）被用作各向 異性導電材料的狀況下，當電子組件安裝構造體丨之鄰近 電極之間距被認為係A體上㈣"日f，作為並不使鄰近 顆粒彼此短路之顆粒直徑，3()，被認為係上限。 為了減輕施加於電子組件安裝構造體i之接合表面8上 之熱應力，將一種諸如橡膠顆粒或具有塑性之樹脂之低彈 性樹脂添加至該熱固性樹脂21的方法可被考慮。然而， 橡膠顆粒或樹脂與熱固性樹脂21(其為基底）之相容性未 必良好。當相容性並不良好時，可能導致不便，使得黏著 力被劣化。就此而言，如該具體例所示，當分散於熱固性 樹脂21中之金屬顆粒22由一由Sn與選自Pb、Ag、Zn、
Bi、In、Sb及Cu中的至少一種金屬製成的合金製成時， 相谷性無需被關注。此意謂熱固性樹脂21之選擇寬度擴 展且藉此對應於所需物理性質及效能的熱固性樹脂21可 312χΡ/發明說明書(補件)/96-11/96134544 14 200814257 容易地被選擇。此外，當金屬顆粒22由金屬之合入 時，黏著劑20(黏著劑硬化材料2〇,）可作為各向^ 材料’且此外，取決於金屬顆粒22之金屬組合物握电 金屬顆粒22之溶化溫度可被有利地自由控制。、， .上文描述了本發明之具體例。然而，本發明不限於兮且 體例。，例而言，在該具體例中，電子組件安農構造體^ 中之黏者劑硬化材料2〇,由於被分散於熱固性樹脂^一 =金屬顆粒22而電連接該第—電路板u之電極12及兮 第二電路板13之電極14，以作為各向異性導電材料。= 而’在本發明之電子組件安裝構造體中，電極被電連接: 兩個電子組件僅需使用本發明之黏著劑(亦即，且有熔化 溫度低於熱固性樹脂之硬化材料之玻璃轉移溫度的全屬 顆粒分散於熱固性樹脂中的黏著劑）來接合。亦即，黏著 劑之硬化材料未必需要作為各向異性導電材料。* 此外’在電子組件安裝構造體丨中，第—電路板n(第 书子、’且件）之电極12及第二電路板13 (第二電子組件） ^電極14電連接且#由使主要由熱固性樹脂2ι冑成之黏 2劑20熱硬化而獲得的黏著劑硬化材料2()，而接合兩個 私路板11及13。然而，作為電極J 2與J 4之間的電連接， 除如該具體例所示之兩個電極12及14經由金屬顆粒22 而連接的狀況，係包含使兩個電極12及14彼此直接接觸 而連接之狀況，及兩個電極12及14經由預先形成之金屬 凸塊、焊料凸塊或焊料預覆層而連接的狀況。 (產業利用性） 312XP/發明說明書(補件)/96-11/96134544 15 200814257 在藉由接合電子組件而獲得的電子組件安装構造體 中’可抑制裂縫及剝落發生。 【圖式簡單說明】 圖1為本發明之具體例中之電子組件安裝構造體的剖 視圖。 圖2A至圖2C為本發明之具體例中之電子組件安裝構造 體之製造流程圖。 圖3顯示本發明之具體例中的硬化黏著劑之溫度與其 縱向彈性模數之間的關係之曲線圖。 又 【主要元件符號說明】 1 電子組件安裝構造體 11 第一電路板 12 電極 13 弟一電路板 14 電極 20 電子組件安裝用黏著劑 20， 黏著劑硬化材料 21 熱固性樹脂 22 金屬顆粒 31 固持台 32 熱壓結合頭 Μρ 熔化溫度 S 接合表面 Tg 玻璃轉移溫度 312XP/發明說明書(補件)/96·11/96134544 16

Claims (1)

  1. 200814257 十、申請專利範圍： 1· 一種電子組件安裝用黏著劑，其包含： 一熱固性樹脂；及 金屬顆粒，該等金屬顆粒分散於該熱固性樹脂中，且具 有一熔化溫度低於該熱固性樹脂之一硬化樹脂之玻璃轉 移溫度。 =申請專利範圍第1項之電子組件安裝用黏著劑，其 中遠等金屬顆粒之含量以體積計係不大於20%。 t申明專利範圍第i項之電子組件安裝用黏著劑，其 该寻金屬顆粒係由—含有Sn與選自Pb、Ag、Zn、Bi、 I'、Sb及Cu中至少一種金屬的合金製成。 士申明專利範圍第丨項之電子組件安裝用黏著劑，其 一無機填料係分散於該熱固性樹脂中。 中專利範圍第1項之電子組件安裝用黏著劑，其 z、至鱗顆粒之顆粒直徑為30 或以下。 中节等專利觀圍第1項之電子組件安裝用黏著劑，其 之熔化溫度侃㈣固性樹脂之一硬化 材枓之玻璃轉移溫度低lot或以上。 種電子組件安裝構造體，其包含： 一具有一電極之第一電子組件； 一具有一電極之第二電子 —電子Μ之電H 、、，# “極係電連接至該第 由硬化材料，該黏著劑硬化材料係藉由使-主要 …、口性樹赌製成之雷 成之电子組件安裝用黏著劑硬化而獲 祀ΧΡ/發明說明書(補件)/96 11/961胸 17 200814257 得且連接該兩個電子組件， 其中，該黏著劑硬化材料中含有具有溶化溫度低於該熱 固性樹脂硬化材料之玻璃轉移溫度的金屬顆粒。 8.如申請專利範圍帛7項之電子組件安裝構造體，其中 該等金屬顆粒之熔化溫度係比該熱固性樹脂硬化材料 玻璃轉移溫度低1 0°c或以上。 '
    312XP/發明說明書(補件)/96-11/96134544 18
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JP4830744B2 (ja) 2011-12-07
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CN101361413A (zh) 2009-02-04
JP2008069316A (ja) 2008-03-27

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