TW200806127A - Method for producing electrically conductive surfaces on a support - Google Patents

Method for producing electrically conductive surfaces on a support Download PDF

Info

Publication number
TW200806127A
TW200806127A TW096121489A TW96121489A TW200806127A TW 200806127 A TW200806127 A TW 200806127A TW 096121489 A TW096121489 A TW 096121489A TW 96121489 A TW96121489 A TW 96121489A TW 200806127 A TW200806127 A TW 200806127A
Authority
TW
Taiwan
Prior art keywords
support
conductive
structured
coating
layer
Prior art date
Application number
TW096121489A
Other languages
English (en)
Chinese (zh)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Schneider
Juergen Pfister
Norbert Wagner
Dieter Hentschel
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of TW200806127A publication Critical patent/TW200806127A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025Abrading, e.g. grinding or sand blasting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789Aqueous acid solution, e.g. for cleaning or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097Corona discharge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Chemically Coating (AREA)
TW096121489A 2006-06-14 2007-06-14 Method for producing electrically conductive surfaces on a support TW200806127A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06115487 2006-06-14

Publications (1)

Publication Number Publication Date
TW200806127A true TW200806127A (en) 2008-01-16

Family

ID=38461132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121489A TW200806127A (en) 2006-06-14 2007-06-14 Method for producing electrically conductive surfaces on a support

Country Status (11)

Country Link
US (1) US20090285976A1 (enExample)
EP (1) EP2033501A1 (enExample)
JP (1) JP2009539593A (enExample)
KR (1) KR20090025337A (enExample)
CN (1) CN101491166B (enExample)
BR (1) BRPI0712709A2 (enExample)
CA (1) CA2654797A1 (enExample)
IL (1) IL195620A0 (enExample)
RU (1) RU2436266C2 (enExample)
TW (1) TW200806127A (enExample)
WO (1) WO2007144322A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI398198B (zh) * 2010-09-13 2013-06-01 Zhen Ding Technology Co Ltd 具有接地屏蔽結構之電路板及其製作方法
TWI473118B (zh) * 2012-03-15 2015-02-11 Nat Univ Kaohsiung Polyethylene dioxythiophene - polystyrene sulfonate conductive liquid and conductive film formed by it
TWI580059B (zh) * 2008-06-18 2017-04-21 巴地斯顏料化工廠 製造用於太陽能電池之電極之方法

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WO2008101884A2 (de) * 2007-02-20 2008-08-28 Basf Se Verfahren zur kontaktierung elektrischer bauelemente
ATE474080T1 (de) 2007-02-20 2010-07-15 Basf Se Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
WO2009144186A2 (de) 2008-05-30 2009-12-03 Basf Se Verfahren zur herstellung von transparenten leitfähigen oxiden
US20110266158A1 (en) * 2008-06-19 2011-11-03 Fundacion Cidetec Method for electrochemically covering an insulating substrate
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
DE102009009650B4 (de) * 2009-02-19 2013-10-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung
US8585911B2 (en) * 2009-03-18 2013-11-19 Kuo-Ching Chiang Thin film antenna and the method of forming the same
US20170038658A1 (en) 2011-09-30 2017-02-09 View, Inc. Particle removal during fabrication of electrochromic devices
US9007674B2 (en) 2011-09-30 2015-04-14 View, Inc. Defect-mitigation layers in electrochromic devices
KR101009442B1 (ko) * 2009-04-15 2011-01-19 한국과학기술연구원 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름
WO2010126876A1 (en) * 2009-04-27 2010-11-04 Drexel University Transparent conformal polymer antennas for rfid and other wireless communications applications
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
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DE102009045061A1 (de) 2009-09-28 2011-03-31 Basf Se Verfahren zur Herstellung von elektrisch leitfähigen, strukturierten oder vollflächigen Oberflächen auf einem Träger
FR2952384B1 (fr) * 2009-11-10 2012-12-14 Commissariat Energie Atomique Depot selectif de nanoparticules
KR101046545B1 (ko) * 2009-12-22 2011-07-05 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 적층체의 제조 방법 및 적층체
MX2012009464A (es) * 2010-02-17 2012-09-12 Basf Se Proceso para producir uniones conductoras de electricidad entre celdas solares.
WO2011109660A2 (en) * 2010-03-04 2011-09-09 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
KR101204539B1 (ko) * 2010-08-27 2012-11-23 삼성전기주식회사 에너지 저장 장치의 전극 제조용 도핑 장치 및 이를 이용한 전극 제조 방법
CN102404934B (zh) * 2010-09-09 2015-01-14 富葵精密组件(深圳)有限公司 电路板基板及其制作方法
US9475946B2 (en) * 2011-09-30 2016-10-25 Ppg Industries Ohio, Inc. Graphenic carbon particle co-dispersions and methods of making same
EP2785896B1 (de) * 2011-12-02 2015-09-23 Altana AG Verfahren zur herstellung elektrisch leitfähiger strukturen auf nichtleitenden substraten und auf diese weise erzeugte strukturen
US9648751B2 (en) 2012-01-13 2017-05-09 Arjo Wiggins Fine Papers Limited Method for producing a sheet
US9005483B2 (en) 2012-02-10 2015-04-14 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof
EP2812923B1 (en) 2012-02-10 2019-11-27 Lockheed Martin Corporation Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof
CN102580905B (zh) * 2012-02-15 2013-11-20 德州华源生态科技有限公司 并条、粗纱胶辊导电涂层的处理方法
RU2516008C2 (ru) * 2012-06-20 2014-05-20 Закрытое акционерное общество "Галилео Нанотех" Способ изготовления электропроводящей поверхности на полимерном рулонном материале
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Publication number Priority date Publication date Assignee Title
TWI580059B (zh) * 2008-06-18 2017-04-21 巴地斯顏料化工廠 製造用於太陽能電池之電極之方法
TWI398198B (zh) * 2010-09-13 2013-06-01 Zhen Ding Technology Co Ltd 具有接地屏蔽結構之電路板及其製作方法
TWI473118B (zh) * 2012-03-15 2015-02-11 Nat Univ Kaohsiung Polyethylene dioxythiophene - polystyrene sulfonate conductive liquid and conductive film formed by it

Also Published As

Publication number Publication date
IL195620A0 (en) 2009-09-01
CN101491166A (zh) 2009-07-22
CA2654797A1 (en) 2007-12-21
KR20090025337A (ko) 2009-03-10
US20090285976A1 (en) 2009-11-19
JP2009539593A (ja) 2009-11-19
BRPI0712709A2 (pt) 2012-05-22
WO2007144322A1 (de) 2007-12-21
RU2009100627A (ru) 2010-07-20
RU2436266C2 (ru) 2011-12-10
EP2033501A1 (de) 2009-03-11
CN101491166B (zh) 2011-09-28

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