CN102404934B - 电路板基板及其制作方法 - Google Patents
电路板基板及其制作方法 Download PDFInfo
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- CN102404934B CN102404934B CN201010277646.6A CN201010277646A CN102404934B CN 102404934 B CN102404934 B CN 102404934B CN 201010277646 A CN201010277646 A CN 201010277646A CN 102404934 B CN102404934 B CN 102404934B
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- epoxy resin
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CN201010277646.6A CN102404934B (zh) | 2010-09-09 | 2010-09-09 | 电路板基板及其制作方法 |
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CN201010277646.6A CN102404934B (zh) | 2010-09-09 | 2010-09-09 | 电路板基板及其制作方法 |
Publications (2)
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CN102404934A CN102404934A (zh) | 2012-04-04 |
CN102404934B true CN102404934B (zh) | 2015-01-14 |
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CN201010277646.6A Active CN102404934B (zh) | 2010-09-09 | 2010-09-09 | 电路板基板及其制作方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103374205A (zh) * | 2012-04-26 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | 环氧树脂复合材料及其制作方法 |
CN103642202B (zh) * | 2013-12-16 | 2016-04-13 | 湖南省映鸿科技有限公司 | 一种陶瓷粉改性聚氨酯/环氧树脂互穿网络弹性体 |
JP5954675B2 (ja) * | 2014-09-26 | 2016-07-20 | パナソニックIpマネジメント株式会社 | 両面金属張積層板の製造方法、プリント配線板の製造方法、多層積層板の製造方法、及び多層プリント配線板の製造方法 |
CN108470687A (zh) * | 2018-03-22 | 2018-08-31 | 江西芯创光电有限公司 | 一种覆膜制板方法 |
CN111793348A (zh) * | 2020-07-21 | 2020-10-20 | 明光瑞智电子科技有限公司 | 一种高频高速电路基板用的高性能无卤树脂组合物 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101072468A (zh) * | 2006-05-11 | 2007-11-14 | 冠品化学股份有限公司 | 软性印刷电路板基板 |
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BRPI0712709A2 (pt) * | 2006-06-14 | 2012-05-22 | Basf Se | método para produzir superfìcies de área-inteira ou estruturada, eletricamente condutivas sobre um suporte. |
US8866018B2 (en) * | 2009-01-12 | 2014-10-21 | Oak-Mitsui Technologies Llc | Passive electrical devices and methods of fabricating passive electrical devices |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101072468A (zh) * | 2006-05-11 | 2007-11-14 | 冠品化学股份有限公司 | 软性印刷电路板基板 |
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CN102404934A (zh) | 2012-04-04 |
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Effective date of registration: 20160113 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Effective date of registration: 20170705 Address after: No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhending Technology Co., Ltd. Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |