EP2033501A1 - Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger - Google Patents

Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger

Info

Publication number
EP2033501A1
EP2033501A1 EP07765353A EP07765353A EP2033501A1 EP 2033501 A1 EP2033501 A1 EP 2033501A1 EP 07765353 A EP07765353 A EP 07765353A EP 07765353 A EP07765353 A EP 07765353A EP 2033501 A1 EP2033501 A1 EP 2033501A1
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
structured
full
conductive particles
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07765353A
Other languages
German (de)
English (en)
French (fr)
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Schneider
Jürgen PFISTER
Norbert Wagner
Dieter Hentschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to EP07765353A priority Critical patent/EP2033501A1/de
Publication of EP2033501A1 publication Critical patent/EP2033501A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097—Corona discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to a method for the production of electrically conductive, structured or full surface surfaces on a support.
  • the method according to the invention is suitable, for example, for producing printed conductors on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, printed conductors in solar cells or in LCD or plasma picture screens or galvanically coated products in any desired form. Also, the method is useful for making decorative or functional surfaces on products that can be used, for example, to shield from electromagnetic radiation, to conduct heat, or to package. Finally, thin metal foils or one or two-sided metal-clad polymer carriers can also be produced by the process.
  • structured metal layers are produced on a carrier body, for example, by first applying a structured adhesive layer to the carrier body.
  • a metal foil or a metal powder is fixed.
  • the structuring of the metal layer takes place by mechanical removal of the regions of the metal foil or of the metal powder which are not connected to the adhesive layer or to the carrier body.
  • Such a method is described for example in DE-A 101 45 749.
  • a surface of the carrier is at least partially covered with conductive particles.
  • a passivation layer is applied to the particle layer formed by the conductive particles.
  • the passivation layer is formed as a negative image of the conductive structure.
  • the conductive structure is formed.
  • the conductive structure acts, for example, by electroless and / or galvanic coating.
  • a disadvantage of this method known from the prior art is that the carrier is in each case initially covered over the full area with a metal foil or an electrically conductive powder. is covered. This requires a large amount of material and then a complex process to remove the metal again or only to continue to coat the areas that are to form the electrically conductive structure.
  • DE-A 1 490 061 relates to a method for producing printed circuits, in which an adhesive in the form of the structure of the conductor tracks is first applied to a carrier. The application of the adhesive takes place for example by screen printing. Subsequently, a metal powder is applied to the adhesive. The excess metal powder, d. H. the metal powder, which does not adhere to the adhesive layer, is then removed again. Finally, the electrically conductive tracks are produced by a galvanic coating.
  • a method in which a base support substrate is already provided with conductive particles and then the part of the base support substrate, which is not intended to contain an electrically conductive surface is passivated by a printing process, is known for example from DE-A 102 47 746. According to this document, after passivation, the part of the surface which has not been passivated is activated, for example, by a galvanic coating.
  • WO 83/02538 discloses a method for producing electrical conductor tracks on a carrier. For this purpose, a mixture of a metal powder and a polymer is first applied to the carrier in the form of the conductor tracks. Subsequently, the polymer is cured. In a next step, a part of the metal powder is replaced by a more noble metal by an electrochemical reaction. Finally, an additional metal layer is applied by galvanization.
  • Another disadvantage of the already known methods is the slow electroless and / or galvanic metallization.
  • the number of particles exposed on the surface which are available as growth nuclei for electroless and / or galvanic metallization, is low. This is u.a. also because when applying, for example, pressure dispersions, the heavy metal particles sink into the matrix material and thus only a few metal particles remain on the surface.
  • the object of the invention is to provide an alternative method by which electrically conductive, structured or full-surface surfaces can be produced on a carrier, in which these surfaces are homogeneous and continuously electrically conductive.
  • the object is achieved by a method for the production of electrically conductive, structured or full surface surfaces on a support, which comprises the following steps:
  • a carrier to which the electrically conductive, structured or full-surface surface is applied for example, rigid or flexible carrier are suitable.
  • the carrier is not electrically conductive. This means that the resistivity is more than 10 9 Ohm x cm is.
  • Suitable carriers are, for example, reinforced or unreinforced polymers, as are commonly used for printed circuit boards.
  • Suitable polymers are epoxy resins, or modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, aramid-reinforced or glass-fiber reinforced or paper-reinforced epoxy resins (for example FR4), glass fiber reinforced plastics, liquid cristal polymers (LCP), polyphenylene sulfides (PPS), polyoxymethylenes (POM), polyaryletherketones (PAEK), polyetheretherketones (PEEK), polyamides (PA), polycarbonates (PC), polybutylene terephthalates (PBT), polyethylene terephthalates (PET), polyimides (PI) , Polyimide resins, cyanate esters, bismaleimide-triazine resins, nylon, vinyl ester resins, polyesters, polyester resins, polyamides, polyanilines, phenolic resins, polypyrroles, polyethylene naphthalate (PEN), polymethylmethacrylate
  • suitable substrates composites, foam-like polymers, polystyrene ®, styrodur ®, polyurethanes (PU), ceramic surfaces, textiles, paperboard, cardboard, paper, polymer coated paper, wood, mineral materials, silicon, glass, plant tissue and animal tissue.
  • the carrier can be both rigid and flexible.
  • the structured or full-surface base layer with a dispersion containing electrically conductive particles in a matrix material is applied to the support.
  • the electrically conductive particles may be particles of any geometry made of any electrically conductive material, of mixtures of different electrically conductive materials or of mixtures of electrically conductive and non-conductive materials.
  • Suitable electrically conductive materials are, for example Carbon, for example in the form of carbon black, graphite or carbon nanotubes, electrically conductive metal complexes, conductive organic compounds or conductive polymers or metals, preferably zinc, nickel, copper, tin, cobalt, manganese, iron, magnesium, lead, chromium, bismuth, silver, Gold, aluminum, titanium, palladium, platinum, tantalum and alloys thereof or metal mixtures containing at least one of these metals.
  • suitable alloys are CuZn, CuSn, CuNi, SnPb, SnBi, SnCo, NiPb, ZnFe, ZnNi, ZnCo and ZnMn. Particularly preferred are aluminum, iron, copper, nickel, zinc, carbon and mixtures thereof.
  • the electrically conductive particles preferably have an average particle diameter of from 0.001 to 100 ⁇ m, preferably from 0.005 to 50 ⁇ m and particularly preferably from 0.01 to 10 ⁇ m.
  • the average particle diameter can be determined by means of laser diffraction measurement, for example on a Microtrac X100 device.
  • the distribution of the particle diameter depends on their production method. Typically, the diameter distribution has only one maximum, but several maxima are also possible.
  • the surface of the electrically conductive particle can be provided at least partially with a coating ("coating").
  • Suitable coatings may be inorganic (for example SiO 2 , phosphates) or organic in nature.
  • the electrically conductive particles may also be coated with a metal or metal oxide.
  • the metal may be in partially oxidized form.
  • the electrically conductive particles can be formed by mixing these metals. It is particularly preferred if the metals are selected from the group consisting of aluminum, iron, copper, nickel and zinc.
  • the electrically conductive particles may also include a first metal and a second metal in which the second metal is in the form of an alloy (with the first metal or one or more other metals), or the electrically conductive particles contain two different alloys.
  • the shape of the electrically conductive particles has an influence on the properties of the dispersion after a coating.
  • the shape of the electrically conductive particles may be, for example, acicular, cylindrical, plate-shaped or spherical. These particle shapes represent idealized forms, where when the actual shape, for example due to production, more or less strongly deviate from this.
  • drop-shaped particles in the context of the present invention are a real deviation of the idealized spherical shape.
  • Electrically conductive particles having various particle shapes are commercially available.
  • the individual mixing partners can also have different particle shapes and / or particle sizes. It is also possible to use mixtures of only one type of electrically conductive particles having different particle sizes and / or particle shapes. In the case of different particle shapes and / or particle sizes, the metals aluminum, iron, copper, nickel and zinc and carbon are also preferred.
  • the electrically conductive particles in the form of their powders can be added to the dispersion.
  • Such powders for example metal powders
  • metal powders are common commercial products or can be easily prepared by known methods, such as by electrolytic deposition or chemical reduction from solutions of metal salts or by reduction of an oxidic powder, for example by hydrogen, by spraying or atomizing a molten metal, especially in cooling media , for example, gases or water. Preference is given to the gas and water atomization and the reduction of metal oxides.
  • Metal powders of the preferred grain size can also be made by grinding coarser metal powders. For this purpose, for example, a ball mill is suitable.
  • the carbonyl iron powder process is preferred for the production of carbonyl iron powder.
  • This is done by thermal decomposition of iron pentacarbonyl. This is described, for example, in Ullman's Encyclopedia of Industrial Chemistry, 5th Edition, Vol. A14, page 599.
  • the decomposition of the iron pentacarbonyl can be carried out, for example, at elevated temperatures and elevated pressures in a heatable decomposer comprising a tube made of a refractory material such as quartz glass or V2A steel in a preferably vertical position, that of a heater, for example consisting of heating baths, heating wires or surrounded by a heating medium flows through the heating jacket.
  • Platelet-shaped electrically conductive particles can be controlled by optimized conditions in the production process or be obtained afterwards by mechanical treatment, for example by treatment in a stirred ball mill. Based on the total weight of the dried coating, the proportion of electrically conductive particles in the range of 20 to 98 wt .-%. A preferred range of the proportion of the electrically conductive particles is from 30 to 95% by weight, based on the total weight of the dried coating.
  • Suitable matrix materials are, for example, binders with pigment-affine anchoring group, natural and synthetic polymers and their derivatives, natural resins and synthetic resins and their derivatives, natural rubber, synthetic rubber, proteins, cellulose derivatives, drying and non-drying oils and the like. These can, but do not have to be, chemically or physically curing, for example air-hardening, radiation-curing or temperature-curing.
  • the matrix material is a polymer or polymer mixture.
  • Preferred polymers as the matrix material are ABS (acrylonitrile-butadiene-styrene); ASA (acrylonitrile-styrene-acrylate); acrylated acrylates; alkyd resins; Alkylvinylacetate; Alkylene vinyl acetate copolymers, especially methylene vinyl acetate, ethylene vinyl acetate, butylene vinyl acetate; Alkylenvinylchlorid copolymers; amino resins; Aldehyde and ketone resins; Cellulose and cellulose derivatives, in particular hydroxyalkylcellulose, cellulose esters, such as acetates, propionates, butyrates, carboxyalkylcelluloses, cellulose nitrate; epoxy acrylates; epoxy resins; modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, gly
  • Particularly preferred polymers as matrix material are acrylates, acrylate resins, cellulose derivatives, methacrylates, methacrylate resins, melamine and amino resins, polyalkylenes, polyimides, epoxy resins, modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolaks.
  • Resins brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, vinyl ethers, and phenolic resins, polyurethanes, polyesters, polyvinyl acetals, polyvinyl acetates, polystyrenes, polystyrene copolymers, polystyrene acrylates, styrene-butadiene block copolymers, alkylene vinyl acetates and vinyl chloride copolymers, polyamides and their copolymers.
  • the matrix material for the dispersion is preferably thermally or radiation-curing resins, for example modified epoxy resins, such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, polyimides, melamine resins and amino resins, polyurethanes, polyesters and cellulose derivatives.
  • modified epoxy resins such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, polyimides, melamine resins and amino resins, polyurethanes, polyesters and cellulose derivatives.
  • the proportion of the organic binder component is from 0.01 to 60% by weight.
  • the proportion is 0.1 to 45 wt .-%, more preferably 0.5 to 35 wt .-%.
  • the dispersion may furthermore be admixed with a solvent or a solvent mixture in order to adjust the viscosity of the dispersion which is suitable for the respective application method.
  • Suitable solvents are, for example, aliphatic and aromatic hydrocarbons (for example n-octane, cyclohexane, toluene, xylene), alcohols (for example methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, amyl alcohol), Polyhydric alcohols, such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol, alkyl esters (for example methyl acetate, ethyl acetate, propyl acetate, butyl alcohol).
  • aliphatic and aromatic hydrocarbons for example n-octane, cyclohexane, toluene, xylene
  • alcohols for example methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, amyl alcohol
  • Polyhydric alcohols such as glyce
  • Preferred solvents are alcohols (for example ethanol, 1-propanol, 2-propanol, butanol), alkoxyalcohols (for example methoxypropanol, ethoxypropanol, butylglycol, butyldiglycol), butyrolactone, diglycol dialkyl ethers, diglycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, esters (cf.
  • alcohols for example ethanol, 1-propanol, 2-propanol, butanol
  • alkoxyalcohols for example methoxypropanol, ethoxypropanol, butylglycol, butyldiglycol
  • butyrolactone diglycol dialkyl ethers, diglycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, esters
  • ethers for example tetrahydrofuran
  • polyhydric alcohols such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol,
  • alkoxy alcohols for example ethoxypropanol, butylglycol, butyldiglycol
  • polyhydric alcohols such as glycerol, esters (for example butyldiglycol acetate, butylglycol acetate, dipropylene glycol methyl ether acetates), water, cyclohexanone, butyrolactone, N-methyl-pyrrolidone, DBE and mixtures thereof as solvent are particularly preferred.
  • liquid matrix materials eg liquid epoxy resins, acrylate esters
  • the respective viscosity can alternatively also be adjusted via the temperature during the application, or via a combination of solvent and temperature
  • the dispersion may further contain a dispersant component. This consists of one or more dispersants.
  • dispersants known to the person skilled in the art for use in dispersions and described in the prior art are suitable.
  • Preferred dispersants are surfactants or surfactant mixtures, for example anionic, cationic, amphoteric or nonionic surfactants.
  • anionic surfactants are alkali metal salts of organic carboxylic acids having chain lengths of 8 to 30 carbon atoms, preferably 12 to 18 carbon atoms. These are in the
  • soaps Generally referred to as soaps. Usually they are called sodium, potassium or
  • alkyl sulfates and alkyl or alkylaryl sulfonates having 8 to 30 carbon atoms, preferably 12 to 18 carbon atoms can be used as anionic surfactants.
  • Particularly suitable compounds are alkali dodecyl sulfates, for example sodium dodecyl sulfate or potassium dodecyl sulfate, and alkali metal salts of C 2 -C 6 -
  • Paraffin sulfonic acids Furthermore, sodium dodecylbenzenesulfonate and sodium dioctylsulfonosuccinate are suitable.
  • Suitable cationic surfactants are salts of amines or diamines, quaternary ammonium salts, such as, for example, hexadecyltrimethylammonium bromide, and salts of long-chain substituted cyclic amines, such as pyridine, morpholine, piperidine.
  • quaternary ammonium salts such as, for example, hexadecyltrimethylammonium bromide of trialkylamines are used.
  • the alkyl radicals preferably have 1 to 20 carbon atoms therein.
  • nonionic surfactants can be used as the dispersant component.
  • Nonionic surfactants are described, for example, in CD Römpp Chemie Lexikon - Version 1.0, Stuttgart / New York: Georg Thieme Verlag 1995, keyword "nonionic surfactants”.
  • Suitable nonionic surfactants are, for example, polyethylene oxide or polypropylene oxide-based substances, such as Pluronic® or Tetronic® from BASF Aktiengesellschaft.
  • Polyalkylene glycols suitable as nonionic surfactants generally have a number average molecular weight M n in the range from 1000 to 15000 g / mol, preferably 2000 to 13000 g / mol, particularly preferably 4000 to 1000 g / mol.
  • Preferred nonionic surfactants are polyethylene glycols.
  • the polyalkylene glycols are known per se or can be prepared by processes known per se, for example by anionic polymerization with alkali metal hydroxides, such as sodium or potassium hydroxide or alkali metal alkoxides, such as sodium methoxide, sodium or potassium or potassium isopropoxide, as catalysts and with the addition of at least one starter molecule, the 2 to 8, preferably 2 to 6, bonded reactive hydrogen atoms, or by cationic polymerization with Lewis acids, such as antimony pentachloride, boron fluoride etherate or bleaching earth, as catalysts of one or more alkylenoxides having 2 to 4 carbon atoms in the alkylene radical.
  • alkali metal hydroxides such as sodium or potassium hydroxide or alkali metal alkoxides, such as sodium methoxide, sodium or potassium or potassium isopropoxide
  • Lewis acids such as antimony pentachloride, boron fluoride etherate or bleaching earth
  • Suitable alkylene oxides are, for example, tetrahydrofuran, 1, 2 or 2,3-butylene oxide, styrene oxide and preferably ethylene oxide and / or 1, 2-propylene oxide.
  • the alkylene oxides can be used individually, alternately in succession or as mixtures.
  • Possible starter molecules are, for example: water, organic dicarboxylic acids such as succinic acid, adipic acid, phthalic acid or terephthalic acid, aliphatic or a- romantic, optionally N-mono-, N 1 N- or N, N'-dialkyl-substituted diamines having 1 to 4 carbon atoms in the alkyl radical, such as optionally mono- and dialkyl-substituted ethylenediamine, diethylenetriamine, triethylenetetramine, 1,3-propylenediamine, 1,3- or 1,4-butylenediamine, 1, 2-, 1, 3-, 1, 4-, 1, 5 or 1,6-hexamethylenediamine.
  • organic dicarboxylic acids such as succinic acid, adipic acid, phthalic acid or terephthalic acid, aliphatic or a- romantic, optionally N-mono-, N 1 N- or N, N'-dialkyl-substituted diamines having 1
  • alkanolamines for example ethanolamine, N-methyl- and N-ethylethanolamine
  • dialkanolamines for example diethanolamine, N-methyl- and N-ethyldiethanolamine
  • trialkanolamines for example triethanolamine, and ammonia.
  • polyhydric, in particular dihydric, trihydric or higher polyhydric alcohols such as ethanediol, propanediol 1, 2 and 1, 3, diethylene glycol, dipropylene glycol, butanediol 1, 4, hexanediol 1, 6, glycerol, trimethylolpropane, pentaerythritol, and sucrose, sorbitol and sorbitol.
  • esterified polyalkylene glycols for example the mono-, di-, tri- or polyesters of the stated polyalkylene glycols obtained by reaction of the terminal OH groups of said polyalkylene glycols with organic acids, preferably adipic acid or terephthalic acid, in a manner known per se can be produced.
  • Nonionic surfactants are substances produced by alkoxylation of compounds with active hydrogen atoms, for example addition products of alkylene oxide onto fatty alcohols, oxo alcohols or alkylphenols.
  • ethylene oxide or 1,2-propylene oxide can be used for the alkoxylation.
  • nonionic surfactants are alkoxylated or non-alkoxylated sugar esters or sugar ethers.
  • Sugar ethers are alkylglycosides obtained by reaction of fatty alcohols with sugars.
  • Sugar esters are obtained by reacting sugars with fatty acids. The sugar, fatty alcohols and fatty acids necessary for the preparation of the substances mentioned are known to the person skilled in the art.
  • Suitable sugars are described for example in Beyer / Walter, textbook of organic chemistry, S. Hirzel Verlag Stuttgart, 19th edition, 1981, pages 392 to 425. Possible sugars are D-sorbitol and the sorbitan obtained by dehydration of D-sorbitol.
  • Suitable fatty acids are saturated or mono- or polyunsaturated unbranched or branched carboxylic acids having 6 to 26, preferably 8 to 22, particularly preferably 10 to 20 C atoms, as described, for example, in CD Römpp Chemie Lexikon, Version 1.0, Stuttgart / New York: Georg Thieme Verlag 1995, keyword "fatty acids" are called.
  • Conceivable are fatty acids, such as lauric acid, palmitic acid, stearic acid and oleic acid.
  • Suitable fatty alcohols have the same carbon skeleton as the compounds described as suitable fatty acids.
  • sugar ethers, sugar esters and the processes for their preparation are known in the art.
  • Preferred sugar ethers are prepared by known processes by reacting the said sugars with the stated fatty alcohols.
  • Preferred sugar esters are prepared by known processes by reacting the said sugars with said fatty acids.
  • Suitable sugar esters are mono-, di- and triesters of sorbitans with fatty acids, in particular sorbitan monolaurate, sorbitan dilaurate, sorbitan trilaurate, sorbitan monooleate, sorbitan dioleate, sorbitan trioleate, sorbitan monopalmitate, sorbitan palmitate, sorbitan tripalmitate, sorbitan monostearate, sorbitan distearate, sorbitan tristearate and sorbitan sesquioleate, a mixture of sorbitan mono - and diesters of oleic acid.
  • Possible dispersants are thus alkoxylated sugar ethers and sugar esters, which are obtained by alkoxylation of said sugar ethers and sugar esters.
  • Preferred alkoxylating agents are ethylene oxide and 1,2-propylene oxide.
  • the degree of alkoxylation is generally between 1 and 20, preferably 2 and 10, more preferably 2 and 6.
  • polysorbates which are obtained by ethoxylation of the sorbitan esters described above, for example described in CD Römpp Chemie Lexikon - Version 1.0, Stuttgart / New York: Georg Thieme Verlag 1995, keyword "Polysorbate”.
  • Suitable polysorbates are polyethoxysorbitan, stearate, palmitate, tri-stearate, oleate, trioleate, in particular polyethoxysorbitan, which for example as Tween ® 60, the ICI Amer- rica Inc. (described for example in CD Römpp Chemie Lexikon - Version 1.0 , Stuttgart / New York: Georg Thieme Verlag 1995, keyword "Tween ® ").
  • the dispersant may be used in the range of 0.01 to 50% by weight based on the total weight of the dispersion.
  • the proportion is preferably 0.1 to 25% by weight, more preferably 0.2 to 10% by weight.
  • the dispersion of the invention may contain a filler component.
  • This can consist of one or more fillers.
  • the filler component of the metallizable composition may contain fibrous, layered or particulate fillers or mixtures thereof. These are preferably commercially available products, such as carbon and mineral fillers.
  • fillers or reinforcing materials such as glass powder, mineral fibers, whiskers, aluminum hydroxide, metal oxides such as alumina or iron oxide, mica, quartz powder, calcium carbonate, barium sulfate, titanium dioxide or wollastonite can be used.
  • thixotropic agents for example silica, silicates, such as aerosils or bentonites or organic thixotropic agents and thickeners, such as polyacrylic acid, polyurethanes, hydrogenated castor oil, dyes, fatty acids, fatty acid amides, plasticizers, wetting agents, defoamers, lubricants, Dry substances, crosslinkers, photoinitiators, complexing agents, waxes, pigments, conductive polymer particles, can be used.
  • the proportion of the filler component based on the total weight of the dry coating is preferably 0.01 to 50 wt .-%. Further preferred are 0.1 to 30 wt .-%, particularly preferably 0.3 to 20 wt .-%.
  • processing aids and stabilizers such as UV stabilizers, lubricants, corrosion inhibitors and flame retardants can be present in the dispersion according to the invention.
  • their proportion based on the total weight of the dispersion 0.01 to 5 wt .-%.
  • the proportion is 0.05 to 3 wt .-%.
  • the particles are for the most part within the matrix, so that no continuous electrical conductive surface was generated.
  • the matrix material can be cured chemically, for example by polymerization, polyaddition or polycondensation of the matrix material, for example by UV radiation, electron radiation, microwave radiation, IR radiation or temperature, or by purely physical means by evaporation of the solvent are dried. A combination of drying by physical and chemical means is possible.
  • the electrically conductive particles contained in the dispersion are at least partially exposed in order to obtain already electrically conductive nuclei at which the metal ions form during the subsequent electroless and / or galvanic metallization to form a metal layer can separate. If the particles consist of materials which oxidize easily, it may additionally be necessary to at least partially remove the oxide layer beforehand. Depending on the implementation of the method, for example when using acidic electrolyte solutions, the removal of the oxide layer can already take place simultaneously with the onset of metallization without the need for an additional process step.
  • An advantage of exposing the particles prior to the electroless and / or galvanic metallization is that, by exposing the particles, an approximately 5 to 10% by weight lower proportion of electrically conductive particles must be present in the coating in order to produce a continuous electrically conductive layer Surface as it does when the particles are not exposed. Further advantages are the homogeneity and consistency of the coatings produced and the high process reliability.
  • the exposure of the electrically conductive particles can be done either mechanically, for example by brushing, grinding, milling, sand blasting or irradiation with supercritical carbon dioxide, physically, for example by heating, laser, UV light, corona or plasma discharge, or chemically.
  • a suitable chemical or chemical mixture is preferably used for the matrix material.
  • the matrix material can be at least partially dissolved and washed down by a solvent on the surface or can be at least partially destroyed by means of suitable reagents, the chemical structure of the matrix material, whereby the electrically conductive particles are exposed.
  • Reagents that swell the matrix material are also suitable for exposing the electrically conductive particles.
  • the swelling results in cavities in which the metal ions to be deposited can penetrate from the electrolyte solution, as a result of which a larger number of electrically conductive particles can be metallized.
  • the adhesion, the homogeneity and the continuity of the subsequently electrolessly and / or electrodeposited metal layer are significantly better than in the methods described in the prior art. Due to the higher number of exposed electrically conductive particles, the process speed during metallization is also considerably higher, which allows additional cost advantages to be achieved.
  • the exposure of the electroconductive particles is preferably carried out with an oxidizing agent.
  • the oxidizing agent breaks up bonds in the matrix material, which allows the binder to be peeled off and thereby expose the particles.
  • Suitable oxidizing agents are, for example, manganates, for example potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, oxygen, oxygen in the presence of catalysts such as, for example, manganese, molybdenum, bismuth, tungsten and cobalt salts, ozone, vanadium pentoxide, Selenium dioxide, ammonium polysulfide solution, sulfur in the presence of ammonia or amines, manganese dioxide, potassium ferrate, dichromate / sulfuric acid, chromic acid in sulfuric acid.
  • manganates for example potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, oxygen, oxygen in the presence of catalysts such as, for example, manganese, molybdenum, bismuth, tungsten and cobalt salts, ozone, vanadium pentoxide, Selenium dioxide, ammonium polysulfide solution, sulfur in the presence
  • manganates for example potassium permanganate, potassium manganate, sodium permanganate; Sodium manganate, hydrogen peroxide, N-methylmorpholine N-oxide, percarbonates, for example sodium or potassium percarbonate, perborates, for example sodium or potassium perborate; Persulfates, for example sodium or potassium persulfate; sodium, potassium and ammonium peroxodi- and monosulfates, sodium hypochlorite, urea-hydrogen peroxide adducts, salts of oxohalogenic acids, such as chlorates or bromates or iodates, salts of haloperacids, such as Sodium periodate or sodium perchlorate, tetrabutylammonium peroxydisulfate, quinones, iron (III) salt solutions, vanadium pentoxide, pyridinium dichromate, hydrochloric acid, bromine, chlorine, dichromates.
  • potassium permanganate potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide and its adducts
  • perborates percarbonates, persulfates, peroxodisulfates, sodium hypochlorite and perchlorates.
  • acidic or alkaline chemicals and / or chemical mixtures are, for example, concentrated or dilute acids, such as acid, sulfuric acid, phosphoric acid or nitric acid.
  • organic acids such as formic acid or acetic acid, may be suitable depending on the matrix material.
  • Suitable alkaline chemicals and / or chemical mixtures are, for example, bases, such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • bases such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • the temperature may be increased during the process.
  • Solvents can also be used to expose the electrically conductive particles in the matrix material.
  • the solvent must be matched to the matrix material as the matrix material must dissolve in the solvent or swell through the solvent. If a solvent is used in which the matrix material dissolves, the base layer is only brought into contact with the solvent for a short time, so that the upper layer of the matrix material is dissolved and thereby becomes detached.
  • Preferred solvents are xylene, toluene, halogenated hydrocarbons, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diethylene glycol monobutyl ether.
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • diethylene glycol monobutyl ether diethylene glycol monobutyl ether.
  • the temperature during the dissolution process can be increased.
  • Suitable mechanical methods include, for example, brushing, grinding, abrasive polishing, or jet blasting, blasting, or supercritical carbon dioxide blasting.
  • a suitable abrasive is, for example, pumice.
  • the water jet preferably contains small solid particles, for example pumice flour (Al 2 O 3 ) having an average particle size distribution of 40 to 120 ⁇ m, preferably 60 to 80 ⁇ m, and quartz flour (SiO 2 ) with a particle size> 3 ⁇ m.
  • the oxide layer is at least partially removed.
  • the removal of the oxide layer can take place, for example, chemically and / or mechanically.
  • Suitable substances with which the base layer are treated are acids such as concentrated or dilute sulfuric acid or concentrated or dilute hydrochloric acid, citric acid, phosphoric acid, sulfamic acid, formic acid, acetic acid.
  • Suitable mechanical methods for removing the oxide layer from the electrically conductive particles are generally the same as the mechanical methods of exposing the particles.
  • the dispersion which is applied to the support adheres firmly to the support, in a preferred embodiment it is cleaned before the application of the structured or full-surface base layer by a dry process, a wet-chemical process and / or a mechanical process.
  • a wet-chemical process is particularly suitable rinsing the carrier with acidic or alkaline reagents or with suitable solvents. Also water in conjunction with ultrasound can be used.
  • Suitable acidic or alkaline reagents are, for example, hydrochloric acid, sulfuric acid or nitric acid, phosphoric acid or sodium hydroxide solution, potassium hydroxide solution or carbonates, such as potassium carbonate.
  • Suitable solvents are the same as they may be included in the dispersion for applying the base layer. Preferred solvents are alcohols, ketones and hydrocarbons, which are to be selected depending on the carrier material. Also, the oxidizing agents that have already been mentioned in the activation, can be used.
  • Mechanical methods of cleaning the substrate prior to applying the patterned or full-surface base layer are generally the same as they can be used to expose the electrically conductive particles and remove the oxide layer of the particles.
  • dry cleaning methods To remove dust and other particles that may affect the adhesion of the dispersion on the support, as well as for roughening the surface are particularly dry cleaning methods. These are, for example, dedusting by means of brushing and / or deionized air, corona discharge or low-pressure plasma and particle removal by means of rollers and / or rolls provided with an adhesive layer. By corona discharge and low-pressure plasma, the surface tension of the substrate is selectively increased, the substrate surface is cleaned of organic residues and thus improves both the wetting with the dispersion and the adhesion of the dispersion.
  • the structured or full-surface base layer is printed with the dispersion by any printing method on the support.
  • the printing process used to print the patterned surface is, for example, a web or sheet fed printing process, such as screen printing, gravure, flexo, letterpress, pad printing, ink jet printing, the Lasersonic® process as described in DE10051850, or offset printing.
  • Such coating methods are, for example, casting, brushing, knife coating, brushing, spraying, dipping, rolling, tumbling, fluidized bed or the like.
  • the layer thickness of the structured or full surface area produced by the printing or the coating method preferably varies between 0.01 and 50 ⁇ m, more preferably between 0.05 and 25 ⁇ m and particularly preferably between 0.1 and 15 ⁇ m.
  • the layers can be applied both over the entire surface as well as structured.
  • the dispersion is stirred or pumped in a storage container prior to application to the carrier.
  • stirring and / or pumping a possible sedimentation of the particles contained in the dispersion is prevented.
  • the dispersion is heated in the reservoir. This makes it possible to achieve an improved printed image of the base layer on the carrier, since a constant viscosity can be set by the tempering.
  • the temperature control is particularly necessary when the dispersion is heated, for example, by the stirring and / or pumping due to the energy input of the stirrer or the pump and thereby changes the viscosity thereof.
  • digital printing processes for example inkjet printing, LaserSonic® are particularly suitable in the case of a print application. These processes generally eliminate the cost of producing printing stencils, such as printing rolls or screens, as well as their constant change when several different structures need to be printed one behind the other. In the digital The new printing process can be converted to a new design without any need for retooling or downtime.
  • the dispersion In the case of application of the dispersion by means of the inkjet process, it is preferred to use electrically conductive particles having a maximum size of 15 ⁇ m, more preferably 10 ⁇ m, in order to prevent clogging of the inkjet nozzles.
  • the dispersion can be pumped by means of a pumped circulation, so that the particles do not settle.
  • the system can be heated to adjust the viscosity of the dispersion verdruckbar.
  • the carrier at its top and bottom with an electrically conductive structured or full-surface base layer.
  • the structured or full-surface electrically conductive base layers on the top side and the underside of the carrier can be electrically connected to one another.
  • a wall of a bore in the carrier is provided with an electrically conductive surface.
  • a sufficiently thin carrier it is not necessary to coat the wall of the bore with the dispersion, as in the electroless and / or electroplating with a sufficiently long coating time also within the hole forms a metal layer by the top and Grow together underside of the carrier into the hole growing metal layers, whereby the electrical connection of the electrically conductive structured or full-surface surfaces of the top and bottom of the carrier is formed.
  • the dispersion with which the structured or full-surface base layer is applied to the support at least partially cures after application.
  • hardening takes place as described above, for example by the action of heat, light (UVA / is) and / or radiation, for example infrared radiation, electron radiation, gamma radiation, X-radiation, microwaves.
  • UVA / is light
  • radiation for example infrared radiation, electron radiation, gamma radiation, X-radiation, microwaves.
  • a suitable be added can also be achieved by combining various methods, for example by combining UV radiation and heat. The combination of the curing processes can be carried out simultaneously or sequentially.
  • UV radiation can only be used to first harden the layer so that the formed structures no longer flow apart. Thereafter, the layer can be cured by exposure to heat. The heat can be done directly after the UV-curing and / or after the galvanic metallization. After at least partial curing - as already described above - in a preferred variant, the electrically conductive particles are at least partially exposed.
  • at least one metal layer is formed on the structured or full-surface base layer by electroless and / or galvanic coating. The coating can be carried out by any method known to those skilled in the art. Also, any conventional metal coating can be applied by the coating method.
  • the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate.
  • all metals which are nobler or equally noble as the most noble metal of the dispersion can be used for electroless and / or electroplating.
  • Typical metals which are deposited by electroplating on electrically conductive surfaces are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.
  • the thicknesses of the one or more deposited layers are within the usual range known to the person skilled in the art and are not essential to the invention.
  • Suitable electrolyte solutions which can be used to coat electrically conductive structures are those skilled in the art, for example, Werner Jillek, Gustl Keller, Manual of printed circuit board technology. Eugen G. Leuze Verlag, 2003, Volume 4, pages 332-352 known.
  • the carrier For coating the electrically conductive structured or full surface on the carrier, the carrier is first supplied to the bath with the electrolyte solution. The carrier is then conveyed through the bath, wherein the electrically conductive particles contained in the previously applied structured or full-surface base layer are contacted with at least one cathode.
  • any customary, known in the art, suitable cathode can be used. As long as the cathode contacts the structured or solid surface, metal ions are deposited from the electrolyte solution to form a metal layer on the surface.
  • a suitable device in which the structured or full-surface electrically conductive base layer is galvanically coated, generally comprises at least one bath, one anode and one cathode, wherein the bath contains an electrolyte solution containing at least one metal salt. From the electrolyte solution, metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer.
  • the at least one cathode is for this purpose brought into contact with the base layer of the substrate to be coated, while the substrate is conveyed through the bath.
  • electroplating processes for galvanic coating, all electroplating processes known to those skilled in the art are suitable. Such electroplating processes are, for example, those in which the cathode is formed by one or more rollers which contact the material to be coated.
  • the cathodes can also be designed in the form of segmented rolls, in which in each case at least the segment of the roll, which is in communication with the substrate to be coated, is connected cathodically. In the case of segmented rolls, in order to remove metal deposited on the roll, it is possible to anodically switch the segments which do not contact the base layer to be coated, whereby the metal deposited thereon is deposited again into the electrolytic solution.
  • the at least one cathode comprises at least one band with at least one electrically conductive portion, which is guided around at least two rotatable shafts.
  • the waves are carried out with a suitable, matched to the respective substrate cross-section.
  • the waves are cylindrically shaped and may for example be provided with grooves in which the at least one band runs.
  • at least one of the shafts is preferably connected in a cathodic manner, wherein the shaft is designed in such a way that the current is transmitted from the surface of the shaft to the band. If the shafts are provided with grooves in which the at least one belt runs, the substrate can be contacted simultaneously via the shafts and the belt.
  • the grooves can be electrically conductive and the regions of the waves between the grooves can be made of an insulating material in order to avoid that the substrate is also electrically contacted via the waves.
  • the power supply of the waves takes place for example via slip rings, but it can also be used any other suitable device with which power can be transmitted to rotating shafts.
  • the cathode comprises at least one band with at least one electrically conductive section
  • substrates with short electrically conductive structures especially in the transport direction of the substrate, can also be provided with a sufficiently thick layer. Layering be provided. This is possible because, as a result of the design of the cathode as a band, even short electrically conductive structures are in contact with the cathode for a longer time.
  • At least two bands are arranged offset one behind the other.
  • the arrangement is generally such that the second band, which is arranged offset behind the first band, contacts the electrically conductive structure in the region on which the metal was deposited during the contacting with the first band.
  • a greater thickness of the coating can be achieved by designing more than two bands in succession.
  • a shorter construction viewed in the direction of transport, can be achieved in that successive, staggered bands are guided over at least one common shaft.
  • the at least one band can, for example, also have a network structure so that only small areas of the electrically conductive structures to be coated on the substrate are covered by the band.
  • the coating takes place in each case in the brackets of the net.
  • the bands are formed in the form of a network structure, at least two bands arranged one behind the other.
  • the at least one band comprises alternating conductive and non-conductive sections.
  • the regions of the ribbon which are in contact with the coated substrate are switched cathodically, and the regions of the ribbon which are not in contact with the substrate become anodic.
  • the advantage of this circuit is that metal which deposits on the tape during the cathodic circuit of the tape is removed during the anodic circuit.
  • the anodized region is preferably longer or at least as long as the cathodically connected region.
  • this can be achieved in that the anodically connected shaft has a larger one
  • the cathode may comprise at least two disks rotatably mounted on one shaft in each case instead of the belts, the disks meshing with one another.
  • the disks are generally designed in a cross-section adapted to the respective substrate.
  • the disks preferably have a circular cross section.
  • the waves can have any cross section.
  • the shafts are cylindrical.
  • the distance between two disks on a shaft corresponds at least to the width of a disk. This makes it possible that in the distance between two discs on a shaft, a disc can engage another shaft.
  • the power supply of the discs takes place for example via the shaft.
  • This connection is generally made via a slip ring.
  • any other connection is possible with which a voltage transfer from a stationary voltage source is transmitted to a rotating element.
  • sliding contacts such as brushes, may be in contact with the contact disks on the side facing away from the substrate.
  • the shafts and the disks are preferably made at least in part from an electrically conductive material.
  • the shafts from an electrically insulating material and the power supply to the individual disks, for example by electrical conductors, such as wires to realize. In this case, then the individual wires are each connected to the contact discs, so that the contact discs are supplied with voltage.
  • the discs distributed over the circumference individual, electrically isolated from each other sections.
  • the sections which are electrically insulated from one another are preferably switchable both cathodically and anodically. This makes it possible that a portion which is in contact with the substrate, is switched cathodically, and as soon as it is no longer in contact with the substrate is switched a nodal. As a result, deposited metal is removed during the cathodic circuit on the portion during the anodic circuit.
  • the voltage supply of the individual segments generally takes place via the shaft.
  • the material from which the electrically conductive parts of the discs or bands are made is preferably an electrically conductive material, which does not pass into the electrolyte solution during operation of the device.
  • Suitable materials include metals, graphite, conductive polymers such as polythiophenes or metal / plastic composites.
  • Preferred materials are stainless steel and / or titanium.
  • the galvanic coating apparatus may further be provided with a device with which the substrate can be rotated.
  • the axis of rotation of the device, with which the substrate can be rotated is arranged perpendicular to the surface of the substrate to be coated.
  • two rollers or two shafts with the disks or two belts mounted thereon may be arranged so that the substrate to be coated can be passed between them.
  • endless films which are initially unwound from a roll, passed through the device for electroplating and then wound up again - this can also be zigzag-shaped, for example or in the form of a meander to several devices for electroplating, which can then be arranged, for example, one above the other or next to each other, are passed through the bath.
  • the galvanic coating device may be equipped with any additional device known to those skilled in the art as needed.
  • ancillary devices include, for example, pumps, filters, chemical feeders, roll-up and roll-down devices, etc.
  • the device according to the invention can also be operated, for example, in the pulse method known from Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik, Eugen G. Leuze Verlag, Vol. 4, pages 192, 260, 349, 351, 352, 359.
  • the process according to the invention for the production of electrically conductive, structured or full surface surfaces on a support can be operated in a continuous, partially continuous or discontinuous manner. Also, it is possible that only individual Steps of the process are carried out continuously while other steps are carried out batchwise.
  • the method according to the invention is suitable, for example, for the production of printed conductors on printed circuit boards.
  • Such circuit boards are, for example, those with multilayer
  • electrically conductive structures can be coated on flexible circuit carriers.
  • flexible circuit carriers are, for example, plastic films made of the materials mentioned above for the carrier, on which electrically conductive structures are printed.
  • the method according to the invention is suitable for the production of RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, printed conductors in solar cells or in LCD or plasma picture screens, capacitors, film capacitors, resistors, convectors, electrical fuses or for Her - Positioning of electroplated products in any form, such as one or two-sided metal-clad polymer carrier with a defined layer thickness, 3D molded interconnect devices or for the production of decorative or functional surfaces on products that, for example, to shield electromagnetic radiation, for Heat conduction or used as packaging. Furthermore, it is also possible to produce contact pads or contact pads or wirings on an integrated electronic component.
  • antennas with contacts for organic electronic components as well as coatings on surfaces, consisting of electrically non-conductive material for electromagnetic shielding, possible.
  • a use is further possible in the field of flowfields of bipolar plates for use in fuel cells.
  • the method according to the invention can likewise be used for the metallization of holes, vias, blind holes, etc., for example in printed circuit boards, RFID antennas or transponder antennas, flat cables, foil conductors with the aim of through-connection of the top and bottom side. This also applies if other substrates are used.
  • the metallized articles according to the invention comprise magnetizable metals - application in areas of magnetizable functional parts, such as magnetic boards, magnetic games, magnetic surfaces in, for example, refrigerator doors.
  • magnetizable functional parts such as magnetic boards, magnetic games, magnetic surfaces in, for example, refrigerator doors.
  • they find application in areas in which a good thermal conductivity is advantageous, for example in films for seat heaters, floor heating and insulation materials.
  • Preferred uses of the surfaces metallized according to the invention are those in which the products thus produced are printed circuit boards, RFID antennas, transponder antennas, seat heaters, flat cables, contactless chip cards, thin metal foils or polymer backing coated on one or two sides, foil conductors, conductor tracks in solar cells or in LCD or plasma screens or as a decorative application such as for packaging materials.
  • the substrate can be processed further in accordance with all steps known to the person skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.
  • An advantage of the method according to the invention is that sufficient coating is possible even when using materials for the electrically conductive particles which oxidize easily.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Chemically Coating (AREA)
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Publication number Priority date Publication date Assignee Title
EP2108239A1 (de) * 2007-01-05 2009-10-14 Basf Se Verfahren zur herstellung von elektrisch leitfähigen oberflächen
WO2008101884A2 (de) * 2007-02-20 2008-08-28 Basf Se Verfahren zur kontaktierung elektrischer bauelemente
ATE474080T1 (de) 2007-02-20 2010-07-15 Basf Se Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
WO2009144186A2 (de) 2008-05-30 2009-12-03 Basf Se Verfahren zur herstellung von transparenten leitfähigen oxiden
CA2728055C (en) * 2008-06-18 2017-04-04 Basf Se Process for producing electrodes for solar cells
US20110266158A1 (en) * 2008-06-19 2011-11-03 Fundacion Cidetec Method for electrochemically covering an insulating substrate
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
DE102009009650B4 (de) * 2009-02-19 2013-10-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung
US8585911B2 (en) * 2009-03-18 2013-11-19 Kuo-Ching Chiang Thin film antenna and the method of forming the same
US20170038658A1 (en) 2011-09-30 2017-02-09 View, Inc. Particle removal during fabrication of electrochromic devices
US9007674B2 (en) 2011-09-30 2015-04-14 View, Inc. Defect-mitigation layers in electrochromic devices
KR101009442B1 (ko) * 2009-04-15 2011-01-19 한국과학기술연구원 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름
WO2010126876A1 (en) * 2009-04-27 2010-11-04 Drexel University Transparent conformal polymer antennas for rfid and other wireless communications applications
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
US9072185B2 (en) 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
DE102009045061A1 (de) 2009-09-28 2011-03-31 Basf Se Verfahren zur Herstellung von elektrisch leitfähigen, strukturierten oder vollflächigen Oberflächen auf einem Träger
FR2952384B1 (fr) * 2009-11-10 2012-12-14 Commissariat Energie Atomique Depot selectif de nanoparticules
KR101046545B1 (ko) * 2009-12-22 2011-07-05 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 적층체의 제조 방법 및 적층체
MX2012009464A (es) * 2010-02-17 2012-09-12 Basf Se Proceso para producir uniones conductoras de electricidad entre celdas solares.
WO2011109660A2 (en) * 2010-03-04 2011-09-09 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
KR101204539B1 (ko) * 2010-08-27 2012-11-23 삼성전기주식회사 에너지 저장 장치의 전극 제조용 도핑 장치 및 이를 이용한 전극 제조 방법
CN102404934B (zh) * 2010-09-09 2015-01-14 富葵精密组件(深圳)有限公司 电路板基板及其制作方法
TWI398198B (zh) * 2010-09-13 2013-06-01 Zhen Ding Technology Co Ltd 具有接地屏蔽結構之電路板及其製作方法
US9475946B2 (en) * 2011-09-30 2016-10-25 Ppg Industries Ohio, Inc. Graphenic carbon particle co-dispersions and methods of making same
EP2785896B1 (de) * 2011-12-02 2015-09-23 Altana AG Verfahren zur herstellung elektrisch leitfähiger strukturen auf nichtleitenden substraten und auf diese weise erzeugte strukturen
US9648751B2 (en) 2012-01-13 2017-05-09 Arjo Wiggins Fine Papers Limited Method for producing a sheet
US9005483B2 (en) 2012-02-10 2015-04-14 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof
EP2812923B1 (en) 2012-02-10 2019-11-27 Lockheed Martin Corporation Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof
CN102580905B (zh) * 2012-02-15 2013-11-20 德州华源生态科技有限公司 并条、粗纱胶辊导电涂层的处理方法
TWI473118B (zh) * 2012-03-15 2015-02-11 Nat Univ Kaohsiung Polyethylene dioxythiophene - polystyrene sulfonate conductive liquid and conductive film formed by it
RU2516008C2 (ru) * 2012-06-20 2014-05-20 Закрытое акционерное общество "Галилео Нанотех" Способ изготовления электропроводящей поверхности на полимерном рулонном материале
JP2015524624A (ja) * 2012-08-06 2015-08-24 ダウ グローバル テクノロジーズ エルエルシー 高信頼性光起電デバイス
RU2520239C1 (ru) * 2012-12-28 2014-06-20 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский технологический университет "МИСиС" Способ получения тонкопленочных полимерных нанокомпозиций для сверхплотной магнитной записи информации
CN105885474B (zh) * 2015-07-16 2017-09-08 国网浙江省电力公司湖州供电公司 一种碳黑静电吸附碳纳米管导电填料的制备方法
JP6039854B1 (ja) * 2016-07-13 2016-12-07 名古屋メッキ工業株式会社 電気めっき方法、めっき装飾品、ゴルフボール及び支承治具
WO2018067148A1 (en) * 2016-10-05 2018-04-12 Hewlett-Packard Development Company, L.P. Alloy substrate with exterior coat
CN106604538A (zh) * 2016-12-13 2017-04-26 苏州城邦达力材料科技有限公司 一种柔性线路板及其制备方法
US10763165B2 (en) 2017-04-18 2020-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive powder formation method, device for forming conductive powder, and method of forming semiconductor device
CN110158132A (zh) * 2018-02-13 2019-08-23 华瑞墨石丹阳有限公司 一种绝缘材料的电镀方法
WO2021161295A1 (en) * 2020-02-10 2021-08-19 Deiana Roberto Production of plastic touch controls using laser-etched conductive layers
MX2023002015A (es) 2020-08-18 2023-04-11 Enviro Metals Llc Refinamiento metálico.
CN115394469B (zh) * 2022-09-19 2025-02-14 常州聚和新材料股份有限公司 一种太阳能电池正面银浆用改性玻璃粉及其制法与应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095117A (en) * 1963-12-26 1967-12-13 Matsushita Electric Industrial Co Ltd Method of making printed circuit board
DE2528000B2 (de) * 1975-06-24 1979-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen
FR2397469A1 (fr) * 1977-02-22 1979-02-09 Panoduz Anstalt Procede pour deposer une couche de metal conducteur sur un support isolant
JPS53113232A (en) * 1977-03-15 1978-10-03 Shiyouzou Fukuda Preparation of colored metal film
US4417296A (en) * 1979-07-23 1983-11-22 Rca Corp Method of connecting surface mounted packages to a circuit board and the resulting connector
JPS5880892A (ja) * 1981-11-09 1983-05-16 セイコーインスツルメンツ株式会社 回路基板の導電パタ−ン形成方法
JPS5895892A (ja) * 1981-12-02 1983-06-07 住友ベークライト株式会社 回路板作成方法
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
US5109269A (en) * 1991-07-08 1992-04-28 Ofer Holzman Method and means for positioning surface mounted electronic components on a printed wiring board
JP3528924B2 (ja) * 1993-01-22 2004-05-24 ソニー株式会社 プリント配線板及びその製造方法
JPH08127894A (ja) * 1994-10-28 1996-05-21 Toyoda Gosei Co Ltd 樹脂製品の部分めっき方法
JP3686527B2 (ja) * 1997-04-25 2005-08-24 富士重工業株式会社 炭素繊維強化プラスチックの金属被覆方法
GB2336161B (en) * 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
DE69942279D1 (de) * 1998-09-17 2010-06-02 Ibiden Co Ltd Vielschichtig aufgebaute leiterplatte
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法
JP2002356782A (ja) * 2001-03-26 2002-12-13 Nippon Paint Co Ltd 金属パターンの形成方法
DE10145749A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht
DE10254927B4 (de) * 2002-11-25 2012-11-22 Infineon Technologies Ag Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens
JP4420626B2 (ja) * 2003-06-06 2010-02-24 株式会社秀峰 印刷または塗布画像作成方法
TW200521171A (en) * 2003-12-26 2005-07-01 Toshiba Kk Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
JP4166686B2 (ja) * 2003-12-26 2008-10-15 株式会社東芝 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
JP2005303090A (ja) * 2004-04-13 2005-10-27 Toshiba Corp 配線基板および配線基板の製造方法
JP2006128228A (ja) * 2004-10-26 2006-05-18 Seiko Epson Corp 導電膜の形成方法、配線基板、電子デバイスおよび電子機器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2007144322A1 *

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JP2009539593A (ja) 2009-11-19
BRPI0712709A2 (pt) 2012-05-22
WO2007144322A1 (de) 2007-12-21
RU2009100627A (ru) 2010-07-20
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TW200806127A (en) 2008-01-16
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