CN101283414A - 施加金属层用的含有两种不同金属的分散体 - Google Patents
施加金属层用的含有两种不同金属的分散体 Download PDFInfo
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- CN101283414A CN101283414A CNA2006800375716A CN200680037571A CN101283414A CN 101283414 A CN101283414 A CN 101283414A CN A2006800375716 A CNA2006800375716 A CN A2006800375716A CN 200680037571 A CN200680037571 A CN 200680037571A CN 101283414 A CN101283414 A CN 101283414A
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- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- ONQDVAFWWYYXHM-UHFFFAOYSA-M potassium lauryl sulfate Chemical compound [K+].CCCCCCCCCCCCOS([O-])(=O)=O ONQDVAFWWYYXHM-UHFFFAOYSA-M 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- 229960005078 sorbitan sesquioleate Drugs 0.000 description 1
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- 150000003624 transition metals Chemical class 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
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- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- PVNIQBQSYATKKL-UHFFFAOYSA-N tripalmitin Chemical compound CCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCC PVNIQBQSYATKKL-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
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- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
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- C08K7/06—Elements
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
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Abstract
本发明涉及在非导电基底上施加金属层用的分散体，其包含有机粘合剂组分、具有不同金属和/或金属粒子形状的金属组分，以及溶剂组分。本发明还涉及该分散体的制备方法、涉及使用该分散体生产任选结构化的金属层的方法，并涉及所得基底表面及其用途。
Description
本发明涉及施加金属层用的分散体，涉及其制备方法，并涉及使用该分散体在基底上生产金属层的方法。本发明进一步涉及如此涂敷的基底表面及其用途。
多种技术已知用于在不导电基底上生产导电金属层。例如，不导电基底，例如塑料，可以在高真空中金属化，但是这些方法复杂且昂贵。
将塑料金属化的常用方法在一个工艺中连续实施许多步骤。在此通过在表面活化步骤中使用强酸或碱开始该方法。此处常使用对健康有害的物质，例如铬酸-硫酸。然后经由具有合适的过渡金属络合物的溶液涂敷塑料表面。在该方法中这些步骤能够将活化的塑料表面金属化。
但是，在不导电表面上获得导电涂层的另一方法使用导电漆或导电糊，其中将它们施加到塑料上，但它们必须与该材料具有良好的粘合。
DE-A 1 615 786例如描述了在在不导电表面上生产导电层的方法中使用包含微细分散的铁的漆层。该漆还要包含有机溶剂和一定比例的粘合剂。
但是，已知的是，这些导电漆只有相对较小的电导率，因为分散的金属粒子没有通过粘合剂形成连贯的导电层。因此，这些层的电导率没有达到相当厚度的金属箔的电导率。该层内金属颜料含量的提高也会引起电导率的提高，但在此常常由于导电层在塑料表面上的粘合力不足而出现问题。
DE-A 1 521 152因此提出在不导电表面上施加包含粘合剂并包含微细分散的铁的导电漆，然后通过无电流法在该导电漆上施加银层或铜层。然后可以通过无电流法或电镀法施加进一步的层。
EP-B 200 772描述了使用流体有机漆粘合剂涂敷不导电的制品，从而在高于10kHz的频率下实现电磁屏蔽。通过用流体有机漆粘合剂(活性金属粒子已经分散在其中)涂施第一层而开始该方法，然后通过无电流法在该第一层上沉积第二铜层，最后在该第二层上施加由电镀铂化金属构成的第三层。
DE-A 199 45 400尤其描述了磁性分散体，其要包含特定粘合剂和磁性或可磁化材料。
对用于不导电基底的金属涂层的最优化体系具有需求，特别是具有改进的粘合力并且环境相容、廉价可靠，并可以以高操作速度使用的那些。现有技术中已知的体系迄今还不能大规模工业应用。
因此，本发明的目的是提供能够在不导电基底上施加金属层，特别是能够实现金属层的提高的粘合力和/或层均匀性的分散体。
通过一种在不导电基底上施加金属层用的分散体实现了该目的，该分散体包含：
A 基于分散体总重量为0.01至30重量％的有机粘合剂组分，
B 基于分散体总重量为30至89.99重量％的金属组分，其至少包含：
B1 基于金属组分B总重量为0.01至99.99重量％的具有第一金属粒子形状的第一金属，和
B2 基于金属组分B总重量为99.99至0.01重量％的具有第二金属粒子形状的第二金属；
C 基于分散体总重量为10至69.99重量％的溶剂组分；
其中满足下列条件中的至少一项：
(1)第一和第二金属不同；
(2)第一和第二粒子形状不同。
具体地，已经发现，本发明的分散体中不同金属和/或粒子形状的存在可以在施加后产生金属第一层，其与通过无电流法和/或电镀法施加的另外金属层一起产生具有改进性质的金属层。
该分散体可以另外包含下列组分之一：
D)基于分散体总重量为0.01至50重量％的分散剂组分，和
E)基于分散体总重量为0.01至50重量％的填料组分。
组分A
有机粘合剂组分A是粘合剂或粘合剂混合物。可能的粘合剂是含有具有颜料亲合力的结合基团的粘合剂，天然存在和合成的聚合物及其衍生物、天然存在的树脂和合成树脂及其衍生物、天然橡胶、合成橡胶、蛋白质、纤维素衍生物、干性和非干性油，和类似物。这些可以是，但并不必须是，化学或物理固化的物质，例如空气固化、辐射固化或热固化的物质。
粘合剂组分A优选为聚合物或聚合物混合物。
优选作为组分A的聚合物是ABS(丙烯腈-丁二烯-苯乙烯)；ASA(丙烯腈-苯乙烯-丙烯酸酯)；丙烯酸化丙烯酸酯；醇酸树脂；乙酸烷基乙烯酯；烯烃-乙酸乙烯酯共聚物，特别是亚甲基-乙酸乙烯酯、乙烯-乙酸乙烯酯、丁烯-乙酸乙烯酯；烯烃-氯乙烯共聚物；氨基树脂；醛树脂和酮树脂；纤维素和纤维素衍生物，特别是烷基纤维素、纤维素酯，例如乙酸纤维素、丙酸纤维素、丁酸纤维素，纤维素醚，羧基烷基纤维素，硝酸纤维素；环氧丙烯酸酯；环氧树脂；乙烯-丙烯酸共聚物；烃树脂；MABS(具有存在的丙烯酸酯单元的透明ABS)；马来酸酐共聚物；甲基丙烯酸酯，如果合适的话，胺官能化；天然橡胶；合成橡胶；氯化橡胶；天然存在的树脂；松香；紫胶；酚醛树脂；聚酯；聚酯树脂，例如苯基酯树脂；聚砜；聚醚砜；聚酰胺；聚酰亚胺；聚苯胺；聚吡咯；聚对苯二甲酸丁二酯(PBT)；聚碳酸酯(例如来自Bayer AG的Makrolon
)；聚酯丙烯酸酯；聚醚丙烯酸酯；聚乙烯；聚乙烯-噻吩；聚萘二甲酸乙二酯；聚对苯二甲酸乙二酯(PET)；聚对苯二甲酸乙二醇酯(PETG)；聚丙烯；聚甲基丙烯酸甲酯(PMMA)；聚苯醚(PPO)；聚四氟乙烯(PTFE)；聚四氢呋喃；聚乙烯基化合物，特别是聚氯乙烯(PVC)、PVC共聚物、PVdC、聚乙酸乙烯酯，和这些的共聚物，聚乙烯基醇(如果合适的话，部分水解形式)、聚乙酸乙烯酯、聚乙烯基吡咯烷酮、聚乙烯基醚、聚丙烯酸乙烯酯和聚甲基丙烯酸乙烯酯(溶液和分散体形式)，和它们的共聚物、聚丙烯酸酯以及聚苯乙烯共聚物；聚苯乙烯(抗冲的或没有抗冲改性)；未交联或用异氰酸酯处理的聚氨酯；聚氨酯丙烯酸酯；苯乙烯-丙烯酸共聚物；苯乙烯-丁二烯嵌段共聚物(来自BASF AG的Styroflex
或Styrolux
来自CPC的K-ResinTM)；蛋白质，例如酪蛋白；SIS；SPS嵌段共聚物。两种或更多种聚合物的混合物也可以构成有机粘合剂组分A)。
优选作为组分A的聚合物是聚烯、聚酰亚胺、环氧树脂和酚醛树脂、苯乙烯-丁二烯嵌段共聚物、烯烃-乙酸乙烯酯和烯烃-氯乙烯共聚物、聚酰胺和它们的共聚物。
有机粘合剂A)的含量基于分散体总重量为0.01至30重量％。该含量优选为0.1至10重量％，更优选为0.5至5重量％。
组分B
金属组分B包含至少一种具有第一金属粒子形状的第一金属和一种具有第二金属粒子形状的第二金属。
第一金属可以是与第二金属相同或不同的金属。第一金属粒子形状同样可以与第二金属粒子形状相同或不同。但是，重要的是，至少金属或粒子形状是不同的。但是，也可能的是，不仅第一和第二金属彼此不同，而且第一和第二粒子形状也彼此不同。
该分散体除了金属组分B1和B2外，还可以包含与第一和第二金属不同，或与第一或第二金属不同，或与第一和第二金属相同的附加金属。类似的考虑适用于附加金属的金属粒子形状。对于本发明，唯一要求是存在至少一种第一和第二金属，和一种第一金属粒子形状和一种第二金属粒子形状，只要第一和第二金属不同和/或第一和第二粒子形状彼此不同。
对于本发明，金属的氧化态为0，且它们可以以金属粉末形式添加到分散体中。
金属的平均粒径优选为0.01至100微米，优选0.05至50微米，特别优选0.1至10微米。平均粒径可以通过激光散射测量法，例如在MicrotracX100设备上测定。粒径分布取决于粒子的制备方法。粒径分布通常只有一个最大值，但也可能有两个或更多最大值。
合适的金属的实例是锌、镍、铜、锡、钴、锰、铁、镁、铅、铬、铋、银、金、铝、钛、钯、铂、钽及其合金。合适的合金的实例是CuZn、CuSn、CuNi、SnPb、SnBi、SnCo、NiPb、ZnFe、ZnNi、ZnCo和ZnMn。铁、锌、铝和铜特别优选。
该金属除了金属含量外还可以包含非金属含量。例如，该金属的表面可以至少在一定程度上已带有涂层。合适的涂层可以是无机(例如SiO2，磷酸盐)或有机类型的。该金属当然也可以已被另外的金属或金属氧化物涂敷。该金属还可以以部分氧化形式存在。
如果要由两种不同金属构成金属组分B，这可以通过两种金属的混合实现。这两种金属特别优选选自铁、锌、铝和铜。
但是，金属组分B也可以包含第一金属和第二金属，其中第二金属以合金形式存在(与第一金属或与一种或多种其它金属的合金)，或金属组分B可以包含两种不同的合金。在这两种情况下，金属组分B1和B2彼此不同，由此允许彼此独立地选择它们的金属粒子形状，相同或不同。
除了金属的选择外，金属的金属粒子形状也影响本发明的分散体在涂敷工艺后的性质。对于形状，存在本领域技术人员已知的许多不同的变体。例如，金属粒子的形状可以是针状、圆柱状、层状或球状。这些粒子形状代表理想形状，实际形状在此可以是例如随生产方法已经或多或少地有所改变的形状。因此，对于本发明，例如液滴形粒子是理想球形的实际变型。
可购得具有各种粒子形状的金属。
如果金属组分B1和金属组分B2的金属粒子形状不同，优选第一金属组分是球形，第二金属组分是层状或针状。
当粒子形状不同时，优选金属同样是铁、铜、锌和铝。
如上所述，在添加到分散体中时，金属可以是其粉末形式。这些金属粉末是熟悉的商品，或可通过已知方法容易地制备，例如由金属盐的溶液通过电解沉积或化学还原，或通过例如用氢还原氧化粉末，通过将熔融金属喷雾，特别是喷到冷却剂，例如气体或水中。喷气和喷水是优选的。
在铁的情况下，除喷气和喷水法外，羰基铁粉法(CIP)优选用于生产羰基铁粉。CIP法利用五羰基铁的热分解。例如在Ullman’s Encyclopedia ofIndustrial Chemistry，第5版，卷A14，第599页中描述了该方法。五羰基铁的分解例如在包含管道的可加热的分解容器中在升高温度和升高压力下进行，其中管道由耐热材料，例如石英玻璃或V2A钢构成(优选在竖直位置)并具有例如由加热浴、加热线或加热护套(加热流体流经该护套)构成的环绕加热器。
层状金属可以在制备过程中通过优化的条件控制，或可随后通过机械处理，例如通过在带有搅拌器的球磨中处理来获得。
基于分散体总重量，金属组分B的含量为30至89.99重量％。金属亚组分B1的含量基于组分B总重量为99.99至0.01重量％。金属亚组分B2的含量为0.01至99.99重量％。如果不存在另外金属，B1和B2构成金属组分B的100％。
B的优选范围基于分散体总重量为50至85重量％。
组分B1和B2的重量比优选为1000∶1至1∶1，更优选为100∶1至1∶1，最优选为20∶1至1∶1。
组分C
本发明的分散体还包含溶剂组分C。其由溶剂或溶剂混合物构成。
合适的溶剂是丙酮，乙酸烷基酯，烷氧基丙醇(例如甲氧基丙醇)，戊基醇，丁醇，乙酸丁酯，丁基二甘醇，烷基二醇乙酸酯如丁基乙二醇乙酸酯，丁基乙二醇，氯仿，环己烷，环己酮，双丙酮醇，二乙醚，二甘醇二甲醚，二噁烷，乙醇，乙酸乙酯，乙基苯，氯乙烯，乙二醇，乙二醇乙酸酯，乙二醇二甲酯，异丁醇，乙酸异丁酯，乙酸异丙酯，甲酚，甲醇，甲氧基丁醇，乙酸甲酯，3-甲基丁醇，甲基二甘醇，二氯甲烷，亚甲基二醇，甲乙酮(MEK)，甲基异丁基酮(MIBK)，乙二醇一甲醚乙酸酯，甲基苯酚(邻甲酚、间甲酚、对甲酚)，1-丙醇，2-丙醇，乙酸丙酯，丙二醇，四氯化碳，四氢呋喃，甲苯，三羟甲基丙烷(TMP)，醇式单萜(例如萜品醇)，水，和由两种或更多种这些溶剂组成的混合物。
优选溶剂是烷氧基丙醇、环己烷、乙醇、乙酸乙酯、乙酸丁酯、1-丙醇、2-丙醇、四氢呋喃、乙基苯、丁基乙二醇乙酸酯、水及其混合物。
溶剂组分C的含量基于分散体总重量为10重量％至69.99重量％。该含量优选为15至50重量％。
组分D
本发明的分散体还可包含分散剂组分D。其由一种或多种分散剂构成。
原则上，现有技术中描述的且本领域技术人员已知用在分散体中的任何分散剂均合适。优选分散剂是表面活性剂或表面活性剂混合物，例如阴离子型、阳离子型、两性或非离子型表面活性剂。
例如在″Encyclopedia of Polymer Science and Technology″，J.Wiley& Sons(1966)，第5卷，第816至818页中和在″Emulsion Polymerisationand Emulsion Polymers″，编辑P.Lovell和M.El-Asser，Verlag Wiley &Sons(1997)，第224-226页中描述了阳离子型和阴离子型表面活性剂。
阴离子型表面活性剂的实例是链长为8至30个碳原子，优选12至18个碳原子的有机羧酸的碱金属盐。这些通常被称作皂。常用的盐是钠盐、钾盐或铵盐。其它可用的阴离子型表面活性剂是具有8至30个碳原子，优选12至18个碳原子的烷基硫酸盐和烷基-或烷基芳基磺酸盐。特别合适的化合物是碱金属十二烷基硫酸盐，例如十二烷基硫酸钠或十二烷基硫酸钾，和C12-C16链烷烃磺酸的碱金属盐。其它合适的化合物是十二烷基苯磺酸钠和二辛基磺基琥珀酸钠。
合适的阳离子型表面活性剂的实例是胺或二胺的盐、季铵盐，例如十六烷基三甲基溴化铵，以及长链取代的环胺的盐，例如吡啶、吗啉、哌啶的盐。特别可以使用三烷基胺的季铵盐，例如十六烷基三甲基溴化铵。烷基在此优选具有1至20个碳原子。
根据本发明，在组分D中特别可以使用非离子型表面活性剂。例如在CDChemie Lexikon-Version 1.0，Stuttgart/New York：GeorgThieme Verlag 1995，关键词″Nichtionische Tenside″[Nonionicsurfactants]中描述了非离子型表面活性剂。
合适的非离子型表面活性剂的实例是基于聚氧化乙烯或聚氧化丙烯的表面活性剂，例如来自BASF Aktiengesellschaft的Pluronic或Tetronic
适合作为非离子型表面活性剂的聚亚烷基二醇通常具有1000至15000克/摩尔，优选2000至13000克/摩尔，特别优选4000至11000克/摩尔的摩尔量Mn。优选的非离子型表面活性剂是聚乙二醇。
聚亚烷基二醇本身是已知的或可以通过本身已知的方法制备，例如通过使用碱金属氢氧化物催化剂，例如氢氧化钠或氢氧化钾，或使用碱金属醇盐催化剂，例如甲醇钠、乙醇钠、乙醇钾或异丙醇钾并添加至少一种包含2至8个反应性氢原子，优选2至6个反应性氢原子的起始物分子的阴离子聚合制备，或通过使用路易斯酸催化剂，例如五氯化锑、氯化硼醚合物、或漂白土的阳离子聚合制备，其中原料是一种或多种在亚烷基中具有2至4个碳原子的氧化烯。
合适的氧化烯的实例是四氢呋喃、1，2-或2，3-氧化丁烯、氧化苯乙烯，和优选氧化乙烯和/或1，2-氧化丙烯。氧化烯可以单独使用、彼此交替使用，或作为混合物使用。可用的起始物分子的实例是：水，有机二羧酸如琥珀酸、己二酸、邻苯二甲酸或对苯二甲酸，在烷基中具有1至4个碳原子的脂族或芳族的未取代或N-单-、或N，N-或N，N’-二烷基取代的二胺，例如未取代的或单-或二烷基取代的乙二胺、二亚乙基三胺、三亚乙基四胺、1，3-丙二胺、1，3-或1，4-丁二胺、或1，2-、1，3-、1，4-、1，5-或1，6-己二胺。
可用的其它起始物分子是：链烷醇胺，例如乙醇胺、N-甲基-或N-乙基乙醇胺，二链烷醇胺，例如二乙醇胺和N-甲基-和N-乙基二乙醇胺，和三链烷醇胺，例如三乙醇胺，以及氨。优选使用多元醇，特别是二元醇或三元醇，或官能度大于3的醇，例如乙二醇、1，2-丙二醇、1，3-丙二醇、二乙二醇、二丙二醇、1，4-丁二醇、1，6-己二醇、丙三醇、三羟甲基丙烷、季戊四醇、蔗糖和山梨糖醇。
其它合适的组分D是酯化的聚亚烷基二醇，例如所提到的聚亚烷基二醇的单-、二-、三-或聚酯，其可以通过使所提到的聚亚烷基二醇的末端OH基团与有机酸，优选己二酸或对苯二甲酸以本身已知的方式反应来制备。
非离子型表面活性剂通过将具有活性氢原子的化合物(例如氧化烯在脂肪醇、羰基合成醇或烷基酚上的加合物)烷氧基化来制备。对于烷氧基化反应，优选使用氧化乙烯或1，2-氧化丙烯。
其它可能的非离子型表面活性剂是烷氧基化或未烷氧基化糖酯或糖醚。
糖醚是通过使脂肪醇与糖反应获得的烷基糖苷，糖酯通过使糖与脂肪酸反应来获得。制备所提到的物质所需的糖、脂肪醇和脂肪酸是本领域技术人员已知的。
例如在Beyer/Walter，Lehrbuch der organischen Chemie，S.HirzelVerlag Stuttgart，第19版，1981，第392至425页中描述了合适的糖。可能的糖是D-山梨糖醇，和通过将D-山梨糖醇脱水而获得的失水山梨糖醇。合适的脂肪酸是例如CD
Chemie Lexikon-Version 1.0，Stuttgart/New York：Georg Thieme Verlag 1995，关键词″
″[Fatty acids]中提到的具有6至26个碳原子，优选8至22个碳原子，特别优选10至20个碳原子的饱和或单或多不饱和的未支化或支化的羧酸。优选的脂肪酸是月桂酸、棕榈酸、硬脂酸和油酸。
合适的脂肪醇的碳骨架与所述作为合适脂肪酸的化合物相同。
糖醚、糖酯及其制备方法是本领域技术人员已知的。优选的糖醚通过已知方法，通过使所提到的糖与所提到的脂肪醇反应来制备。优选的糖酯通过已知方法，通过使所提到的糖与所提到的脂肪酸反应来制备。优选的糖酯是失水山梨糖醇与脂肪酸的单-、二-和三酯，特别是失水山梨糖醇单月桂酸酯、失水山梨糖醇二月桂酸酯、失水山梨糖醇三月桂酸酯、失水山梨糖醇单油酸酯、失水山梨糖醇二油酸酯、失水山梨糖醇三油酸酯、失水山梨糖醇单棕榈酸酯、失水山梨糖醇二棕榈酸酯、失水山梨糖醇三棕榈酸酯、失水山梨糖醇单硬脂酸酯、失水山梨糖醇二硬脂酸酯、失水山梨糖醇三硬脂酸酯、和失水山梨糖醇倍半油酸酯、失水山梨糖醇单-和二-油酸酯的混合物。
可能的组分D因此是通过将所提到的糖醚和糖酯烷氧基化而获得的烷氧基化糖醚和糖酯。优选的烷氧基化剂是氧化乙烯和1，2-氧化丙烯。烷氧基化程度通常为1至20，优选2至10，特别优选为2至6。这些的实例是例如如CDChemie Lexikon-Version 1.0，Stuttgart/New York：Georg Thieme Verlag 1995，关键词″Polysorbate″[Polysorbates]中所述通过将上述失水山梨糖醇酯乙氧基化而获得的聚山梨醇酯。合适的聚山梨醇酯是聚乙氧基失水山梨糖醇的月桂酸酯、硬脂酸酯、棕榈酸酯、三硬脂酸酯、油酸酯、三油酸酯，特别是聚乙氧基失水山梨糖醇硬脂酸酯，其例如可作为Tween
60获自ICI America Inc.(例如在CDChemieLexikon-Version 1.0中所述，Stuttgart/New York：Georg Thieme Verlag1995，关键词″Tween
″)。
还可以使用聚合物作为分散剂。
分散剂组分D的用量基于分散体总重量可以为0.01至50重量％。该含量优选为0.1至10重量％，特别优选为0.3至5重量％。
组分E
本发明的分散体还可以包含填料组分E。其可以由一种填料或两种或更多填料构成。例如，可金属化组合物的组分E可以包含纤维状或粒状填料或这些的混合物。它们优选是市售产品，例如碳纤维和玻璃纤维。
可用的玻璃纤维可以由E、A或C玻璃构成，并优选带有胶料和偶联剂。它们的直径通常为1至20微米。可以使用连续长丝纤维(粗纱)或短切玻璃纤维(短纤维)，其长度为1至10毫米，优选3至6毫米。
还可以使用填料或增强材料，例如玻璃粉、玻璃织物、玻璃非织造布、矿物纤维、须晶、氧化铝纤维、云母、石英粉或硅灰石。还可以使用碳、二氧化硅、硅酸盐，例如Aerosil或页硅酸盐，染料、脂肪酸、脂肪酰胺、增塑剂、润湿剂、干燥剂、络合剂、碳酸钙、硫酸钡、蜡、颜料、传导性聚合物粒子或芳族聚酰胺纤维。
组分E的含量基于分散体总重量为优选0.01至50重量％。进一步优选为0.01至10重量％，特别优选为0.3至5重量％。
在本发明的分散体中还可以存在加工助剂和稳定剂，例如紫外线稳定剂、润滑剂、缓蚀剂和阻燃剂。其含量基于分散体总重量通常为0.01至5重量％。该含量优选为0.05至3重量％。
本发明进一步提供了本发明的分散体的制备方法，其步骤包括：
A 混合组分A至C，和如果合适的话，D和E，以及其它组分，和
B分散该混合物。
该分散体可以使用本领域技术人员已知的组件通过剧烈混合和分散来制备。这包括将组分在溶解器或在类似的剧烈分散组件中混合，在带有搅拌器的球磨机中分散，或对大量而言，在粉末流化器中分散。
本发明进一步提供在不导电基底的至少一部分表面上生产金属层的方法，其步骤包括：
a)在基底上施加本发明的分散体；
b)干燥和/或硬化施加在基底上的层；和
c)如果合适的话，在干燥和/或硬化的分散体层上通过无电流法和/或电镀法沉积金属。
由不导电材料，例如聚合物提供合适的基底。合适的聚合物是环氧树脂，例如双官能或多官能的芳族聚酰胺增强的或玻璃纤维增强的、或纸增强的环氧树脂(例如FR4)、玻璃纤维增强的塑料、液晶聚合物(LCP)、聚苯硫醚(PPS)、聚甲醛(POM)、聚芳基醚酮(PAEK)、聚醚醚酮(PEEK)、聚酰胺(PA)、聚碳酸酯(PC)、聚对苯二甲酸丁二酯(PBT)、聚对苯二甲酸乙二酯(PET)、聚酰亚胺(PI)、聚酰亚胺树脂、氰酸酯、双马来酰亚胺-三嗪树脂、尼龙、乙烯基酯树脂、聚酯、聚酯树脂、聚酰胺、聚苯胺、酚醛树脂、聚吡咯、聚对苯二甲酸萘二酯、聚甲基丙烯酸甲酯、磷改性的环氧树脂、聚乙烯二氧噻吩、酚醛树脂涂敷的芳族聚酰胺纸、聚四氟乙烯(PTFE)、三聚氰胺树脂、有机硅树脂、氟树脂、电介材料、APPE、聚醚酰亚胺(PEI)、聚苯醚(PPO)、聚丙烯(PP)、聚乙烯(PE)、聚砜(PSU)、聚醚砜(PES)、聚芳基酰胺(PAA)、聚氯乙烯(PVC)、聚苯乙烯(PS)、丙烯腈-丁二烯-苯乙烯(ABS)、丙烯腈-苯乙烯-丙烯酸酯(ASA)、苯乙烯-丙烯腈(SAN)和两种或更多种上述聚合物的混合物(共混物)，它们可以以非常多样的形式存在。基底可以包含本领域技术人员已知的添加剂，例如阻燃剂。
原则上，也可以使用在组分A下所列的任何聚合物。印刷电路板工业中同样常规的其它基底也是合适的。
其它合适的基底是复合材料、泡沫状聚合物、Styropor
Styrodur陶瓷表面、织物、卡纸板、纸板、纸、聚合物涂敷的纸、木材、矿物材料、玻璃、植物组织和动物组织。
对于本发明，术语“不导电”优选表示大于109欧姆×厘米的电阻率。
所述分散体可以通过本领域技术人员已知的方法施加。可以施加到基底表面的一面或多面上，并可经一维、二维或三维延伸。基底通常可以具有适合实际用途的任何所需几何形状。
施加的层也通过传统方法干燥。或者，也可以通过化学或物理途径，例如通过紫外线辐射或加热使粘合剂硬化。
干燥和/或硬化可以完全或部分进行。
在施加分散体和/或干燥和/或硬化后获得的层允许通过无电流法和/或电镀法随后在干燥的分散体层上沉积金属。
本发明的分散体可以在步骤a)中以结构化或全表面形式施加。施加工艺步骤(步骤a)、干燥和/或硬化工艺步骤(步骤b)和如果合适的话另外金属的沉积步骤(步骤c)优选以连续程序进行。由于步骤a)、b)和如果合适的话c)的实施简单，这是可行的。但是，当然也可以使用分批法或半分批法。
涂敷方法可以使用传统和公知的涂敷方法(流延、铺展、刮涂、刷涂、印刷(凹版印刷、丝网印刷、柔性版印刷、tampon print(移印)、喷墨、胶印等等)、喷涂、浸涂、粉末化、流化床，等等)。层厚度优选在0.01至100微米范围内，进一步优选为0.1至50微米，特别优选为1至25微米。这些层可以以全表面形式或结构化形式施加。
在步骤c)中通过无电流法和/或电镀法进行的金属沉积可以通过本领域技术人员已知的并在文献中描述的方法进行。可以通过无电流法和/或电镀法，即通过供应外部电压和电流施加一个或多个金属层。原则上，可通过无电流法和/或电镀法用于沉积工艺的金属是比分散体的最不贵金属贵或同样贵的任何金属。优选通过电镀法沉积铜层、铬层、银层、金层和/或镍层。还优选通过电镀法沉积由铝构成的层。步骤c)中沉积的一个或多个层的厚度在本领域技术人员已知的常规范围内且对本发明不重要。
本发明进一步提供了可通过上述生产金属层的本发明方法获得的具有至少部分存在的导电金属层的基底表面。
这种类型的基底表面可用于导电或导热，用于屏蔽电磁辐射或用于磁化。
本发明进一步提供了本发明的分散体用于施加金属层的用途。
本发明的基底表面特别可用于下列各种用途。
可能的实例是生产导体-轨道(conductor-track)结构体，例如用于生产天线，例如RFID天线、发射机应答器天线，印刷电路板(多层内层和外层、微通孔(microvia)、板上芯片(chip-on-board)、挠性和刚性印刷电路板、纸和复合材料，等等)、带状电缆、座位加热系统、非接触芯片卡、电容器、电阻、连接器、箔导体或电保险丝。
另一可能性是生产具有有机电子部件用接触器的天线，或在由不导电材料构成的表面上生产用于电磁屏蔽(防护)目的的涂层。
另一可能性是生产高频信号的空心导线用的金属内涂层的生产，该空心导线具有由不导电材料构成的承受机械载荷的结构。基底表面也可以是膜电容器的一部分。
另一可能性是用在燃料电池用的双极板的流场区域中。
另一可能性是生产全表面或结构化导电层，其随后用于由上述不导电基底构成的模制品的装饰性金属化。也可以想到金属泡沫的生产(例如用于碰撞吸收器)。
借助本发明的分散体和本发明的基底表面生产金属层的本发明的方法的应用范围能够低成本生产金属化的本身绝缘的基底，特别是用作开关、传感器和MID(模制互连器件)、电磁辐射吸收器、或气体屏障、或装饰性部件，特别是汽车、卫生、玩具、家居或办公部门的装饰性部件、和包装材料以及箔。本发明也可用在纸币、信用卡、身份证件等的安全印刷领域中。织物可以借助本发明的方法以磁和电方式功能化(发射器、RFID天线、发射机应答器天线和其它天线、传感器、加热元件、抗静电材料(尤其用于塑料)、屏蔽材料，等等)。
这些用途的实例是外壳，例如电脑外壳，用于显示屏、移动电话、声频设备、视频设备、DVDs、照相机的外壳、用于电子部件、军事和非军事屏蔽装置的外壳，淋浴配件和盥洗台配件、淋浴头、淋浴杆和淋浴支架、金属化门把手和球形门把手、厕纸筒支架、浴缸把手、家具和镜子的金属化装饰条、淋浴隔断的框架、包装材料。
可以提到的其它产品是：汽车领域中的金属化塑料表面，例如装饰条、车外后视镜、散热器护栅、前部金属化、翼面、外部车身部件、内部车身部件、车门槛、踏脚板替代物、装饰性车轮护盖。
此外，可以由绝缘材料生产迄今在一定程度上或完全由金属制成的部件。例如，在此可以提到落水管、沟槽、门和窗框。
在此另一可能性是生产集成电子模件上的接触位点或接触垫或线路。
本发明的分散体同样可用于印刷电路板中的孔、通孔或盲孔等的金属化，目的是通过印刷电路板的上侧和下侧建立接触。当使用其它基底时，这也适用。
本发明的制成的金属化制品(在它们包含可磁化金属的情况下)还可用在可磁化功能部件领域中，例如磁板、磁玩具和例如冰箱门中的磁表面。它们也用在良好热导性具有有利性的领域中，例如在座位加热系统、地板加热系统和绝缘材料中的箔材中。
本发明的金属化基底表面的优选用途是其中所得基底充当印刷电路板、RFID天线、发射机应答器天线、座位加热系统、带状电缆或非接触芯片卡的那些用途。
实施例
实施例1
将8.4克乙烯-乙酸乙烯酯共聚物溶解在126克乙酸正丁酯中。借助溶解器搅拌器，将378克球形铁粉和42.0克层状铜粉分散在该溶液中。所得分散体以4微米厚度施加到预涂底漆的PET箔上。在干燥过程后，在酸性硫酸铜浴中施加厚9微米的铜层。
实施例2
将8.4克乙烯-乙酸乙烯酯共聚物溶解在96.6克乙酸正丁酯中。借助溶解器搅拌器，将378克球形铁粉和42.0克层状铜粉分散在该溶液中。所得分散体以4微米厚度施加到预涂底漆的PET箔上。在干燥过程后，在酸性硫酸铜浴中施加厚9微米的铜层。
实施例3
使用层状铁粉代替层状铜粉重复实施例1。
实施例4
使用羰基铁粉代替常规铁粉重复实施例1。
在所有情况下，发现省略一种金属组分在每种情况下都产生较不均匀的铜层，其还具有较差的粘合性。
Claims (18)
1.在不导电基底上施加金属层用的分散体，其包含：
A 基于分散体总重量为0.01至30重量％的有机粘合剂组分，
B 基于分散体总重量为30至89.99重量％的金属组分，其至少包含
B1 基于金属组分B总重量为0.01至99.99重量％的具有第一金属粒子形状的第一金属，和
B2 基于金属组分B总重量为99.99至0.01重量％的具有第二金属粒子形状的第二金属；
C 基于分散体总重量为10至69.99重量％的溶剂组分；
其中满足下列条件中的至少一项：
(1)第一和第二金属不同；
(2)第一和第二粒子形状不同。
2.根据权利要求1的分散体，其还包含至少一种下列组分：
D)基于分散体总重量为0.01至50重量％的分散剂组分，和
E)基于分散体总重量为0.01至50重量％的填料组分。
3.根据权利要求1或2的分散体，其中粘合剂组分A由聚合物或聚合物混合物构成。
4.根据权利要求1至3中任一项的分散体，其中，如果合适的话，第一和第二金属已经被涂敷，已彼此独立地选自锌、镍、铜、锡、钴、锰、铁、镁、铅、铬、铋、银、金、铝、钛、钯、铂、钽及其合金。
5.根据权利要求1至4中任一项的分散体，其中第一和第二粒子形状已彼此独立地选自针状、圆柱状、层状和球状。
6.根据权利要求1至5中任一项的分散体，其中第一和第二金属不同。
7.根据权利要求6的分散体，其中第一金属和第二金属已选自铁、铜、锌和铝。
8.根据权利要求1至7中任一项的分散体，其中第一和第二粒子形状不同。
9.根据权利要求8的分散体，其中第一粒子形状是球状且第二粒子形状是层状或针状。
10.根据权利要求1至9中任一项的分散体，其中第一和第二金属的平均粒径为0.01至100微米。
11.制备根据权利要求1至10中任一项的分散体的方法，其步骤包括：
A 混合组分A至C，和如果合适的话，D和E，以及其它组分，和
B 分散该混合物。
12.在不导电基底的至少一部分表面上生产金属层的方法，其步骤包括：
a)在基底上施加根据权利要求1至10中任一项的分散体；
b)干燥和/或硬化施加在基底上的层；和
c)如果合适的话，在干燥和/或硬化的分散体层上通过无电流法和/或电镀法沉积金属。
13.根据权利要求12的方法，其中在层a)中，分散体以结构化或全表面形式施加。
14.根据权利要求12或13的方法，其中步骤a)、b)和如果合适的话c)的至少一个在至少一定程度上以连续程序进行。
15.基底表面，带有可由根据权利要求12至14中任一项的方法获得的至少部分存在的导电金属层。
16.根据权利要求15的基底表面用于传导电流或传导热、或用作装饰性金属表面或用于屏蔽电磁辐射或用于磁化的用途。
17.根据权利要求16的用途，用作印刷电路板、RFID天线、发射机应答器天线、座位加热系统、带状电缆或非接触芯片卡。
18.根据权利要求1至10中任一项的悬浮液用于施加金属层的用途。
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| RU2556012C1 (ru) * | 2014-07-22 | 2015-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Ярославский государственный технический университет" (ФГБОУВПО "ЯГТУ") | Состав для изоляции пластин магнитопроводов трансформаторов |
| EP2995703B1 (de) * | 2014-09-09 | 2019-08-28 | Christian-Albrechts-Universität zu Kiel | Verfahren zur Herstellung von Flächenableitelektroden und Halbzeug zur Durchführung des Verfahrens |
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-
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- 2005-09-09 DE DE102005043242A patent/DE102005043242A1/de not_active Withdrawn
-
2006
- 2006-08-31 AT AT09173628T patent/ATE522910T1/de active
- 2006-08-31 CA CA002625013A patent/CA2625013A1/en not_active Abandoned
- 2006-08-31 CN CN2006800375716A patent/CN101283414B/zh not_active Expired - Fee Related
- 2006-08-31 US US12/066,340 patent/US20080206553A1/en not_active Abandoned
- 2006-08-31 RU RU2008113143/07A patent/RU2405222C2/ru not_active IP Right Cessation
- 2006-08-31 EP EP09173628A patent/EP2159805B1/de not_active Not-in-force
- 2006-08-31 BR BRPI0615863-3A patent/BRPI0615863A2/pt not_active Application Discontinuation
- 2006-08-31 KR KR1020087008087A patent/KR20080044327A/ko not_active Application Discontinuation
- 2006-08-31 WO PCT/EP2006/065875 patent/WO2007028762A2/de active Application Filing
- 2006-08-31 AT AT06793112T patent/ATE455157T1/de active
- 2006-08-31 EP EP06793112A patent/EP1926784B1/de not_active Revoked
- 2006-08-31 AU AU2006289126A patent/AU2006289126A1/en not_active Abandoned
- 2006-08-31 JP JP2008529610A patent/JP2009507952A/ja not_active Withdrawn
- 2006-08-31 DE DE502006005931T patent/DE502006005931D1/de active Active
- 2006-09-08 MY MYPI20064116A patent/MY144457A/en unknown
- 2006-09-08 MY MYPI20095022A patent/MY154908A/en unknown
- 2006-09-08 AR ARP060103917A patent/AR058037A1/es unknown
- 2006-09-08 TW TW095133154A patent/TW200718737A/zh unknown
-
2008
- 2008-02-28 IL IL189851A patent/IL189851A0/en unknown
- 2008-03-04 NO NO20081107A patent/NO20081107L/no not_active Application Discontinuation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102391633A (zh) * | 2009-12-17 | 2012-03-28 | 比亚迪股份有限公司 | 塑料组合物及其应用以及塑料表面选择性金属化的方法 |
| CN102391633B (zh) * | 2009-12-17 | 2013-12-04 | 比亚迪股份有限公司 | 塑料组合物及其应用以及塑料表面选择性金属化的方法 |
| CN101866704A (zh) * | 2010-06-29 | 2010-10-20 | 彩虹集团公司 | 一种低成本环保无卤型导电浆料 |
| CN102300446A (zh) * | 2011-06-27 | 2011-12-28 | 宜宾金川电子有限责任公司 | 一种用于物联网射频识别的电磁波复合吸收材料 |
| CN102300446B (zh) * | 2011-06-27 | 2014-06-11 | 宜宾金川电子有限责任公司 | 一种用于物联网射频识别的电磁波复合吸收材料 |
| CN104080956A (zh) * | 2011-12-02 | 2014-10-01 | 阿尔塔纳股份公司 | 在非导电衬底上制造的导电结构及其制造方法 |
| CN107949475A (zh) * | 2015-08-18 | 2018-04-20 | 惠普发展公司，有限责任合伙企业 | 复合材料 |
| US11046058B2 (en) | 2015-08-18 | 2021-06-29 | Hewlett-Packard Development Company, L.P. | Composite material |
| US10917964B2 (en) | 2017-08-10 | 2021-02-09 | Industrial Technology Research Institute | Primer composition and copper foil substrate using the same |
| CN111757820A (zh) * | 2018-01-10 | 2020-10-09 | 大众汽车股份公司 | 具有电的加热装置的车辆座椅 |
| CN112940604A (zh) * | 2021-03-18 | 2021-06-11 | 北京冬曦既驾科技咨询有限公司 | 导电涂料及其制备方法 |
| CN112940604B (zh) * | 2021-03-18 | 2022-04-29 | 广东安捷伦新材料科技有限公司 | 导电涂料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| IL189851A0 (en) | 2008-08-07 |
| BRPI0615863A2 (pt) | 2012-12-18 |
| CA2625013A1 (en) | 2007-03-15 |
| JP2009507952A (ja) | 2009-02-26 |
| EP1926784B1 (de) | 2010-01-13 |
| WO2007028762A3 (de) | 2007-06-28 |
| AR058037A1 (es) | 2008-01-23 |
| TW200718737A (en) | 2007-05-16 |
| RU2008113143A (ru) | 2009-10-20 |
| RU2405222C2 (ru) | 2010-11-27 |
| CN101283414B (zh) | 2011-09-14 |
| EP2159805B1 (de) | 2011-08-31 |
| ATE522910T1 (de) | 2011-09-15 |
| DE502006005931D1 (de) | 2010-03-04 |
| MY144457A (en) | 2011-09-30 |
| DE102005043242A1 (de) | 2007-03-15 |
| MY154908A (en) | 2015-08-28 |
| EP1926784A2 (de) | 2008-06-04 |
| EP2159805A1 (de) | 2010-03-03 |
| WO2007028762A2 (de) | 2007-03-15 |
| NO20081107L (no) | 2008-04-07 |
| AU2006289126A1 (en) | 2007-03-15 |
| ATE455157T1 (de) | 2010-01-15 |
| US20080206553A1 (en) | 2008-08-28 |
| KR20080044327A (ko) | 2008-05-20 |
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