TW200805000A - Exposure method and apparatus, maintenance method and device manufacturing method - Google Patents
Exposure method and apparatus, maintenance method and device manufacturing method Download PDFInfo
- Publication number
- TW200805000A TW200805000A TW096117939A TW96117939A TW200805000A TW 200805000 A TW200805000 A TW 200805000A TW 096117939 A TW096117939 A TW 096117939A TW 96117939 A TW96117939 A TW 96117939A TW 200805000 A TW200805000 A TW 200805000A
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- substrate
- exposure
- stage
- cleaning
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 119
- 238000012423 maintenance Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 686
- 239000007788 liquid Substances 0.000 claims abstract description 645
- 238000007654 immersion Methods 0.000 claims abstract description 205
- 238000004140 cleaning Methods 0.000 claims abstract description 171
- 230000003287 optical effect Effects 0.000 claims abstract description 164
- 230000007246 mechanism Effects 0.000 claims abstract description 98
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- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 4
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
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- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
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- 239000004698 Polyethylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 240000006394 Sorghum bicolor Species 0.000 description 1
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006139614 | 2006-05-18 | ||
| JP2006140957 | 2006-05-19 | ||
| JP2007103343 | 2007-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200805000A true TW200805000A (en) | 2008-01-16 |
Family
ID=38723302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096117939A TW200805000A (en) | 2006-05-18 | 2007-05-18 | Exposure method and apparatus, maintenance method and device manufacturing method |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8514366B2 (enExample) |
| EP (1) | EP2037486A4 (enExample) |
| JP (2) | JP5217239B2 (enExample) |
| KR (1) | KR20090018024A (enExample) |
| CN (2) | CN102298274A (enExample) |
| SG (1) | SG175671A1 (enExample) |
| TW (1) | TW200805000A (enExample) |
| WO (1) | WO2007135990A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7880860B2 (en) | 2004-12-20 | 2011-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
| EP1965414A4 (en) * | 2005-12-06 | 2010-08-25 | Nikon Corp | EXPOSURE METHOD, EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS |
| US7969548B2 (en) * | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
| EP2043134A4 (en) * | 2006-06-30 | 2012-01-25 | Nikon Corp | MAINTENANCE METHOD, EXPOSURE METHOD, AND DEVICE AND DEVICE MANUFACTURING METHOD |
| US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
| US7900641B2 (en) | 2007-05-04 | 2011-03-08 | Asml Netherlands B.V. | Cleaning device and a lithographic apparatus cleaning method |
| US7916269B2 (en) | 2007-07-24 | 2011-03-29 | Asml Netherlands B.V. | Lithographic apparatus and contamination removal or prevention method |
| US20090025753A1 (en) | 2007-07-24 | 2009-01-29 | Asml Netherlands B.V. | Lithographic Apparatus And Contamination Removal Or Prevention Method |
| SG151198A1 (en) | 2007-09-27 | 2009-04-30 | Asml Netherlands Bv | Methods relating to immersion lithography and an immersion lithographic apparatus |
| NL1035942A1 (nl) | 2007-09-27 | 2009-03-30 | Asml Netherlands Bv | Lithographic Apparatus and Method of Cleaning a Lithographic Apparatus. |
| NL1036273A1 (nl) | 2007-12-18 | 2009-06-19 | Asml Netherlands Bv | Lithographic apparatus and method of cleaning a surface of an immersion lithographic apparatus. |
| NL1036306A1 (nl) | 2007-12-20 | 2009-06-23 | Asml Netherlands Bv | Lithographic apparatus and in-line cleaning apparatus. |
| US8339572B2 (en) | 2008-01-25 | 2012-12-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2009182110A (ja) * | 2008-01-30 | 2009-08-13 | Nikon Corp | 露光装置、露光方法、及びデバイス製造方法 |
| JP2009295933A (ja) | 2008-06-09 | 2009-12-17 | Canon Inc | ダミー露光基板及びその製造方法、液浸露光装置、並びに、デバイス製造方法 |
| JP2010103363A (ja) * | 2008-10-24 | 2010-05-06 | Nec Electronics Corp | 液浸露光装置の洗浄方法、ダミーウェハ、及び液浸露光装置 |
| US20100283979A1 (en) * | 2008-10-31 | 2010-11-11 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
| NL2004540A (en) * | 2009-05-14 | 2010-11-18 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
| JP2010278299A (ja) * | 2009-05-29 | 2010-12-09 | Nikon Corp | 露光装置、露光方法、及びデバイス製造方法 |
| NL2005167A (en) * | 2009-10-02 | 2011-04-05 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
| NL2005610A (en) * | 2009-12-02 | 2011-06-06 | Asml Netherlands Bv | Lithographic apparatus and surface cleaning method. |
| KR101683411B1 (ko) * | 2009-12-18 | 2016-12-06 | 가부시키가이샤 니콘 | 기판 처리 장치의 메인터넌스 방법 및 안전 장치 |
| JPWO2012011512A1 (ja) * | 2010-07-20 | 2013-09-09 | 株式会社ニコン | 露光方法、露光装置および洗浄方法 |
| US20120057139A1 (en) * | 2010-08-04 | 2012-03-08 | Nikon Corporation | Cleaning method, device manufacturing method, cleaning substrate, liquid immersion member, liquid immersion exposure apparatus, and dummy substrate |
| US20120188521A1 (en) * | 2010-12-27 | 2012-07-26 | Nikon Corporation | Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium |
| NL2008183A (en) * | 2011-02-25 | 2012-08-28 | Asml Netherlands Bv | A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method. |
| US20130057837A1 (en) * | 2011-04-06 | 2013-03-07 | Nikon Corporation | Exposure apparatus, exposure method, device-manufacturing method, program, and recording medium |
| TWI503553B (zh) * | 2011-10-19 | 2015-10-11 | Johnstech Int Corp | 用於微電路測試器的導電開爾文接觸件 |
| KR102071873B1 (ko) * | 2012-12-27 | 2020-02-03 | 삼성디스플레이 주식회사 | 용매 제거장치 및 이를 포함하는 포토리소그래피 장치 |
| KR101573450B1 (ko) * | 2014-07-17 | 2015-12-11 | 주식회사 아이에스시 | 테스트용 소켓 |
| NL2015049A (en) | 2014-08-07 | 2016-07-08 | Asml Netherlands Bv | A lithography apparatus, a method of manufacturing a device and a control program. |
| WO2017084797A1 (en) * | 2015-11-20 | 2017-05-26 | Asml Netherlands B.V. | Lithographic apparatus and method of operating a lithographic apparatus |
| EP4155086B1 (en) | 2018-07-13 | 2025-02-12 | Hewlett-Packard Development Company, L.P. | Print liquid supply |
| ES2832495T3 (es) | 2018-07-13 | 2021-06-10 | Hewlett Packard Development Co | Suministro de líquido de impresión |
| JP7167333B2 (ja) | 2018-11-09 | 2022-11-08 | エーエスエムエル ホールディング エヌ．ブイ． | リソグラフィ装置内部のサポートをクリーニングするための装置及び方法 |
Family Cites Families (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
| JPS6144429A (ja) | 1984-08-09 | 1986-03-04 | Nippon Kogaku Kk <Nikon> | 位置合わせ方法、及び位置合せ装置 |
| US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
| JP3200874B2 (ja) | 1991-07-10 | 2001-08-20 | 株式会社ニコン | 投影露光装置 |
| US5243195A (en) | 1991-04-25 | 1993-09-07 | Nikon Corporation | Projection exposure apparatus having an off-axis alignment system and method of alignment therefor |
| US5559582A (en) * | 1992-08-28 | 1996-09-24 | Nikon Corporation | Exposure apparatus |
| JPH08313842A (ja) | 1995-05-15 | 1996-11-29 | Nikon Corp | 照明光学系および該光学系を備えた露光装置 |
| JP4029183B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
| JP4029182B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 露光方法 |
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-
2007
- 2007-05-18 CN CN2011102517818A patent/CN102298274A/zh active Pending
- 2007-05-18 CN CN200780011033.4A patent/CN101410948B/zh not_active Expired - Fee Related
- 2007-05-18 JP JP2007132800A patent/JP5217239B2/ja not_active Expired - Fee Related
- 2007-05-18 SG SG2011077435A patent/SG175671A1/en unknown
- 2007-05-18 EP EP07743663A patent/EP2037486A4/en not_active Withdrawn
- 2007-05-18 KR KR1020087024125A patent/KR20090018024A/ko not_active Ceased
- 2007-05-18 WO PCT/JP2007/060228 patent/WO2007135990A1/ja not_active Ceased
- 2007-05-18 TW TW096117939A patent/TW200805000A/zh unknown
-
2008
- 2008-10-21 US US12/289,148 patent/US8514366B2/en not_active Expired - Fee Related
-
2012
- 2012-03-30 JP JP2012080199A patent/JP2012164992A/ja active Pending
-
2013
- 2013-07-16 US US13/943,207 patent/US20130301019A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012164992A (ja) | 2012-08-30 |
| WO2007135990A1 (ja) | 2007-11-29 |
| CN101410948A (zh) | 2009-04-15 |
| US20130301019A1 (en) | 2013-11-14 |
| US8514366B2 (en) | 2013-08-20 |
| JP2008283156A (ja) | 2008-11-20 |
| JP5217239B2 (ja) | 2013-06-19 |
| SG175671A1 (en) | 2011-11-28 |
| CN102298274A (zh) | 2011-12-28 |
| KR20090018024A (ko) | 2009-02-19 |
| US20090066922A1 (en) | 2009-03-12 |
| EP2037486A4 (en) | 2012-01-11 |
| CN101410948B (zh) | 2011-10-26 |
| EP2037486A1 (en) | 2009-03-18 |
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