TW200727078A - Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same - Google Patents

Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same

Info

Publication number
TW200727078A
TW200727078A TW095135391A TW95135391A TW200727078A TW 200727078 A TW200727078 A TW 200727078A TW 095135391 A TW095135391 A TW 095135391A TW 95135391 A TW95135391 A TW 95135391A TW 200727078 A TW200727078 A TW 200727078A
Authority
TW
Taiwan
Prior art keywords
same
photosetting
wiring board
printed wiring
resin composition
Prior art date
Application number
TW095135391A
Other languages
English (en)
Other versions
TWI336026B (zh
Inventor
Nobuhito Itoh
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200727078A publication Critical patent/TW200727078A/zh
Application granted granted Critical
Publication of TWI336026B publication Critical patent/TWI336026B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW095135391A 2005-10-04 2006-09-25 Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same TW200727078A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005290765A JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Publications (2)

Publication Number Publication Date
TW200727078A true TW200727078A (en) 2007-07-16
TWI336026B TWI336026B (zh) 2011-01-11

Family

ID=38028841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135391A TW200727078A (en) 2005-10-04 2006-09-25 Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same

Country Status (4)

Country Link
JP (1) JP4849860B2 (zh)
KR (1) KR100787325B1 (zh)
CN (1) CN1945434B (zh)
TW (1) TW200727078A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP5449688B2 (ja) * 2008-03-26 2014-03-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2009239181A (ja) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板
KR101612569B1 (ko) * 2008-03-28 2016-04-14 다이요 홀딩스 가부시키가이샤 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판
CN102199273B (zh) * 2010-03-25 2014-07-09 株式会社艾迪科 光固化树脂和使用该树脂的分散剂
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP5660690B2 (ja) * 2013-08-02 2015-01-28 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
KR102415755B1 (ko) * 2015-01-21 2022-07-04 다이요 잉키 세이조 가부시키가이샤 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6892668B2 (ja) * 2016-10-14 2021-06-23 互応化学工業株式会社 感光性樹脂組成物
JP7109186B2 (ja) * 2017-12-27 2022-07-29 株式会社Ｄｎｐファインケミカル ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272A (ja) * 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
EP0774476A4 (en) * 1995-06-06 2002-01-16 Nof Corp THERMALIZING COMPOSITION, METHOD FOR FINISHING AND ITEMS COATED ITEMS
JP3963602B2 (ja) * 1999-01-27 2007-08-22 富士フイルム株式会社 遠紫外線露光用ポジ型フォトレジスト組成物
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
CN1193056C (zh) * 2000-01-18 2005-03-16 太阳油墨制造株式会社 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物
EP1276011B1 (en) * 2000-03-29 2004-05-26 Kanagawa University Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same
JP2003076015A (ja) * 2001-09-07 2003-03-14 Nichigo Morton Co Ltd 感光性樹脂組成物及びそれを用いたドライフィルム
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP4309225B2 (ja) * 2003-10-14 2009-08-05 太陽インキ製造株式会社 硬化性組成物、その硬化物及びそれを用いたプリント配線板
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP4815952B2 (ja) * 2005-08-26 2011-11-16 Ｊｓｒ株式会社 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル

Also Published As

Publication number Publication date
TWI336026B (zh) 2011-01-11
JP4849860B2 (ja) 2012-01-11
KR20070037998A (ko) 2007-04-09
CN1945434A (zh) 2007-04-11
CN1945434B (zh) 2010-05-12
JP2007101830A (ja) 2007-04-19
KR100787325B1 (ko) 2007-12-21

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