JP4849860B2 - 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 - Google Patents
光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 Download PDFInfo
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- JP4849860B2 JP4849860B2 JP2005290765A JP2005290765A JP4849860B2 JP 4849860 B2 JP4849860 B2 JP 4849860B2 JP 2005290765 A JP2005290765 A JP 2005290765A JP 2005290765 A JP2005290765 A JP 2005290765A JP 4849860 B2 JP4849860 B2 JP 4849860B2
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- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 5
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 5
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- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
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- 229920005906 polyester polyol Polymers 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
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- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005290765A JP4849860B2 (ja) | 2005-10-04 | 2005-10-04 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
| TW095135391A TW200727078A (en) | 2005-10-04 | 2006-09-25 | Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same |
| KR1020060095264A KR100787325B1 (ko) | 2005-10-04 | 2006-09-29 | 광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판 |
| CN2006101404506A CN1945434B (zh) | 2005-10-04 | 2006-10-08 | 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 |
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| KR (1) | KR100787325B1 (zh) |
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| JP5513711B2 (ja) * | 2007-10-01 | 2014-06-04 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
| JP4975579B2 (ja) * | 2007-10-01 | 2012-07-11 | 太陽ホールディングス株式会社 | 組成物、ドライフィルム、硬化物及びプリント配線板 |
| JP5376793B2 (ja) * | 2007-11-07 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
| JP5449688B2 (ja) * | 2008-03-26 | 2014-03-19 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP5787516B2 (ja) * | 2008-03-28 | 2015-09-30 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物とその硬化物、およびプリント配線板 |
| JP2009239181A (ja) * | 2008-03-28 | 2009-10-15 | Taiyo Ink Mfg Ltd | プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板 |
| CN102199273B (zh) * | 2010-03-25 | 2014-07-09 | 株式会社艾迪科 | 光固化树脂和使用该树脂的分散剂 |
| JP6084353B2 (ja) * | 2010-12-28 | 2017-02-22 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法 |
| JP5660690B2 (ja) * | 2013-08-02 | 2015-01-28 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
| CN107207837B (zh) * | 2015-01-21 | 2020-04-07 | 太阳油墨制造株式会社 | 热固化性树脂组合物、干膜、固化物和印刷电路板 |
| JP6892668B2 (ja) * | 2016-10-14 | 2021-06-23 | 互応化学工業株式会社 | 感光性樹脂組成物 |
| JP7109186B2 (ja) * | 2017-12-27 | 2022-07-29 | 株式会社Ｄｎｐファインケミカル | ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体 |
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| JPS61272A (ja) * | 1984-06-12 | 1986-01-06 | Taiyo Ink Seizo Kk | インキ組成物 |
| JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
| JP2684948B2 (ja) * | 1993-02-03 | 1997-12-03 | 株式会社日本触媒 | 液状感光性樹脂組成物 |
| EP0774476A4 (en) * | 1995-06-06 | 2002-01-16 | Nof Corp | THERMALIZING COMPOSITION, METHOD FOR FINISHING AND ITEMS COATED ITEMS |
| JP3963602B2 (ja) * | 1999-01-27 | 2007-08-22 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| TW494276B (en) * | 1999-05-06 | 2002-07-11 | Solar Blak Water Co Ltd | Solder resist ink composition |
| WO2001053375A1 (fr) * | 2000-01-18 | 2001-07-26 | Taiyo Ink Manufacturing Co., Ltd. | Compose epoxyde polynucleaire, resine durcissable par rayon energetique actinique obtenue a partir de ce compose, et composition de resine photodurcissable/thermodurcissable contenant ladite resine |
| EP1276011B1 (en) * | 2000-03-29 | 2004-05-26 | Kanagawa University | Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| JP2003076015A (ja) * | 2001-09-07 | 2003-03-14 | Nichigo Morton Co Ltd | 感光性樹脂組成物及びそれを用いたドライフィルム |
| JP4328593B2 (ja) * | 2003-09-18 | 2009-09-09 | 太陽インキ製造株式会社 | カルボキシル基含有感光性樹脂を含有する組成物 |
| JP4309225B2 (ja) * | 2003-10-14 | 2009-08-05 | 太陽インキ製造株式会社 | 硬化性組成物、その硬化物及びそれを用いたプリント配線板 |
| JP3912405B2 (ja) * | 2003-11-11 | 2007-05-09 | 三菱化学株式会社 | 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置 |
| JP4489566B2 (ja) * | 2003-11-27 | 2010-06-23 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物、およびプリント配線板 |
| TW200519535A (en) * | 2003-11-27 | 2005-06-16 | Taiyo Ink Mfg Co Ltd | Hardenable resin composition, hardened body thereof, and printed circuit board |
| JP4815952B2 (ja) * | 2005-08-26 | 2011-11-16 | Ｊｓｒ株式会社 | 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1945434A (zh) | 2007-04-11 |
| TWI336026B (zh) | 2011-01-11 |
| TW200727078A (en) | 2007-07-16 |
| KR20070037998A (ko) | 2007-04-09 |
| KR100787325B1 (ko) | 2007-12-21 |
| JP2007101830A (ja) | 2007-04-19 |
| CN1945434B (zh) | 2010-05-12 |
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