TW200719443A - Semiconductor device and manufacturing method of the same - Google Patents
Semiconductor device and manufacturing method of the sameInfo
- Publication number
- TW200719443A TW200719443A TW095104709A TW95104709A TW200719443A TW 200719443 A TW200719443 A TW 200719443A TW 095104709 A TW095104709 A TW 095104709A TW 95104709 A TW95104709 A TW 95104709A TW 200719443 A TW200719443 A TW 200719443A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor element
- semiconductor device
- manufacturing
- same
- sealing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 abstract 4
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005330499A JP4382030B2 (ja) | 2005-11-15 | 2005-11-15 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719443A true TW200719443A (en) | 2007-05-16 |
TWI306291B TWI306291B (en) | 2009-02-11 |
Family
ID=37836840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104709A TWI306291B (en) | 2005-11-15 | 2006-02-13 | Semiconductor device and manufacturing method of the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US7719097B2 (zh) |
EP (1) | EP1786033B1 (zh) |
JP (1) | JP4382030B2 (zh) |
KR (1) | KR100681781B1 (zh) |
CN (1) | CN100565891C (zh) |
TW (1) | TWI306291B (zh) |
Cited By (2)
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TWI567834B (zh) * | 2014-06-13 | 2017-01-21 | 新東亞微電子股份有限公司 | 指紋辨識晶片封裝模組的製造方法 |
US12009377B2 (en) | 2019-02-21 | 2024-06-11 | Sony Semiconductor Solutions Corporation | Solid-state imaging device and electronic apparatus for curbing deterioration of picture quality |
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US8093672B2 (en) * | 2005-10-28 | 2012-01-10 | Panasonic Corporation | Solid-state imaging device |
JP4838609B2 (ja) * | 2006-03-22 | 2011-12-14 | 富士通セミコンダクター株式会社 | 半導体装置 |
US7964945B2 (en) * | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
JP2009152481A (ja) * | 2007-12-21 | 2009-07-09 | Shinko Electric Ind Co Ltd | 撮像用半導体装置および撮像用半導体装置の製造方法 |
JPWO2009113262A1 (ja) * | 2008-03-11 | 2011-07-21 | パナソニック株式会社 | 半導体デバイスおよび半導体デバイスの製造方法 |
US9142480B2 (en) * | 2008-08-15 | 2015-09-22 | Intel Corporation | Microelectronic package with high temperature thermal interface material |
JP2010098117A (ja) * | 2008-10-16 | 2010-04-30 | Nec Electronics Corp | 電子装置および電子装置の製造方法 |
TWI398949B (zh) * | 2009-07-29 | 2013-06-11 | Kingpak Tech Inc | 模造成型之影像感測器封裝結構製造方法及封裝結構 |
JP2011128140A (ja) * | 2009-11-19 | 2011-06-30 | Dainippon Printing Co Ltd | センサデバイス及びその製造方法 |
TWI425825B (zh) * | 2009-12-31 | 2014-02-01 | Kingpak Tech Inc | 免調焦距影像感測器封裝結構 |
US8796798B2 (en) * | 2010-01-27 | 2014-08-05 | Ricoh Company, Ltd. | Imaging module, fabricating method therefor, and imaging device |
JP2011238667A (ja) * | 2010-05-06 | 2011-11-24 | Shinko Electric Ind Co Ltd | 固体撮像装置の製造方法および固体撮像装置 |
JP2013229675A (ja) * | 2012-04-24 | 2013-11-07 | Sony Corp | 撮像ユニット及び撮像装置 |
JP2014130077A (ja) * | 2012-12-28 | 2014-07-10 | Hitachi High-Technologies Corp | パターン形状評価方法、半導体装置の製造方法及びパターン形状評価装置 |
US9608029B2 (en) * | 2013-06-28 | 2017-03-28 | Stmicroelectronics Pte Ltd. | Optical package with recess in transparent cover |
TW201508931A (zh) | 2013-08-16 | 2015-03-01 | Upi Semiconductor Corp | 光學感測器及其製造方法 |
SG10201705797UA (en) * | 2013-09-10 | 2017-08-30 | Heptagon Micro Optics Pte Ltd | Compact opto-electronic modules and fabrication methods for such modules |
US20150116576A1 (en) * | 2013-10-30 | 2015-04-30 | Blackberry Limited | Image capture assembly, digital camera and a mobile device having an improved construction |
WO2015126328A1 (en) | 2014-02-18 | 2015-08-27 | Heptagon Micro Optics Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
CN103996687A (zh) * | 2014-06-12 | 2014-08-20 | 中国电子科技集团公司第四十四研究所 | 局部减薄背照式图像传感器结构及其封装工艺 |
TWI575761B (zh) * | 2016-04-27 | 2017-03-21 | 南茂科技股份有限公司 | 光電晶片封裝體及光電晶片封裝製程 |
CN108231700B (zh) * | 2016-12-21 | 2020-03-03 | 苏州迈瑞微电子有限公司 | 芯片封装结构和方法 |
KR102404330B1 (ko) * | 2017-06-13 | 2022-06-07 | 삼성전기주식회사 | 이미지 센서 모듈 및 이의 제조방법 |
WO2019142785A1 (ja) * | 2018-01-16 | 2019-07-25 | 富士フイルム株式会社 | 撮像ユニット及び撮像装置 |
CN110828387B (zh) | 2018-08-10 | 2021-10-22 | 财团法人工业技术研究院 | 保护结构以及具有此保护结构的电子装置 |
CN111200701B (zh) * | 2018-11-20 | 2021-08-10 | 中芯集成电路(宁波)有限公司 | 摄像组件及其封装方法、镜头模组、电子设备 |
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CN111199985B (zh) * | 2018-11-20 | 2023-04-18 | 中芯集成电路(宁波)有限公司 | 摄像组件及其封装方法、镜头模组、电子设备 |
JP7462620B2 (ja) | 2019-05-15 | 2024-04-05 | ソニーセミコンダクタソリューションズ株式会社 | 半導体パッケージ、半導体パッケージの製造方法、および、電子装置 |
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JP7303698B2 (ja) | 2019-08-08 | 2023-07-05 | キヤノン株式会社 | 半導体装置および機器 |
KR20210158012A (ko) | 2020-06-23 | 2021-12-30 | 삼성전자주식회사 | 시모스 이미지 센서 패키지 |
US11543654B2 (en) * | 2020-09-16 | 2023-01-03 | Aac Optics Solutions Pte. Ltd. | Lens module and system for producing image having lens module |
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JP2005330499A (ja) | 2004-04-21 | 2005-12-02 | Jfe Steel Kk | 粉末冶金用鉄基混合粉末 |
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2005
- 2005-11-15 JP JP2005330499A patent/JP4382030B2/ja active Active
-
2006
- 2006-02-09 EP EP06002647A patent/EP1786033B1/en active Active
- 2006-02-10 US US11/350,759 patent/US7719097B2/en active Active
- 2006-02-13 TW TW095104709A patent/TWI306291B/zh active
- 2006-02-27 KR KR1020060018726A patent/KR100681781B1/ko active IP Right Grant
- 2006-03-02 CN CNB2006100547288A patent/CN100565891C/zh active Active
-
2010
- 2010-03-29 US US12/749,440 patent/US7932121B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI567834B (zh) * | 2014-06-13 | 2017-01-21 | 新東亞微電子股份有限公司 | 指紋辨識晶片封裝模組的製造方法 |
US12009377B2 (en) | 2019-02-21 | 2024-06-11 | Sony Semiconductor Solutions Corporation | Solid-state imaging device and electronic apparatus for curbing deterioration of picture quality |
Also Published As
Publication number | Publication date |
---|---|
EP1786033A2 (en) | 2007-05-16 |
TWI306291B (en) | 2009-02-11 |
US20070108578A1 (en) | 2007-05-17 |
KR100681781B1 (ko) | 2007-02-12 |
US7932121B2 (en) | 2011-04-26 |
JP4382030B2 (ja) | 2009-12-09 |
US20100248453A1 (en) | 2010-09-30 |
CN1967853A (zh) | 2007-05-23 |
US7719097B2 (en) | 2010-05-18 |
EP1786033A3 (en) | 2008-05-21 |
EP1786033B1 (en) | 2012-10-31 |
CN100565891C (zh) | 2009-12-02 |
JP2007141957A (ja) | 2007-06-07 |
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