TW200711168A - Packaging designs for LEDs - Google Patents

Packaging designs for LEDs

Info

Publication number
TW200711168A
TW200711168A TW095101693A TW95101693A TW200711168A TW 200711168 A TW200711168 A TW 200711168A TW 095101693 A TW095101693 A TW 095101693A TW 95101693 A TW95101693 A TW 95101693A TW 200711168 A TW200711168 A TW 200711168A
Authority
TW
Taiwan
Prior art keywords
leds
packaging designs
designs
packaging
processes
Prior art date
Application number
TW095101693A
Other languages
Chinese (zh)
Other versions
TWI356506B (en
Inventor
Alexei A Erchak
Paul Pannacione
Karlicek, Jr
Michael Lim
Elefterios Lidorikis
Jo A Venezia
Christian Hoepfner
Original Assignee
Luminus Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/209,957 external-priority patent/US7170100B2/en
Priority claimed from US11/210,013 external-priority patent/US7692207B2/en
Application filed by Luminus Devices Inc filed Critical Luminus Devices Inc
Publication of TW200711168A publication Critical patent/TW200711168A/en
Application granted granted Critical
Publication of TWI356506B publication Critical patent/TWI356506B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Led Device Packages (AREA)
  • Packages (AREA)

Abstract

Light-emitting devices, and related components, processes, systems and methods are disclosed.
TW095101693A 2005-01-21 2006-01-17 Light-emitting system TWI356506B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US64572005P 2005-01-21 2005-01-21
US64572105P 2005-01-21 2005-01-21
US65986105P 2005-03-08 2005-03-08
US66092105P 2005-03-11 2005-03-11
US11/209,957 US7170100B2 (en) 2005-01-21 2005-08-23 Packaging designs for LEDs
US11/210,013 US7692207B2 (en) 2005-01-21 2005-08-23 Packaging designs for LEDs

Publications (2)

Publication Number Publication Date
TW200711168A true TW200711168A (en) 2007-03-16
TWI356506B TWI356506B (en) 2012-01-11

Family

ID=45047349

Family Applications (3)

Application Number Title Priority Date Filing Date
TW095101693A TWI356506B (en) 2005-01-21 2006-01-17 Light-emitting system
TW100104727A TW201125160A (en) 2005-01-21 2006-01-17 Packaging designs for LEDs
TW100104726A TW201125159A (en) 2005-01-21 2006-01-17 Packaging designs for LEDs

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW100104727A TW201125160A (en) 2005-01-21 2006-01-17 Packaging designs for LEDs
TW100104726A TW201125159A (en) 2005-01-21 2006-01-17 Packaging designs for LEDs

Country Status (1)

Country Link
TW (3) TWI356506B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556478B (en) 2014-06-30 2016-11-01 億光電子工業股份有限公司 Light emitting diode device
TWI626770B (en) * 2014-06-30 2018-06-11 億光電子工業股份有限公司 Light emitting diode device

Also Published As

Publication number Publication date
TW201125159A (en) 2011-07-16
TWI356506B (en) 2012-01-11
TW201125160A (en) 2011-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees