FR2819634B1 - Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication - Google Patents
Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabricationInfo
- Publication number
- FR2819634B1 FR2819634B1 FR0100473A FR0100473A FR2819634B1 FR 2819634 B1 FR2819634 B1 FR 2819634B1 FR 0100473 A FR0100473 A FR 0100473A FR 0100473 A FR0100473 A FR 0100473A FR 2819634 B1 FR2819634 B1 FR 2819634B1
- Authority
- FR
- France
- Prior art keywords
- insert
- sensor
- semiconductor package
- manufacturing
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0100473A FR2819634B1 (fr) | 2001-01-15 | 2001-01-15 | Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication |
PCT/FR2002/000069 WO2002056388A2 (fr) | 2001-01-15 | 2002-01-10 | Boîtier semi-conducteur a capteur, muni d'un insert, et son procede de fabrication |
US10/466,191 US7095123B2 (en) | 2001-01-15 | 2002-01-10 | Sensor semiconductor package, provided with an insert, and method for making same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0100473A FR2819634B1 (fr) | 2001-01-15 | 2001-01-15 | Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2819634A1 FR2819634A1 (fr) | 2002-07-19 |
FR2819634B1 true FR2819634B1 (fr) | 2004-01-16 |
Family
ID=8858814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0100473A Expired - Fee Related FR2819634B1 (fr) | 2001-01-15 | 2001-01-15 | Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication |
Country Status (3)
Country | Link |
---|---|
US (1) | US7095123B2 (fr) |
FR (1) | FR2819634B1 (fr) |
WO (1) | WO2002056388A2 (fr) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7127793B2 (en) * | 2002-04-24 | 2006-10-31 | Fuji Photo Film Co., Ltd. | Method of producing solid state pickup device |
WO2004047421A2 (fr) | 2002-11-14 | 2004-06-03 | Donnelly Corporation | Systeme d'imagerie pour vehicule |
SG111092A1 (en) | 2002-11-15 | 2005-05-30 | St Microelectronics Pte Ltd | Semiconductor device package and method of manufacture |
US20060003483A1 (en) * | 2003-07-07 | 2006-01-05 | Wolff Larry L | Optoelectronic packaging with embedded window |
US7897920B2 (en) * | 2005-09-21 | 2011-03-01 | Analog Devices, Inc. | Radiation sensor device and method |
US8476591B2 (en) * | 2005-09-21 | 2013-07-02 | Analog Devices, Inc. | Radiation sensor device and method |
WO2007053404A2 (fr) * | 2005-10-28 | 2007-05-10 | Donnelly Corporation | Module d'appareil de prise de vues pour système de vision de véhicule |
JP4382030B2 (ja) | 2005-11-15 | 2009-12-09 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
EP2097725B1 (fr) | 2006-12-27 | 2019-08-28 | Analog Devices, Inc. | Ouverture de commande pour un détecteur ir |
US8482664B2 (en) | 2008-10-16 | 2013-07-09 | Magna Electronics Inc. | Compact camera and cable system for vehicular applications |
CN102379119B (zh) | 2009-02-06 | 2015-02-25 | 马格纳电子系统公司 | 用于安装在车辆上的照相机 |
CN102449524B (zh) | 2009-03-25 | 2015-03-11 | 马格纳电子系统公司 | 车辆摄相机和透镜组装 |
TW201104747A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure |
DE102011013468A1 (de) * | 2011-03-09 | 2012-09-13 | Micronas Gmbh | Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses |
US9380219B2 (en) | 2011-04-20 | 2016-06-28 | Magna Electronics Inc. | Angular filter for vehicle mounted cameras |
US9596387B2 (en) | 2011-08-02 | 2017-03-14 | Magna Electronics Inc. | Vehicular camera system |
US9871971B2 (en) | 2011-08-02 | 2018-01-16 | Magma Electronics Inc. | Vehicle vision system with light baffling system |
US8802508B2 (en) | 2012-11-29 | 2014-08-12 | Freescale Semiconductor, Inc. | Semiconductor device package |
US9451138B2 (en) | 2013-11-07 | 2016-09-20 | Magna Electronics Inc. | Camera for vehicle vision system |
US9749509B2 (en) | 2014-03-13 | 2017-08-29 | Magna Electronics Inc. | Camera with lens for vehicle vision system |
EP2765410B1 (fr) * | 2014-06-06 | 2023-02-22 | Sensirion AG | Structure d'emballage de capteur de gaz |
US10250004B2 (en) | 2015-11-05 | 2019-04-02 | Magna Electronics Inc. | Method of forming a connector for an electrical cable for electrically connecting to a camera of a vehicle |
US10560613B2 (en) | 2015-11-05 | 2020-02-11 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10351072B2 (en) | 2015-11-05 | 2019-07-16 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10230875B2 (en) | 2016-04-14 | 2019-03-12 | Magna Electronics Inc. | Camera for vehicle vision system |
US10142532B2 (en) | 2016-04-08 | 2018-11-27 | Magna Electronics Inc. | Camera for vehicle vision system |
CN107611147B (zh) * | 2016-07-11 | 2020-02-18 | 胜丽国际股份有限公司 | 多芯片塑胶球状数组封装结构 |
US10237456B2 (en) | 2016-08-22 | 2019-03-19 | Magna Electronics Inc. | Vehicle camera assembly process |
FR3073980A1 (fr) | 2017-11-23 | 2019-05-24 | Stmicroelectronics (Grenoble 2) Sas | Capot d'encapsulation pour boitier electronique et procede de fabrication |
US11683911B2 (en) | 2018-10-26 | 2023-06-20 | Magna Electronics Inc. | Vehicular sensing device with cooling feature |
US11438487B2 (en) | 2019-03-07 | 2022-09-06 | Magna Electronics Inc. | Vehicular camera with thermal interface material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134187A (ja) * | 1984-12-04 | 1986-06-21 | Toshiba Corp | 固体撮像デバイス |
US4812420A (en) * | 1986-09-30 | 1989-03-14 | Mitsubishi Denki Kabushiki Kaisha | Method of producing a semiconductor device having a light transparent window |
JPS63186469A (ja) * | 1987-01-28 | 1988-08-02 | Mitsubishi Electric Corp | 光透過窓を有する半導体装置 |
JP2878875B2 (ja) * | 1991-09-17 | 1999-04-05 | 株式会社東芝 | Ccdモジュール |
US5534725A (en) * | 1992-06-16 | 1996-07-09 | Goldstar Electron Co., Ltd. | Resin molded charge coupled device package and method for preparation thereof |
DE19958229B4 (de) * | 1998-12-09 | 2007-05-31 | Fuji Electric Co., Ltd., Kawasaki | Optisches Halbleiter-Sensorbauelement |
-
2001
- 2001-01-15 FR FR0100473A patent/FR2819634B1/fr not_active Expired - Fee Related
-
2002
- 2002-01-10 US US10/466,191 patent/US7095123B2/en not_active Expired - Lifetime
- 2002-01-10 WO PCT/FR2002/000069 patent/WO2002056388A2/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2002056388A3 (fr) | 2003-01-03 |
US20040077118A1 (en) | 2004-04-22 |
WO2002056388A2 (fr) | 2002-07-18 |
US7095123B2 (en) | 2006-08-22 |
FR2819634A1 (fr) | 2002-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2819634B1 (fr) | Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication | |
MY123249A (en) | A semiconductor device and a method of manufacturing the same and an electronic device | |
EP1098183A3 (fr) | Capteur de pression à semiconducteur | |
TWI264756B (en) | Semiconductor device | |
SG99937A1 (en) | An electronic device and a method of manufacturing the same | |
EP1263062A3 (fr) | Dispositif semiconducteur organique et procédé de sa fabrication | |
GB2360629B (en) | Resin-encapsulated semiconductor device | |
WO2003049204A3 (fr) | Composant optoelectronique | |
DE60137033D1 (de) | Eingekapselte anzeigevorrichtung | |
WO2001093310A3 (fr) | Dispositif semiconducteur a injection electronique verticale et son procede de fabrication | |
AU5414696A (en) | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages | |
EP0712160A3 (fr) | Améliorations dans ou relatives à des circuits intégrés | |
ATE337617T1 (de) | Integrierte hallanordnung | |
EP0898180A3 (fr) | Boítier pour un dispositif capteur de champ magnétique | |
CA2470494A1 (fr) | Dispositif de detection ayant une lentille integree bi-radiale | |
EP1191590A3 (fr) | Dispositif semi-conducteur et module semi-conducteur | |
EP0825653A3 (fr) | Encapsulation d'un dispositif optoélectronique | |
EP0780896A3 (fr) | Boítier électronique amélioré | |
SG77721A1 (en) | A semiconductor integrated circuit device an a method of manufacturing the same | |
GB9818474D0 (en) | Multi-layer interconnect package for optical devices & standard semiconductor chips | |
EP1503421A3 (fr) | Dispositif d'imagerie à l'état solide et sa procédé de fabrication | |
TW331036B (en) | Integrated circuit functionality security | |
EP1686617A3 (fr) | Capteur d'image à l'état solide et son procédé de fabrication | |
FR2879889B1 (fr) | Boitier miniature hyperfrequence et procede de fabrication du boitier | |
SG127716A1 (en) | Mold die and method for manufacturing semiconductor device using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20070930 |