TW200717534A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW200717534A
TW200717534A TW095130652A TW95130652A TW200717534A TW 200717534 A TW200717534 A TW 200717534A TW 095130652 A TW095130652 A TW 095130652A TW 95130652 A TW95130652 A TW 95130652A TW 200717534 A TW200717534 A TW 200717534A
Authority
TW
Taiwan
Prior art keywords
voltage
internal
level
signal
power supply
Prior art date
Application number
TW095130652A
Other languages
English (en)
Inventor
Kenji Yoshinaga
Fukashi Morishita
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200717534A publication Critical patent/TW200717534A/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06—Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
TW095130652A 2005-09-01 2006-08-21 Semiconductor device TW200717534A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005253508A JP2007066463A (ja) 2005-09-01 2005-09-01 半導体装置

Publications (1)

Publication Number Publication Date
TW200717534A true TW200717534A (en) 2007-05-01

Family

ID=37803883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130652A TW200717534A (en) 2005-09-01 2006-08-21 Semiconductor device

Country Status (5)

Country Link
US (2) US7430149B2 (zh)
JP (1) JP2007066463A (zh)
KR (1) KR20070026098A (zh)
CN (1) CN1925058B (zh)
TW (1) TW200717534A (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007066463A (ja) * 2005-09-01 2007-03-15 Renesas Technology Corp 半導体装置
KR100846392B1 (ko) * 2006-08-31 2008-07-15 주식회사 하이닉스반도체 반도체 메모리 장치
JP4984759B2 (ja) * 2006-09-05 2012-07-25 富士通セミコンダクター株式会社 半導体記憶装置
JP5098395B2 (ja) * 2007-03-29 2012-12-12 セイコーエプソン株式会社 電気泳動表示パネルの駆動装置、電気泳動表示装置及び電子機器
EP2539897B1 (en) * 2010-02-23 2020-03-18 Rambus Inc. Methods and circuits for dynamically scaling dram power and performance
US8374049B2 (en) * 2010-04-08 2013-02-12 Agiga Tech Inc. DIMM memory module reference voltage switching circuit
JP2011227957A (ja) * 2010-04-19 2011-11-10 Toshiba Corp 不揮発性半導体記憶装置
US8867278B2 (en) 2011-02-28 2014-10-21 Samsung Electronics Co., Ltd. Nonvolatile memory device, memory system including the same, and method of operating nonvolatile memory device
US8705282B2 (en) * 2011-11-01 2014-04-22 Silicon Storage Technology, Inc. Mixed voltage non-volatile memory integrated circuit with power saving
KR101874408B1 (ko) 2011-11-09 2018-07-05 삼성전자주식회사 비휘발성 메모리 장치 및 이를 포함하는 메모리 시스템
US9672885B2 (en) * 2012-09-04 2017-06-06 Qualcomm Incorporated MRAM word line power control scheme
US8988957B2 (en) * 2012-11-07 2015-03-24 Apple Inc. Sense amplifier soft-fail detection circuit
US9928903B2 (en) 2015-03-30 2018-03-27 Toshiba Memory Corporation Semiconductor storage device with voltage generator which generates voltages and currents for read and write operations
KR102280433B1 (ko) * 2015-09-23 2021-07-22 삼성전자주식회사 전력 공급 회로 및 이를 포함하는 저장 장치
US10311191B2 (en) * 2017-01-26 2019-06-04 Advanced Micro Devices, Inc. Memory including side-car arrays with irregular sized entries
US10664035B2 (en) * 2017-08-31 2020-05-26 Qualcomm Incorporated Reconfigurable power delivery networks
US11204826B2 (en) * 2018-09-28 2021-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Memory error detection and correction
CN109559767B (zh) * 2018-11-28 2021-11-16 安徽大学 采用两个灵敏放大器技术抵抗位线泄漏电流的电路结构
CN109545259B (zh) * 2018-11-28 2021-11-16 安徽大学 采用三个灵敏放大器抵抗位线泄漏电流的电路结构
US11651802B1 (en) * 2021-11-17 2023-05-16 Everspin Technologies, Inc. Systems and methods for dual standby modes in memory

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940007298B1 (ko) 1992-05-30 1994-08-12 삼성전자 주식회사 Cmos트랜지스터를 사용한 기준전압 발생회로
JP3926005B2 (ja) 1997-10-27 2007-06-06 エルピーダメモリ株式会社 基準電圧発生回路
JP2000021170A (ja) * 1998-04-30 2000-01-21 Mitsubishi Electric Corp 半導体集積回路装置
JP2000011671A (ja) 1998-06-29 2000-01-14 Hitachi Ltd 半導体記憶装置
JP2000156085A (ja) * 1998-11-20 2000-06-06 Toshiba Corp 半導体記憶装置
JP4437565B2 (ja) * 1998-11-26 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体集積回路装置、半導体集積回路装置の設計方法、及び、記録媒体
JP2001084791A (ja) * 1999-07-12 2001-03-30 Mitsubishi Electric Corp 半導体記憶装置
JP3367519B2 (ja) * 1999-12-03 2003-01-14 日本電気株式会社 半導体記憶装置及びそのテスト方法
JP3957469B2 (ja) * 2000-04-11 2007-08-15 Ｎｅｃエレクトロニクス株式会社 半導体記憶装置
JP2001338489A (ja) * 2000-05-24 2001-12-07 Mitsubishi Electric Corp 半導体装置
JP2002042459A (ja) 2000-07-26 2002-02-08 Mitsubishi Electric Corp 半導体集積回路装置
JP2002074967A (ja) 2000-08-29 2002-03-15 Mitsubishi Electric Corp 降圧電源回路
JP5041631B2 (ja) * 2001-06-15 2012-10-03 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP4222766B2 (ja) 2002-03-22 2009-02-12 株式会社リコー 温度検出回路
JP4091410B2 (ja) 2002-12-05 2008-05-28 富士通株式会社 半導体集積回路
JP2004318235A (ja) 2003-04-11 2004-11-11 Renesas Technology Corp 基準電圧発生回路
JP3788983B2 (ja) * 2003-07-10 2006-06-21 松下電器産業株式会社 半導体集積回路装置
JP2007066463A (ja) * 2005-09-01 2007-03-15 Renesas Technology Corp 半導体装置
JP2007213706A (ja) * 2006-02-09 2007-08-23 Renesas Technology Corp 半導体装置
JP2007251351A (ja) * 2006-03-14 2007-09-27 Renesas Technology Corp 半導体装置
JP4921986B2 (ja) * 2007-01-09 2012-04-25 株式会社東芝 不揮発性半導体記憶装置

Also Published As

Publication number Publication date
US20070047365A1 (en) 2007-03-01
US20090003091A1 (en) 2009-01-01
JP2007066463A (ja) 2007-03-15
KR20070026098A (ko) 2007-03-08
CN1925058A (zh) 2007-03-07
US7430149B2 (en) 2008-09-30
CN1925058B (zh) 2011-10-19
US8014224B2 (en) 2011-09-06

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