TW200712778A - Novel positive photosensitive polybenzoxazole precursor compositions - Google Patents

Novel positive photosensitive polybenzoxazole precursor compositions

Info

Publication number
TW200712778A
TW200712778A TW095130113A TW95130113A TW200712778A TW 200712778 A TW200712778 A TW 200712778A TW 095130113 A TW095130113 A TW 095130113A TW 95130113 A TW95130113 A TW 95130113A TW 200712778 A TW200712778 A TW 200712778A
Authority
TW
Taiwan
Prior art keywords
polybenzoxazole precursor
composition
positive photosensitive
polymer
precursor compositions
Prior art date
Application number
TW095130113A
Other languages
English (en)
Other versions
TWI409590B (zh
Inventor
Ahmad A Naiini
David B Powell
Donald W Racicot
Il Ya Ruskin
William Weber
Original Assignee
Fujifilm Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Electronic Materials filed Critical Fujifilm Electronic Materials
Publication of TW200712778A publication Critical patent/TW200712778A/zh
Application granted granted Critical
Publication of TWI409590B publication Critical patent/TWI409590B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095130113A 2005-08-17 2006-08-16 新穎的正型光敏性聚苯并唑前驅組成物 TWI409590B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US70899405P 2005-08-17 2005-08-17
US81061106P 2006-06-02 2006-06-02
US11/500,251 US7803510B2 (en) 2005-08-17 2006-08-07 Positive photosensitive polybenzoxazole precursor compositions

Publications (2)

Publication Number Publication Date
TW200712778A true TW200712778A (en) 2007-04-01
TWI409590B TWI409590B (zh) 2013-09-21

Family

ID=37758287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130113A TWI409590B (zh) 2005-08-17 2006-08-16 新穎的正型光敏性聚苯并唑前驅組成物

Country Status (6)

Country Link
US (1) US7803510B2 (zh)
EP (1) EP1946185A2 (zh)
JP (1) JP5030955B2 (zh)
KR (1) KR20080036225A (zh)
TW (1) TWI409590B (zh)
WO (1) WO2007022124A2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703367B2 (en) 2008-09-29 2014-04-22 Cheil Industries Inc. Positive photosensitive resin composition
US8841064B2 (en) 2010-12-31 2014-09-23 Cheil Industries Inc. Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
US9176381B2 (en) 2009-12-29 2015-11-03 Cheil Industries Inc. Positive type photosensitive resin composition

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034604A1 (ja) * 2005-09-22 2007-03-29 Hitachi Chemical Dupont Microsystems Ltd. ネガ型感光性樹脂組成物、パターン形成方法及び電子部品
JP4625769B2 (ja) * 2006-01-24 2011-02-02 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
JP4780586B2 (ja) * 2006-05-08 2011-09-28 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
WO2007148384A1 (ja) * 2006-06-20 2007-12-27 Hitachi Chemical Dupont Microsystems Ltd. ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
US8211614B2 (en) * 2006-08-04 2012-07-03 Dongwoo Fine-Chem. Co., Ltd. Photoresist composition and patterning method thereof
JP4911454B2 (ja) * 2006-09-19 2012-04-04 富士フイルム株式会社 ポリベンゾオキサゾール前駆体、それを用いた感光性樹脂組成物及び半導体装置の製造方法
JP5205772B2 (ja) * 2007-03-01 2013-06-05 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置
JP4931644B2 (ja) * 2007-03-02 2012-05-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
WO2008111470A1 (ja) * 2007-03-12 2008-09-18 Hitachi Chemical Dupont Microsystems, Ltd. 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP5332326B2 (ja) * 2007-06-18 2013-11-06 住友ベークライト株式会社 半導体装置の製造方法
JP5120539B2 (ja) * 2007-08-31 2013-01-16 国立大学法人豊橋技術科学大学 耐熱性樹脂組成物
TW200927832A (en) * 2007-10-16 2009-07-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
KR101275474B1 (ko) * 2007-10-29 2013-06-14 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품
JP2009222733A (ja) * 2008-01-25 2009-10-01 Rohm & Haas Electronic Materials Llc ノボラック樹脂ブレンドを含むフォトレジスト
WO2009099954A1 (en) * 2008-02-04 2009-08-13 Fujifilm Electronic Materials U.S.A., Inc. Novel positive photosensitive resin compositions
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
JP2009282513A (ja) * 2008-04-23 2009-12-03 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
JP5213518B2 (ja) * 2008-05-13 2013-06-19 国立大学法人豊橋技術科学大学 耐熱性樹脂組成物
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US20100240220A1 (en) * 2009-03-20 2010-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Process for stripping photoresist and removing dielectric liner
KR101692758B1 (ko) * 2013-10-23 2017-01-04 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR101750463B1 (ko) * 2013-11-26 2017-06-23 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR101728820B1 (ko) * 2013-12-12 2017-04-20 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR101705755B1 (ko) * 2013-12-19 2017-02-10 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
JP6138067B2 (ja) * 2014-02-03 2017-05-31 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ノボラック樹脂ブレンドを含むフォトレジスト
KR102585279B1 (ko) * 2014-10-02 2023-10-05 에이치디 마이크로시스템즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴 경화막의 제조 방법, 경화물, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품
CN104356389A (zh) * 2014-11-21 2015-02-18 沈阳化工大学 聚(亚萘基)苯并二噁唑的制备方法
TWI731961B (zh) 2016-04-19 2021-07-01 德商馬克專利公司 正向感光材料及形成正向凸紋影像之方法
KR102288387B1 (ko) * 2018-09-03 2021-08-10 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자
KR20210066808A (ko) * 2018-09-28 2021-06-07 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 경화물, 및 전자 부품
US11515234B2 (en) * 2020-12-03 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor device package including promoters and method of manufacturing the same
EP4020036A1 (en) * 2020-12-23 2022-06-29 EFFECT Photonics B.V. An environmentally protected photonic integrated circuit
TWI776586B (zh) * 2021-07-09 2022-09-01 律勝科技股份有限公司 聚苯并噁唑前驅物及其應用

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931297A1 (de) * 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
DE3021748A1 (de) * 1980-06-10 1981-12-17 Siemens AG, 1000 Berlin und 8000 München Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer
DE3411659A1 (de) * 1984-03-29 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen
EP0391196A3 (de) * 1989-04-06 1991-02-27 Siemens Aktiengesellschaft Herstellung von Hydroxypolyamiden
TW397936B (en) * 1994-12-09 2000-07-11 Shinetsu Chemical Co Positive resist comosition based on a silicone polymer containing a photo acid generator
US6177225B1 (en) * 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6143467A (en) * 1998-10-01 2000-11-07 Arch Specialty Chemicals, Inc. Photosensitive polybenzoxazole precursor compositions
US6410677B1 (en) * 1999-09-28 2002-06-25 Sumitomo Bakelite Company Limited Resin composition for insulating material, and insulating material produced from said resin composition
JP4529252B2 (ja) * 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2002023350A (ja) * 2000-07-07 2002-01-23 Fuji Photo Film Co Ltd ネガ型平版印刷版原版
US6551756B1 (en) * 2000-07-24 2003-04-22 Napp Systems, Inc. Solvent-developable printing formulations with improved processing characteristics
KR20030043702A (ko) * 2001-11-26 2003-06-02 간사이 페인트 가부시키가이샤 폴리벤족사졸 전구체 및 그것을 이용하는 피복용 조성물
JP3757886B2 (ja) * 2002-01-25 2006-03-22 株式会社村田製作所 光反応性樹脂組成物、それを用いた回路基板およびセラミック多層基板の製造方法
JP4380178B2 (ja) * 2002-03-28 2009-12-09 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP2003345019A (ja) 2002-05-23 2003-12-03 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
JP4125094B2 (ja) * 2002-11-01 2008-07-23 住友ベークライト株式会社 ポジ型感光性樹脂組成物及び半導体装置
KR20060002751A (ko) * 2003-03-11 2006-01-09 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 새로운 감광성 수지 조성물들
KR20060004908A (ko) * 2003-03-11 2006-01-16 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 새로운 감광성 수지 조성물들
US7132205B2 (en) * 2003-06-05 2006-11-07 Arch Specialty Chemicals, Inc. Positive photosensitive resin compositions
WO2004111726A2 (en) * 2003-06-06 2004-12-23 Fujifilm Electronic Materials U.S.A., Inc. Novel photosensitive resin compositions
JP4244309B2 (ja) * 2003-09-12 2009-03-25 富士フイルム株式会社 平版印刷版原版
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
US7678527B2 (en) * 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
US7687208B2 (en) * 2006-08-15 2010-03-30 Asahi Kasei Emd Corporation Positive photosensitive resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703367B2 (en) 2008-09-29 2014-04-22 Cheil Industries Inc. Positive photosensitive resin composition
US9176381B2 (en) 2009-12-29 2015-11-03 Cheil Industries Inc. Positive type photosensitive resin composition
TWI514078B (zh) * 2009-12-29 2015-12-21 Cheil Ind Inc 正型光敏性樹脂組成物
US8841064B2 (en) 2010-12-31 2014-09-23 Cheil Industries Inc. Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film

Also Published As

Publication number Publication date
WO2007022124A2 (en) 2007-02-22
US7803510B2 (en) 2010-09-28
JP5030955B2 (ja) 2012-09-19
EP1946185A2 (en) 2008-07-23
WO2007022124A3 (en) 2007-11-22
TWI409590B (zh) 2013-09-21
KR20080036225A (ko) 2008-04-25
JP2009505157A (ja) 2009-02-05
US20070099111A1 (en) 2007-05-03

Similar Documents

Publication Publication Date Title
TW200712778A (en) Novel positive photosensitive polybenzoxazole precursor compositions
MY142016A (en) Antireflective compositions for photoresists
TW200608144A (en) Photoresist undercoat-forming material and patterning process
EP1729176A4 (en) POSITIVELY WORKING RADIATION-SENSITIVE RESIN COMPOSITION
WO2011008042A3 (ko) 폴리이미드 및 이를 포함하는 감광성 수지 조성물
KR102556198B1 (ko) 박리층 형성용 조성물 및 박리층
KR20090094270A (ko) 부극 기재
WO2009057638A1 (ja) ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
WO2012176472A1 (ja) 光半導体用の面封止剤、それを用いた有機ｅｌデバイスの製造方法、有機ｅｌデバイスおよび有機ｅｌディスプレイパネル
WO2005000912A3 (en) Novel positive photosensitive resin compositions
WO2006104803A3 (en) Novel photosensitive resin compositions
JP2006241270A5 (zh)
WO2007023133A3 (en) Photopolymer printing plate precursor.
TW200704660A (en) New organic bottom antireflective polymer compositions
WO2009019574A8 (en) Photoresist composition for deep uv and process thereof
TW200942566A (en) Novel positive photosensitive resin compositions
TW200834238A (en) Photosensitive resin composition for forming organic insulating film and device using the same
WO2008117619A1 (ja) 感光性絶縁樹脂組成物
MY151282A (en) Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device
TW200739265A (en) Positive photoresist composition and method of forming photoresist pattern using the same
WO2008132843A1 (ja) 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品
JP2020024374A (ja) 感光性樹脂組成物、硬化レリーフパターンの製造方法
TW200641073A (en) Polymer for forming anti-reflective coating layer
TW200604738A (en) Positive-type photosensitive resin composition, and interlayer insulator and microlens produced from the composition
TWI266143B (en) Photosensitive resin compositions and photosensitive dry film using the same