TW200604738A - Positive-type photosensitive resin composition, and interlayer insulator and microlens produced from the composition - Google Patents

Positive-type photosensitive resin composition, and interlayer insulator and microlens produced from the composition

Info

Publication number
TW200604738A
TW200604738A TW094116954A TW94116954A TW200604738A TW 200604738 A TW200604738 A TW 200604738A TW 094116954 A TW094116954 A TW 094116954A TW 94116954 A TW94116954 A TW 94116954A TW 200604738 A TW200604738 A TW 200604738A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
composition
resin composition
group
positive
Prior art date
Application number
TW094116954A
Other languages
Chinese (zh)
Other versions
TWI424270B (en
Inventor
Yosuke Iinuma
Shinsuke Tuji
Tadashi Hatanaka
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200604738A publication Critical patent/TW200604738A/en
Application granted granted Critical
Publication of TWI424270B publication Critical patent/TWI424270B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide a positive photosensitive resin composition which is free from contamination and exhibits high sensitivity without deterioration in transparency, retention of film thickness, and other characteristics; and interlayer dielectrics and micro lenses, made from the composition. A positive photosensitive resin composition characterized by comprising the following components (A) and (B) and a solvent: (A) at least one alkali-soluble resin selected from among copolymers obtained by using as the essential monomer at least one monomer selected from the group consisting of unsaturated carboxylic acids and derivatives thereof, and (B) a 1,2-quinonediazide compound represented by the general formula (1): wherein D1 to D3 are each independently hydrogen or an organic group bearing a 1,2-quinonediazide group, with the proviso that at least one of D1 to D3 is an organic group bearing an 1,2-quinone- diazide group; n is an integer of 1 to 3; and R is a monovalent organic group.
TW94116954A 2004-05-26 2005-05-24 Positive-type photosensitive resin composition, and interlayer insulator and microlens produced from the composition TWI424270B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004155586 2004-05-26
JP2005124897 2005-04-22

Publications (2)

Publication Number Publication Date
TW200604738A true TW200604738A (en) 2006-02-01
TWI424270B TWI424270B (en) 2014-01-21

Family

ID=35451029

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116954A TWI424270B (en) 2004-05-26 2005-05-24 Positive-type photosensitive resin composition, and interlayer insulator and microlens produced from the composition

Country Status (5)

Country Link
JP (1) JP4509107B2 (en)
KR (1) KR101229381B1 (en)
CN (1) CN1954264B (en)
TW (1) TWI424270B (en)
WO (1) WO2005116764A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8828651B2 (en) 2005-07-25 2014-09-09 Nissan Chemical Industries, Ltd. Positive-type photosensitive resin composition and cured film manufactured therefrom
KR101401564B1 (en) 2007-01-22 2014-06-03 닛산 가가쿠 고교 가부시키 가이샤 Positive photosensitive resin composition
CN101669069B (en) * 2007-05-17 2013-03-20 日产化学工业株式会社 Photosensitive resin and process for producing microlens
EP2302456B1 (en) * 2008-07-16 2015-09-02 Nissan Chemical Industries, Ltd. Positive resist composition;patttern forming method; microlens and planarization film therefrom; solid-state imaging device, liquid crystal display device and led display device comprising the same
US8993699B2 (en) 2009-08-24 2015-03-31 Nissan Chemical Industries, Ltd. Photosensitive resin composition for microlens
US8674043B2 (en) 2009-09-14 2014-03-18 Nissan Chemical Industries, Ltd. Photosensitive resin composition containing copolymer
JP6397697B2 (en) * 2014-08-27 2018-09-26 東京応化工業株式会社 Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film
WO2016088757A1 (en) * 2014-12-04 2016-06-09 日産化学工業株式会社 Positive-acting photosensitive resin composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209754B2 (en) * 1991-02-28 2001-09-17 ジェイエスアール株式会社 Radiation-sensitive resin composition
JP2811663B2 (en) * 1991-06-12 1998-10-15 ジェイエスアール株式会社 Radiation-sensitive resin composition
JP3271378B2 (en) * 1993-07-07 2002-04-02 ジェイエスアール株式会社 Radiation-sensitive resin composition
JPH07281428A (en) * 1994-04-07 1995-10-27 Fuji Photo Film Co Ltd Positive type photoresist composition
CN1237400C (en) * 2001-09-27 2006-01-18 Az电子材料（日本）株式会社 Photosensitive resin composition
JP2003195501A (en) * 2001-12-26 2003-07-09 Fujifilm Arch Co Ltd Positive photosensitive resin composition
JP3966282B2 (en) * 2002-04-18 2007-08-29 日産化学工業株式会社 Positive photosensitive resin composition and pattern forming method

Also Published As

Publication number Publication date
KR101229381B1 (en) 2013-02-05
JPWO2005116764A1 (en) 2008-04-03
CN1954264A (en) 2007-04-25
CN1954264B (en) 2012-03-21
KR20070022108A (en) 2007-02-23
JP4509107B2 (en) 2010-07-21
TWI424270B (en) 2014-01-21
WO2005116764A1 (en) 2005-12-08

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