TW200706106A - Electro-magnetic wave shielding adhesive sheet, process for manufacturing the same, and method for shielding electro-magnetic wave - Google Patents

Electro-magnetic wave shielding adhesive sheet, process for manufacturing the same, and method for shielding electro-magnetic wave

Info

Publication number
TW200706106A
TW200706106A TW095105378A TW95105378A TW200706106A TW 200706106 A TW200706106 A TW 200706106A TW 095105378 A TW095105378 A TW 095105378A TW 95105378 A TW95105378 A TW 95105378A TW 200706106 A TW200706106 A TW 200706106A
Authority
TW
Taiwan
Prior art keywords
electro
magnetic wave
shielding
manufacturing
adhesive sheet
Prior art date
Application number
TW095105378A
Other languages
English (en)
Other versions
TWI360386B (en
Inventor
Hidenobu Kobayashi
Yuji Nishiyama
Akifumi Kuwabara
Takahiro Matsuzawa
Mitsuo Umezawa
Original Assignee
Toyo Ink Mfg Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Mfg Co filed Critical Toyo Ink Mfg Co
Publication of TW200706106A publication Critical patent/TW200706106A/zh
Application granted granted Critical
Publication of TWI360386B publication Critical patent/TWI360386B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6541—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/006—Presence of epoxy resin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
TW095105378A 2005-02-18 2006-02-17 Electro-magnetic wave shielding adhesive sheet, pr TWI360386B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005041728 2005-02-18

Publications (2)

Publication Number Publication Date
TW200706106A true TW200706106A (en) 2007-02-01
TWI360386B TWI360386B (en) 2012-03-11

Family

ID=36916524

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105378A TWI360386B (en) 2005-02-18 2006-02-17 Electro-magnetic wave shielding adhesive sheet, pr

Country Status (5)

Country Link
JP (1) JP4114706B2 (zh)
KR (1) KR100874302B1 (zh)
CN (1) CN100584180C (zh)
TW (1) TWI360386B (zh)
WO (1) WO2006088127A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448527B (zh) * 2005-11-08 2014-08-11 Toyo Ink Mfg Co 硬化性電磁波遮蔽性黏著性薄膜，其製造方法，及其使用方法，暨電磁波遮蔽物之製造方法及電磁波遮蔽物

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JP5233392B2 (ja) * 2008-04-30 2013-07-10 東洋インキＳｃホールディングス株式会社 ポリウレタンポリウレア接着剤、それを用いた硬化性電磁波シールド性接着性フィルム及びその製造方法
CN201072451Y (zh) * 2007-02-27 2008-06-11 叶隆泰 高透明导电性位相差胶膜
JP5105933B2 (ja) * 2007-03-29 2012-12-26 ナノジョイン株式会社 電磁波抑制紙及びその製造方法
JP2009016715A (ja) * 2007-07-09 2009-01-22 Tatsuta System Electronics Kk シールド及び放熱性を有する高周波モジュール及びその製造方法
DE102007037502B4 (de) * 2007-08-08 2014-04-03 Epcos Ag Bauelement mit reduziertem Temperaturgang
WO2009090997A1 (ja) * 2008-01-15 2009-07-23 Toyo Ink Manufacturing Co., Ltd. 硬化性電磁波シールド性接着性フィルム、その製造方法、及びその使用方法、並びに電磁波遮蔽物の製造方法及び電磁波遮蔽物
KR101473045B1 (ko) * 2008-01-15 2014-12-15 토요잉크Sc홀딩스주식회사 경화성 전자파 차폐성 접착성 필름, 그의 제조방법, 그의 사용방법, 전자파 차폐물의 제조방법 및 전자파 차폐물
JP5104778B2 (ja) * 2008-04-30 2012-12-19 東洋インキＳｃホールディングス株式会社 硬化性電磁波シールド性接着性フィルムおよびその製造方法
TW201121405A (en) * 2009-09-18 2011-06-16 Toyo Ink Mfg Co Electro-magnetic wave shielding film and wiring board
JP5742112B2 (ja) * 2010-01-18 2015-07-01 東洋インキＳｃホールディングス株式会社 硬化性電磁波シールド性接着性フィルムおよびその製造方法
CN103120042B (zh) 2010-06-23 2016-03-23 印可得株式会社 电磁波屏蔽膜的制备方法及由其制备的电磁波屏蔽膜
TWI570197B (zh) * 2011-03-31 2017-02-11 Taiyo Holdings Co Ltd Conductive paste
JP5707216B2 (ja) * 2011-04-26 2015-04-22 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
JP2012015548A (ja) * 2011-10-04 2012-01-19 Tatsuta Electric Wire & Cable Co Ltd シールド及び放熱性を有する高周波モジュール及びその製造方法
JP5726048B2 (ja) * 2011-11-14 2015-05-27 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
CN102711426A (zh) * 2012-06-12 2012-10-03 昆山市飞荣达电子材料有限公司 电磁屏蔽型面膜标签
WO2014003159A1 (ja) * 2012-06-29 2014-01-03 タツタ電線株式会社 導電性接着剤組成物、導電性接着フィルム、接着方法及び回路基板
CN104487534B (zh) * 2012-07-11 2016-11-09 大自达电线股份有限公司 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板
CN102916002B (zh) * 2012-10-16 2015-05-13 刘伟德 一种具有磁屏蔽功能的半导体封装器件及其制作方法
TWI488280B (zh) * 2012-11-21 2015-06-11 Ind Tech Res Inst 電磁波屏蔽結構及其製造方法
KR101375237B1 (ko) * 2013-09-13 2014-03-18 신창핫멜트 주식회사 전자파 차폐용 얇은 금속화 필름의 제조방법 및 그에 의한 금속화 필름
JP6354526B2 (ja) * 2013-11-07 2018-07-11 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP6459019B2 (ja) * 2014-05-22 2019-01-30 ナガセケムテックス株式会社 封止用積層シートおよびその製造方法ならびに封止用積層シートを用いて封止された実装構造体およびその製造方法
JP6565373B2 (ja) * 2014-06-26 2019-08-28 東洋インキＳｃホールディングス株式会社 電極シートおよびそれを用いたセンサー
JP5931305B1 (ja) * 2014-06-30 2016-06-08 タツタ電線株式会社 導電性接着剤組成物
JP6402584B2 (ja) * 2014-10-23 2018-10-10 住友ベークライト株式会社 電磁波シールド用フィルムの製造方法
WO2016088381A1 (ja) 2014-12-05 2016-06-09 タツタ電線株式会社 電磁波シールドフィルム
JP6402612B2 (ja) * 2014-12-12 2018-10-10 住友ベークライト株式会社 電磁波シールド用フィルムの製造方法
KR102251415B1 (ko) * 2014-12-24 2021-05-12 주식회사 두산 연성 인쇄회로기판용 전자파 차폐 필름의 제조방법
KR101836566B1 (ko) * 2015-05-15 2018-03-08 현대자동차주식회사 도전성 접착제 및 이를 이용한 복합소재의 접합방법
KR101996977B1 (ko) * 2015-05-26 2019-07-05 타츠타 전선 주식회사 차폐 필름 및 차폐 프린트 배선판
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KR101832736B1 (ko) * 2016-01-04 2018-02-27 율촌화학 주식회사 전자파 차폐 필름 및 이의 제조 방법
KR102280175B1 (ko) 2016-03-23 2021-07-20 타츠타 전선 주식회사 전자파 차폐 필름
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KR20170006301A (ko) 2017-01-05 2017-01-17 주식회사 잉크테크 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름
JP2017115152A (ja) * 2017-01-18 2017-06-29 藤森工業株式会社 導電性接着剤層、及びｆｐｃ用電磁波シールド材
CN107272261A (zh) * 2017-07-28 2017-10-20 张家港康得新光电材料有限公司 一种扩散膜及其制备方法
TWI713845B (zh) * 2017-08-07 2020-12-21 日商拓自達電線股份有限公司 導電性接著劑
CN108342055B (zh) * 2018-02-09 2020-05-01 宁波安工电子有限公司 一种快速固化emi导热导电材料及其制备方法
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