TW200640978A - Latent hardener for epoxy resin and epoxy resin composition - Google Patents

Latent hardener for epoxy resin and epoxy resin composition

Info

Publication number
TW200640978A
TW200640978A TW095106137A TW95106137A TW200640978A TW 200640978 A TW200640978 A TW 200640978A TW 095106137 A TW095106137 A TW 095106137A TW 95106137 A TW95106137 A TW 95106137A TW 200640978 A TW200640978 A TW 200640978A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
latent hardener
resin composition
hardener
mass
Prior art date
Application number
TW095106137A
Other languages
English (en)
Other versions
TWI318632B (zh
Inventor
Hisanao Yamamoto
Kazuhiro Daikai
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200640978A publication Critical patent/TW200640978A/zh
Application granted granted Critical
Publication of TWI318632B publication Critical patent/TWI318632B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
    • C08G18/643—Reaction products of epoxy resins with at least equivalent amounts of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/771—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/7806—Nitrogen containing -N-C=0 groups
    • C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
    • C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
TW095106137A 2005-02-23 2006-02-23 Latent hardener for epoxy resin and epoxy resin composition TW200640978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046615 2005-02-23

Publications (2)

Publication Number Publication Date
TW200640978A true TW200640978A (en) 2006-12-01
TWI318632B TWI318632B (zh) 2009-12-21

Family

ID=36927432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106137A TW200640978A (en) 2005-02-23 2006-02-23 Latent hardener for epoxy resin and epoxy resin composition

Country Status (9)

Country Link
US (1) US20080251757A1 (zh)
EP (1) EP1852452A1 (zh)
JP (1) JP4753934B2 (zh)
KR (1) KR100938523B1 (zh)
CN (1) CN101128502B (zh)
CA (1) CA2601950C (zh)
HK (1) HK1118303A1 (zh)
TW (1) TW200640978A (zh)
WO (1) WO2006090794A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391953B (zh) * 2007-11-08 2013-04-01 Cheil Ind Inc 各向異性導電膜組成物、包含該組成物之各向異性導電 膜以及相關的方法
TWI425023B (zh) * 2009-06-12 2014-02-01 Trillion Science Inc 環氧樹脂組成物的潛伏性硬化劑
TWI449720B (zh) * 2008-02-28 2014-08-21 Sekisui Chemical Co Ltd A hardened epoxy composition, an anisotropic conductive material, and a continuous structure

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CA2625794A1 (en) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
WO2008090719A1 (ja) * 2007-01-24 2008-07-31 Sony Chemical & Information Device Corporation 潜在性硬化剤
EP2242629A1 (en) * 2008-02-11 2010-10-27 MEMC Electronic Materials, Inc. Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
JP2009269976A (ja) * 2008-05-02 2009-11-19 Taiyo Ink Mfg Ltd 導電性樹脂組成物
TWI449723B (zh) * 2009-02-27 2014-08-21 Asahi Kasei E Materials Corp A hardening agent for a microcapsule type epoxy resin, a hardener composition for a masterbatch type epoxy resin, a single-liquid epoxy resin composition, and a processed product
US8067484B2 (en) * 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
WO2010144236A1 (en) * 2009-06-12 2010-12-16 Trillion Science, Inc. Latent hardener for epoxy compositions
JP5509709B2 (ja) * 2009-07-24 2014-06-04 日清紡ケミカル株式会社 燃料電池セパレータ
JP2011032387A (ja) * 2009-08-03 2011-02-17 Toppan Forms Co Ltd 硬化性組成物
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
US8698320B2 (en) 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
CN106085168B (zh) 2010-04-16 2018-10-16 Swimc有限公司 用于包装制品的涂料组合物以及涂布方法
KR101161360B1 (ko) * 2010-07-13 2012-06-29 엘에스전선 주식회사 공간전하 저감 효과를 갖는 직류용 전력 케이블
KR102135072B1 (ko) 2011-02-07 2020-07-20 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품을 위한 코팅 조성물 및 코팅 방법
US8974899B1 (en) * 2011-05-24 2015-03-10 The United States Of America As Represented By The Secretary Of The Air Force Pseudomorphic glass for space solar cells
JP2013001875A (ja) * 2011-06-20 2013-01-07 Asahi Kasei E-Materials Corp マスターバッチ型硬化剤組成物、それを用いる一液性エポキシ樹脂組成物及び成形品、並びにマスターバッチ型硬化剤組成物の製造方法
JP5869911B2 (ja) * 2012-02-23 2016-02-24 株式会社タムラ製作所 熱硬化性樹脂組成物
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
CN104540907B (zh) 2012-08-09 2018-04-10 Swimc有限公司 用于容器和其它物品的组合物以及使用相同组合物的方法
MX2015001729A (es) 2012-08-09 2015-08-14 Valspar Sourcing Inc Sistema de revestimiento de envases.
US9957412B2 (en) * 2013-05-16 2018-05-01 Lord Corporation Aqueous conductive coating
MX2016012828A (es) 2014-04-14 2017-01-05 Valspar Sourcing Inc Metodos para preparar composiciones para contenedores y otros articulos y metodos para usarlas.
KR101706818B1 (ko) * 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
CN104403501B (zh) * 2014-11-26 2017-11-07 王忠强 一种电网运行管理中红外监测用涂覆材料及其制备方法
KR101741652B1 (ko) * 2015-05-08 2017-06-01 주식회사 케이씨씨 분체 도료용 잠재성 경화제 및 이를 포함하는 에폭시 분체 도료 조성물
WO2017057019A1 (ja) * 2015-09-30 2017-04-06 ナミックス株式会社 エポキシ樹脂組成物
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
EP3170847A1 (en) 2015-11-20 2017-05-24 OMG Borchers GmbH Encapsulated accelerators for coatings
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN105646843B (zh) * 2016-04-05 2018-08-10 广州市固研电子材料有限公司 改性脂环胺型环氧树脂潜伏性固化剂和促进剂及其制备方法
KR101991797B1 (ko) 2016-10-17 2019-06-25 한국생산기술연구원 폴리티올 공중합체 경화제 및 코어쉘 잠재성 경화 촉매를 포함하는 일액형 에폭시 접착제 조성물
KR102228758B1 (ko) * 2017-03-17 2021-03-18 아사히 가세이 가부시키가이샤 열경화성 수지 조성물
CN109321183A (zh) * 2018-09-19 2019-02-12 长春永固科技有限公司 一种高导热环氧树脂电子粘接剂及其制备方法
KR102155323B1 (ko) 2018-11-23 2020-09-11 한국과학기술연구원 잠재성 경화제 복합체, 이를 포함하는 일액형 에폭시 수지 및 이의 제조방법
CN114222770B (zh) 2019-07-12 2024-04-05 株式会社三养社 脱水糖醇-亚烷基二醇组合物、基于脱水糖醇的氨基甲酸酯改性多元醇组合物及它们的用途
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JP2022073653A (ja) * 2020-11-02 2022-05-17 日本ペイント・オートモーティブコーティングス株式会社 カチオン電着塗料組成物
KR102434730B1 (ko) * 2020-11-20 2022-08-23 한국생산기술연구원 저흡습성 에폭시 조성물
CN115232585B (zh) * 2022-06-24 2023-11-24 同济大学 一种耐湿热水解的单组分环氧树脂组合物及其制备方法和应用
CN115637021A (zh) * 2022-10-17 2023-01-24 华中科技大学 一种改性二氧化硅协同分散的环氧树脂复合材料及其制备与应用

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391953B (zh) * 2007-11-08 2013-04-01 Cheil Ind Inc 各向異性導電膜組成物、包含該組成物之各向異性導電 膜以及相關的方法
TWI449720B (zh) * 2008-02-28 2014-08-21 Sekisui Chemical Co Ltd A hardened epoxy composition, an anisotropic conductive material, and a continuous structure
TWI425023B (zh) * 2009-06-12 2014-02-01 Trillion Science Inc 環氧樹脂組成物的潛伏性硬化劑

Also Published As

Publication number Publication date
JPWO2006090794A1 (ja) 2008-07-24
EP1852452A1 (en) 2007-11-07
WO2006090794A1 (ja) 2006-08-31
US20080251757A1 (en) 2008-10-16
KR100938523B1 (ko) 2010-01-25
CA2601950A1 (en) 2006-08-31
KR20070104621A (ko) 2007-10-26
CA2601950C (en) 2010-07-13
HK1118303A1 (en) 2009-02-06
JP4753934B2 (ja) 2011-08-24
CN101128502A (zh) 2008-02-20
CN101128502B (zh) 2010-12-01
TWI318632B (zh) 2009-12-21

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