TWI318632B - - Google Patents

Info

Publication number
TWI318632B
TWI318632B TW095106137A TW95106137A TWI318632B TW I318632 B TWI318632 B TW I318632B TW 095106137 A TW095106137 A TW 095106137A TW 95106137 A TW95106137 A TW 95106137A TW I318632 B TWI318632 B TW I318632B
Authority
TW
Taiwan
Application number
TW095106137A
Other versions
TW200640978A (en
Inventor
Hisanao Yamamoto
Kazuhiro Daikai
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200640978A publication Critical patent/TW200640978A/zh
Application granted granted Critical
Publication of TWI318632B publication Critical patent/TWI318632B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
    • C08G18/643—Reaction products of epoxy resins with at least equivalent amounts of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/771—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/7806—Nitrogen containing -N-C=0 groups
    • C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
    • C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
TW095106137A 2005-02-23 2006-02-23 Latent hardener for epoxy resin and epoxy resin composition TW200640978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046615 2005-02-23

Publications (2)

Publication Number Publication Date
TW200640978A TW200640978A (en) 2006-12-01
TWI318632B true TWI318632B (zh) 2009-12-21

Family

ID=36927432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106137A TW200640978A (en) 2005-02-23 2006-02-23 Latent hardener for epoxy resin and epoxy resin composition

Country Status (9)

Country Link
US (1) US20080251757A1 (zh)
EP (1) EP1852452A1 (zh)
JP (1) JP4753934B2 (zh)
KR (1) KR100938523B1 (zh)
CN (1) CN101128502B (zh)
CA (1) CA2601950C (zh)
HK (1) HK1118303A1 (zh)
TW (1) TW200640978A (zh)
WO (1) WO2006090794A1 (zh)

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WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
US7927514B2 (en) 2006-02-03 2011-04-19 Asahi Kasei Chemicals Corporation Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good
US8147720B2 (en) 2007-01-24 2012-04-03 Sony Corporation Latent curing agent
KR100920612B1 (ko) * 2007-11-08 2009-10-08 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름
JP2011512036A (ja) * 2008-02-11 2011-04-14 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド インゴットをワイヤーソーによりスライスしてウェハとする際に使用される、カーボンナノチューブで強化されたワイヤーソー梁部
CN101959922B (zh) * 2008-02-28 2013-08-07 积水化学工业株式会社 固化性环氧组合物、各向异性导电材料以及连接结构体
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
JP2009269976A (ja) * 2008-05-02 2009-11-19 Taiyo Ink Mfg Ltd 導電性樹脂組成物
WO2010098431A1 (ja) * 2009-02-27 2010-09-02 旭化成イーマテリアルズ株式会社 マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
KR101385077B1 (ko) * 2009-06-12 2014-04-24 트릴리온 사이언스 인코포레이티드 에폭시 조성물용 잠재성 하드너
WO2010144236A1 (en) * 2009-06-12 2010-12-16 Trillion Science, Inc. Latent hardener for epoxy compositions
US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
JP5509709B2 (ja) * 2009-07-24 2014-06-04 日清紡ケミカル株式会社 燃料電池セパレータ
JP2011032387A (ja) * 2009-08-03 2011-02-17 Toppan Forms Co Ltd 硬化性組成物
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
US8698320B2 (en) 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
CN102858893B (zh) 2010-04-16 2016-08-03 威士伯采购公司 用于包装制品的涂料组合物以及涂布方法
KR101161360B1 (ko) * 2010-07-13 2012-06-29 엘에스전선 주식회사 공간전하 저감 효과를 갖는 직류용 전력 케이블
ES2852198T3 (es) 2011-02-07 2021-09-13 Swimc Llc Composiciones de recubrimiento para recipientes y otros artículos, y métodos de recubrimiento
US8974899B1 (en) * 2011-05-24 2015-03-10 The United States Of America As Represented By The Secretary Of The Air Force Pseudomorphic glass for space solar cells
JP2013001875A (ja) * 2011-06-20 2013-01-07 Asahi Kasei E-Materials Corp マスターバッチ型硬化剤組成物、それを用いる一液性エポキシ樹脂組成物及び成形品、並びにマスターバッチ型硬化剤組成物の製造方法
JP5869911B2 (ja) * 2012-02-23 2016-02-24 株式会社タムラ製作所 熱硬化性樹脂組成物
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
KR102093405B1 (ko) 2012-08-09 2020-03-25 에스더블유아이엠씨 엘엘씨 용기 코팅 시스템
CN104540907B (zh) 2012-08-09 2018-04-10 Swimc有限公司 用于容器和其它物品的组合物以及使用相同组合物的方法
US9957412B2 (en) * 2013-05-16 2018-05-01 Lord Corporation Aqueous conductive coating
CN110790914A (zh) 2014-04-14 2020-02-14 宣伟投资管理有限公司 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法
KR101706818B1 (ko) * 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
CN104403501B (zh) * 2014-11-26 2017-11-07 王忠强 一种电网运行管理中红外监测用涂覆材料及其制备方法
KR101741652B1 (ko) * 2015-05-08 2017-06-01 주식회사 케이씨씨 분체 도료용 잠재성 경화제 및 이를 포함하는 에폭시 분체 도료 조성물
KR102555587B1 (ko) * 2015-09-30 2023-07-13 나믹스 가부시끼가이샤 에폭시 수지 조성물
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
EP3170847A1 (en) 2015-11-20 2017-05-24 OMG Borchers GmbH Encapsulated accelerators for coatings
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN105646843B (zh) * 2016-04-05 2018-08-10 广州市固研电子材料有限公司 改性脂环胺型环氧树脂潜伏性固化剂和促进剂及其制备方法
KR101991797B1 (ko) 2016-10-17 2019-06-25 한국생산기술연구원 폴리티올 공중합체 경화제 및 코어쉘 잠재성 경화 촉매를 포함하는 일액형 에폭시 접착제 조성물
KR102228758B1 (ko) * 2017-03-17 2021-03-18 아사히 가세이 가부시키가이샤 열경화성 수지 조성물
CN109321183A (zh) * 2018-09-19 2019-02-12 长春永固科技有限公司 一种高导热环氧树脂电子粘接剂及其制备方法
KR102155323B1 (ko) 2018-11-23 2020-09-11 한국과학기술연구원 잠재성 경화제 복합체, 이를 포함하는 일액형 에폭시 수지 및 이의 제조방법
US20220275197A1 (en) 2019-07-12 2022-09-01 Samyang Corporation Anhydrous alcohol-alkylene glycol composition, anhydrous alcohol-based urethane-modified polyol composition, and uses of same for expoxy resin composition
KR102306945B1 (ko) 2019-08-14 2021-10-01 한국과학기술연구원 건식표면중합 공정을 이용한 잠재성 경화제 복합체, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법
KR102236549B1 (ko) 2019-11-26 2021-04-07 한국과학기술연구원 건식 표면 처리 공정을 통해 보존 안정성이 향상된 잠재성 경화제, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법
JP2022073653A (ja) * 2020-11-02 2022-05-17 日本ペイント・オートモーティブコーティングス株式会社 カチオン電着塗料組成物
KR102434730B1 (ko) * 2020-11-20 2022-08-23 한국생산기술연구원 저흡습성 에폭시 조성물
CN115232585B (zh) * 2022-06-24 2023-11-24 同济大学 一种耐湿热水解的单组分环氧树脂组合物及其制备方法和应用
CN115637021A (zh) * 2022-10-17 2023-01-24 华中科技大学 一种改性二氧化硅协同分散的环氧树脂复合材料及其制备与应用

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Also Published As

Publication number Publication date
HK1118303A1 (en) 2009-02-06
CN101128502B (zh) 2010-12-01
JPWO2006090794A1 (ja) 2008-07-24
KR20070104621A (ko) 2007-10-26
CA2601950A1 (en) 2006-08-31
JP4753934B2 (ja) 2011-08-24
TW200640978A (en) 2006-12-01
WO2006090794A1 (ja) 2006-08-31
CN101128502A (zh) 2008-02-20
US20080251757A1 (en) 2008-10-16
KR100938523B1 (ko) 2010-01-25
CA2601950C (en) 2010-07-13
EP1852452A1 (en) 2007-11-07

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