TW200627480A - Electroconductive microparticle and anisotropic electroconductive material - Google Patents

Electroconductive microparticle and anisotropic electroconductive material

Info

Publication number
TW200627480A
TW200627480A TW094128413A TW94128413A TW200627480A TW 200627480 A TW200627480 A TW 200627480A TW 094128413 A TW094128413 A TW 094128413A TW 94128413 A TW94128413 A TW 94128413A TW 200627480 A TW200627480 A TW 200627480A
Authority
TW
Taiwan
Prior art keywords
electroconductive
microparticle
anisotropic
insulation
microparticles
Prior art date
Application number
TW094128413A
Other languages
English (en)
Chinese (zh)
Other versions
TWI326086B (cg-RX-API-DMAC7.html
Inventor
Hiroya Ishida
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200627480A publication Critical patent/TW200627480A/zh
Application granted granted Critical
Publication of TWI326086B publication Critical patent/TWI326086B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
TW094128413A 2004-08-20 2005-08-19 Electroconductive microparticle and anisotropic electroconductive material TW200627480A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004241572A JP4563110B2 (ja) 2004-08-20 2004-08-20 導電性微粒子の製造方法

Publications (2)

Publication Number Publication Date
TW200627480A true TW200627480A (en) 2006-08-01
TWI326086B TWI326086B (cg-RX-API-DMAC7.html) 2010-06-11

Family

ID=35907537

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128413A TW200627480A (en) 2004-08-20 2005-08-19 Electroconductive microparticle and anisotropic electroconductive material

Country Status (6)

Country Link
US (1) US7470416B2 (cg-RX-API-DMAC7.html)
JP (1) JP4563110B2 (cg-RX-API-DMAC7.html)
KR (1) KR20070039954A (cg-RX-API-DMAC7.html)
CN (1) CN101006525B (cg-RX-API-DMAC7.html)
TW (1) TW200627480A (cg-RX-API-DMAC7.html)
WO (1) WO2006019154A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556260B (zh) * 2010-09-30 2016-11-01 積水化學工業股份有限公司 Conductive particles, anisotropic conductive materials and connecting structures
TWI841692B (zh) * 2019-02-28 2024-05-11 日商積水化學工業股份有限公司 導電材料及連接構造體

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
WO2005099941A1 (ja) * 2004-04-16 2005-10-27 National Institute For Materials Science 金属微粒子コロイド溶液、導電ペースト材料、導電性インク材料とそれらの製造方法
JP4877230B2 (ja) * 2005-11-18 2012-02-15 日立化成工業株式会社 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
JP5091416B2 (ja) * 2006-03-17 2012-12-05 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び、異方性導電材料
US20100065311A1 (en) * 2006-07-03 2010-03-18 Hitachi Chemical Company, Ltd. Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
JP5019443B2 (ja) 2007-06-12 2012-09-05 オリンパスメディカルシステムズ株式会社 着脱機構
JP5644067B2 (ja) * 2008-07-23 2014-12-24 日立化成株式会社 絶縁被覆導電粒子
JP5444699B2 (ja) * 2008-11-28 2014-03-19 富士通株式会社 異方性導電性接着剤のための導電性粒子、異方性導電性接着剤、異方性導電性接着剤のための導電性粒子の製造方法、半導体装置
DE102009013826A1 (de) * 2009-03-18 2011-03-10 Michalk, Manfred, Dr. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
JP2010247079A (ja) * 2009-04-16 2010-11-04 Denso Corp 排ガス浄化触媒の製造方法
CN102474024B (zh) * 2009-07-02 2014-09-17 日立化成株式会社 导电粒子
JP5358328B2 (ja) * 2009-07-16 2013-12-04 デクセリアルズ株式会社 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法
JP2011040189A (ja) * 2009-08-07 2011-02-24 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP4993230B2 (ja) * 2009-09-08 2012-08-08 積水化学工業株式会社 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP5554077B2 (ja) * 2009-09-15 2014-07-23 株式会社日本触媒 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
CN102714071A (zh) * 2009-11-20 2012-10-03 3M创新有限公司 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
WO2011111152A1 (ja) * 2010-03-08 2011-09-15 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5534891B2 (ja) * 2010-03-26 2014-07-02 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP5576231B2 (ja) * 2010-09-30 2014-08-20 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5184612B2 (ja) * 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
JP5703149B2 (ja) * 2011-07-06 2015-04-15 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
WO2013094636A1 (ja) * 2011-12-21 2013-06-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6333552B2 (ja) * 2012-01-19 2018-05-30 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
WO2014054572A1 (ja) * 2012-10-02 2014-04-10 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR101410992B1 (ko) * 2012-12-20 2014-07-01 덕산하이메탈(주) 도전입자, 그 제조방법 및 이를 포함하는 도전성 재료
WO2014171946A1 (en) * 2013-04-18 2014-10-23 Empire Technology Development, Llc Methods and systems for labeling and detecting defects in a graphene layer
TW201511296A (zh) 2013-06-20 2015-03-16 Plant PV 用於矽太陽能電池之核-殼型鎳粒子金屬化層
JP6581331B2 (ja) * 2013-07-29 2019-09-25 デクセリアルズ株式会社 導電性接着フィルムの製造方法、接続体の製造方法
US9331216B2 (en) 2013-09-23 2016-05-03 PLANT PV, Inc. Core-shell nickel alloy composite particle metallization layers for silicon solar cells
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6445833B2 (ja) * 2013-10-21 2018-12-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015110743A (ja) * 2013-10-28 2015-06-18 積水化学工業株式会社 有機無機ハイブリッド粒子の製造方法、導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) * 2014-03-10 2019-09-18 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6431411B2 (ja) * 2014-03-10 2018-11-28 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
WO2017035103A1 (en) 2015-08-25 2017-03-02 Plant Pv, Inc Core-shell, oxidation-resistant particles for low temperature conductive applications
WO2017035102A1 (en) 2015-08-26 2017-03-02 Plant Pv, Inc Silver-bismuth non-contact metallization pastes for silicon solar cells
US10000645B2 (en) 2015-11-24 2018-06-19 PLANT PV, Inc. Methods of forming solar cells with fired multilayer film stacks
WO2017138485A1 (ja) * 2016-02-10 2017-08-17 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
KR102649185B1 (ko) * 2016-02-10 2024-03-18 가부시끼가이샤 레조낙 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체
JP7341886B2 (ja) * 2017-03-29 2023-09-11 株式会社レゾナック 導電粒子の選別方法、回路接続材料、接続構造体及びその製造方法
CN107767993B (zh) * 2017-11-15 2024-07-16 深圳先进技术研究院 具有导电功能的薄膜及其制备方法
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JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
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CN1205295C (zh) * 2002-07-24 2005-06-08 财团法人工业技术研究院 适用于制备各向异性导电胶组合物的微导电粉体
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556260B (zh) * 2010-09-30 2016-11-01 積水化學工業股份有限公司 Conductive particles, anisotropic conductive materials and connecting structures
TWI841692B (zh) * 2019-02-28 2024-05-11 日商積水化學工業股份有限公司 導電材料及連接構造體

Also Published As

Publication number Publication date
JP2006059721A (ja) 2006-03-02
CN101006525A (zh) 2007-07-25
CN101006525B (zh) 2011-12-21
TWI326086B (cg-RX-API-DMAC7.html) 2010-06-11
US7470416B2 (en) 2008-12-30
JP4563110B2 (ja) 2010-10-13
US20070281161A1 (en) 2007-12-06
KR20070039954A (ko) 2007-04-13
WO2006019154A1 (ja) 2006-02-23

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