TW200617100A - Epoxy resin composition for copper clad laminate - Google Patents

Epoxy resin composition for copper clad laminate

Info

Publication number
TW200617100A
TW200617100A TW094115314A TW94115314A TW200617100A TW 200617100 A TW200617100 A TW 200617100A TW 094115314 A TW094115314 A TW 094115314A TW 94115314 A TW94115314 A TW 94115314A TW 200617100 A TW200617100 A TW 200617100A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
copper clad
resin composition
composition
clad laminate
Prior art date
Application number
TW094115314A
Other languages
English (en)
Chinese (zh)
Inventor
Sung-Woo Kim
Hyeon-Woo Ahn
Hyun-Sung Min
Yong-Seok Lee
Eun-Hae Koo
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200617100A publication Critical patent/TW200617100A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW094115314A 2004-05-11 2005-05-11 Epoxy resin composition for copper clad laminate TW200617100A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040032927A KR100601091B1 (ko) 2004-05-11 2004-05-11 동박적층판용 에폭시 수지 조성물

Publications (1)

Publication Number Publication Date
TW200617100A true TW200617100A (en) 2006-06-01

Family

ID=35320209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115314A TW200617100A (en) 2004-05-11 2005-05-11 Epoxy resin composition for copper clad laminate

Country Status (4)

Country Link
JP (1) JP4477627B2 (ja)
KR (1) KR100601091B1 (ja)
TW (1) TW200617100A (ja)
WO (1) WO2005108488A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449681B (zh) * 2010-09-06 2014-08-21 Taiwan Union Technology Corp 環氧樹脂掺合物

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0512610D0 (en) 2005-06-18 2005-07-27 Hexcel Composites Ltd Composite material
KR20080077639A (ko) * 2005-12-22 2008-08-25 다우 글로벌 테크놀로지스 인크. 경화성 에폭시 수지 조성물 및 이로부터 제조한 적층물
KR100730982B1 (ko) * 2006-03-16 2007-06-22 도레이새한 주식회사 동박적층판용 나노복합체 접착제 조성물
KR20090080956A (ko) * 2006-10-06 2009-07-27 헨켈 아게 운트 코. 카게아아 발수성의 펌핑가능한 에폭시 페이스트 접착제
KR100845092B1 (ko) * 2006-12-01 2008-07-09 주식회사 엘지화학 접착수지 조성물, 접착필름, 다이싱 다이본딩 필름 및반도체 장치
KR100836175B1 (ko) * 2006-12-13 2008-06-09 도레이새한 주식회사 동박적층판용 비할로겐계 나노복합체 접착제 조성물
KR100823998B1 (ko) * 2007-05-28 2008-04-23 전자부품연구원 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법
ES2320305B1 (es) * 2007-06-05 2010-03-08 Antonio Miravete De Marco Metodo de pre-impregnado de nano-refuerzos y producto asi obtenido.
KR100918914B1 (ko) * 2007-10-04 2009-09-23 도레이새한 주식회사 비할로겐계 커버레이필름용 나노복합체 접착제 조성물
KR100979541B1 (ko) * 2008-07-16 2010-09-02 삼성전기주식회사 프리프레그, 프리프레그 제조방법 및 이를 이용한동박적층판
KR100995678B1 (ko) * 2008-09-01 2010-11-22 주식회사 코오롱 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물
KR101114318B1 (ko) * 2009-04-16 2012-03-14 삼성전기주식회사 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법
CN101864146B (zh) * 2010-06-13 2012-02-15 宏昌电子材料股份有限公司 印刷电路覆铜板用环氧树脂组合物
KR20160081073A (ko) 2014-12-30 2016-07-08 도레이첨단소재 주식회사 비할로겐계 접착제 조성물을 이용한 동박 부착 접착시트 및 그 제조방법
KR20190097622A (ko) 2018-02-12 2019-08-21 옥광호 친환경 층간소음 방지구조
CN109677058B (zh) * 2018-12-24 2021-02-26 龙宇电子(梅州)有限公司 一种无铅tg140覆铜板的制作方法
KR102152327B1 (ko) 2020-02-21 2020-09-07 옥광호 친환경 바닥재를 이용한 층간소음 방지구조

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63162775A (ja) * 1986-12-26 1988-07-06 Somar Corp 無電解メツキ用レジストインキ
CA1338252C (en) * 1989-07-05 1996-04-16 Osamu Ogitani Resist ink composition
KR970010865A (ko) * 1995-08-29 1997-03-27 이웅열 다층회로기판용 동박적층판용 수지 조성물
JP2001139659A (ja) 1999-11-15 2001-05-22 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
KR100447547B1 (ko) 2001-12-28 2004-09-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100491754B1 (ko) 2002-09-11 2005-05-27 주식회사 엘지화학 빌드업 인쇄 회로 기판 기재용 동박 부착 수지 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449681B (zh) * 2010-09-06 2014-08-21 Taiwan Union Technology Corp 環氧樹脂掺合物

Also Published As

Publication number Publication date
JP2006526683A (ja) 2006-11-24
JP4477627B2 (ja) 2010-06-09
WO2005108488A1 (en) 2005-11-17
KR20050107999A (ko) 2005-11-16
KR100601091B1 (ko) 2006-07-14

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