TW200538569A - Sputtering method and sputtering system - Google Patents
Sputtering method and sputtering system Download PDFInfo
- Publication number
- TW200538569A TW200538569A TW094108481A TW94108481A TW200538569A TW 200538569 A TW200538569 A TW 200538569A TW 094108481 A TW094108481 A TW 094108481A TW 94108481 A TW94108481 A TW 94108481A TW 200538569 A TW200538569 A TW 200538569A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- magnetic flux
- sputtering
- processing substrate
- magnet
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 113
- 230000004907 flux Effects 0.000 claims abstract description 53
- 238000012545 processing Methods 0.000 claims description 72
- 230000015572 biosynthetic process Effects 0.000 claims description 23
- 238000012546 transfer Methods 0.000 claims description 19
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 230000003628 erosive effect Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000013077 target material Substances 0.000 claims description 9
- 238000012937 correction Methods 0.000 claims description 7
- 230000005684 electric field Effects 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 abstract description 16
- 238000001755 magnetron sputter deposition Methods 0.000 abstract description 7
- 238000011282 treatment Methods 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 3
- 239000010408 film Substances 0.000 description 55
- 239000007789 gas Substances 0.000 description 27
- 239000011521 glass Substances 0.000 description 19
- 230000002093 peripheral effect Effects 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000010409 thin film Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000010891 electric arc Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 101100518501 Mus musculus Spp1 gene Proteins 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/70—Door leaves
- E06B3/72—Door leaves consisting of frame and panels, e.g. of raised panel type
- E06B3/76—Door leaves consisting of frame and panels, e.g. of raised panel type with metal panels
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
- E05Y2900/00—Application of doors, windows, wings or fittings thereof
- E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
- E05Y2900/13—Type of wing
- E05Y2900/132—Doors
- E05Y2900/134—Fire doors
Landscapes
- Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004079750 | 2004-03-19 | ||
| JP2005043618A JP4580781B2 (ja) | 2004-03-19 | 2005-02-21 | スパッタリング方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200538569A true TW200538569A (en) | 2005-12-01 |
| TWI377263B TWI377263B (ko) | 2012-11-21 |
Family
ID=35041676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094108481A TW200538569A (en) | 2004-03-19 | 2005-03-18 | Sputtering method and sputtering system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4580781B2 (ko) |
| KR (1) | KR101135389B1 (ko) |
| CN (1) | CN100535178C (ko) |
| TW (1) | TW200538569A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10106883B2 (en) | 2011-11-04 | 2018-10-23 | Intevac, Inc. | Sputtering system and method using direction-dependent scan speed or power |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8500975B2 (en) | 2004-01-07 | 2013-08-06 | Applied Materials, Inc. | Method and apparatus for sputtering onto large flat panels |
| JP4781964B2 (ja) * | 2006-10-27 | 2011-09-28 | 信越化学工業株式会社 | マグネトロンスパッタ装置 |
| JP4707693B2 (ja) * | 2007-05-01 | 2011-06-22 | 株式会社アルバック | スパッタリング装置及びスパッタリング方法 |
| JP5291907B2 (ja) * | 2007-08-31 | 2013-09-18 | 株式会社アルバック | スパッタリング装置 |
| CN101970713B (zh) * | 2008-03-04 | 2012-08-29 | 国立大学法人东北大学 | 旋转磁铁溅射装置 |
| WO2010044269A1 (ja) | 2008-10-17 | 2010-04-22 | 株式会社アルバック | 太陽電池の製造方法 |
| CN102191470A (zh) * | 2010-03-09 | 2011-09-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种磁控溅射源及等离子体处理设备 |
| CN102071403B (zh) * | 2011-01-30 | 2012-09-05 | 东莞市汇成真空科技有限公司 | 一种平面磁控溅射靶 |
| KR20140071058A (ko) * | 2012-12-03 | 2014-06-11 | 코닝정밀소재 주식회사 | 롤투롤 스퍼터링 장치 |
| CN110177898B (zh) * | 2017-11-01 | 2021-01-01 | 株式会社爱发科 | 溅射装置及成膜方法 |
| KR102376098B1 (ko) * | 2018-03-16 | 2022-03-18 | 가부시키가이샤 알박 | 성막 방법 |
| CN115058695B (zh) * | 2022-08-11 | 2022-11-04 | 广州粤芯半导体技术有限公司 | 溅射方法及半导体器件的制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0421775A (ja) * | 1990-05-14 | 1992-01-24 | Fujitsu Ltd | スパッタリング装置のカソード |
| JP3514488B2 (ja) * | 1993-06-30 | 2004-03-31 | 株式会社アルバック | マグネトロンスパッタ方法及び装置 |
| CN1157335A (zh) * | 1996-02-13 | 1997-08-20 | 王福贞 | 新型永磁控平面阴极电弧源 |
| JP3344318B2 (ja) * | 1998-05-27 | 2002-11-11 | 日本電気株式会社 | スパッタ装置 |
| JP2003239069A (ja) * | 2002-02-15 | 2003-08-27 | Ulvac Japan Ltd | 薄膜の製造方法及び装置 |
| JP4246547B2 (ja) * | 2003-05-23 | 2009-04-02 | 株式会社アルバック | スパッタリング装置、及びスパッタリング方法 |
-
2005
- 2005-02-21 JP JP2005043618A patent/JP4580781B2/ja active Active
- 2005-03-18 TW TW094108481A patent/TW200538569A/zh unknown
- 2005-03-18 CN CNB2005100563642A patent/CN100535178C/zh active Active
- 2005-03-18 KR KR1020050022494A patent/KR101135389B1/ko active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10106883B2 (en) | 2011-11-04 | 2018-10-23 | Intevac, Inc. | Sputtering system and method using direction-dependent scan speed or power |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1670243A (zh) | 2005-09-21 |
| JP2005298966A (ja) | 2005-10-27 |
| CN100535178C (zh) | 2009-09-02 |
| KR101135389B1 (ko) | 2012-04-17 |
| JP4580781B2 (ja) | 2010-11-17 |
| TWI377263B (ko) | 2012-11-21 |
| KR20060044372A (ko) | 2006-05-16 |
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