JP4580781B2 - スパッタリング方法及びその装置 - Google Patents

スパッタリング方法及びその装置 Download PDF

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Publication number
JP4580781B2
JP4580781B2 JP2005043618A JP2005043618A JP4580781B2 JP 4580781 B2 JP4580781 B2 JP 4580781B2 JP 2005043618 A JP2005043618 A JP 2005043618A JP 2005043618 A JP2005043618 A JP 2005043618A JP 4580781 B2 JP4580781 B2 JP 4580781B2
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JP
Japan
Prior art keywords
target
processing substrate
magnetic flux
sputtering
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005043618A
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English (en)
Japanese (ja)
Other versions
JP2005298966A (ja
Inventor
新井　　真
暁 石橋
孝 小松
典明 谷
淳也 清田
淳 太田
久三 中村
肇 中村
信一郎 田口
祐一 大石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2005043618A priority Critical patent/JP4580781B2/ja
Priority to CNB2005100563642A priority patent/CN100535178C/zh
Priority to KR1020050022494A priority patent/KR101135389B1/ko
Priority to TW094108481A priority patent/TW200538569A/zh
Publication of JP2005298966A publication Critical patent/JP2005298966A/ja
Application granted granted Critical
Publication of JP4580781B2 publication Critical patent/JP4580781B2/ja
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    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/70—Door leaves
    • E06B3/72—Door leaves consisting of frame and panels, e.g. of raised panel type
    • E06B3/76—Door leaves consisting of frame and panels, e.g. of raised panel type with metal panels
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
    • E05Y2900/13—Type of wing
    • E05Y2900/132—Doors
    • E05Y2900/134—Fire doors

Landscapes

  • Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physical Vapour Deposition (AREA)
JP2005043618A 2004-03-19 2005-02-21 スパッタリング方法及びその装置 Active JP4580781B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005043618A JP4580781B2 (ja) 2004-03-19 2005-02-21 スパッタリング方法及びその装置
CNB2005100563642A CN100535178C (zh) 2004-03-19 2005-03-18 溅射方法及其装置
KR1020050022494A KR101135389B1 (ko) 2004-03-19 2005-03-18 스퍼터링 방법 및 그 장치
TW094108481A TW200538569A (en) 2004-03-19 2005-03-18 Sputtering method and sputtering system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004079750 2004-03-19
JP2005043618A JP4580781B2 (ja) 2004-03-19 2005-02-21 スパッタリング方法及びその装置

Publications (2)

Publication Number Publication Date
JP2005298966A JP2005298966A (ja) 2005-10-27
JP4580781B2 true JP4580781B2 (ja) 2010-11-17

Family

ID=35041676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005043618A Active JP4580781B2 (ja) 2004-03-19 2005-02-21 スパッタリング方法及びその装置

Country Status (4)

Country Link
JP (1) JP4580781B2 (ko)
KR (1) KR101135389B1 (ko)
CN (1) CN100535178C (ko)
TW (1) TW200538569A (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500975B2 (en) 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
JP4781964B2 (ja) * 2006-10-27 2011-09-28 信越化学工業株式会社 マグネトロンスパッタ装置
JP4707693B2 (ja) * 2007-05-01 2011-06-22 株式会社アルバック スパッタリング装置及びスパッタリング方法
JP5291907B2 (ja) * 2007-08-31 2013-09-18 株式会社アルバック スパッタリング装置
US8535494B2 (en) * 2008-03-04 2013-09-17 National University Corporation Tohoku University Rotary magnet sputtering apparatus
US8460965B2 (en) 2008-10-17 2013-06-11 Ulvac, Inc. Manufacturing method for solar cell
CN102191470A (zh) * 2010-03-09 2011-09-21 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控溅射源及等离子体处理设备
CN102071403B (zh) * 2011-01-30 2012-09-05 东莞市汇成真空科技有限公司 一种平面磁控溅射靶
US10106883B2 (en) 2011-11-04 2018-10-23 Intevac, Inc. Sputtering system and method using direction-dependent scan speed or power
KR20140071058A (ko) * 2012-12-03 2014-06-11 코닝정밀소재 주식회사 롤투롤 스퍼터링 장치
KR102181665B1 (ko) * 2017-11-01 2020-11-23 가부시키가이샤 알박 스퍼터링 장치 및 성막 방법
JP7007457B2 (ja) * 2018-03-16 2022-01-24 株式会社アルバック 成膜方法
CN115058695B (zh) * 2022-08-11 2022-11-04 广州粤芯半导体技术有限公司 溅射方法及半导体器件的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0421775A (ja) * 1990-05-14 1992-01-24 Fujitsu Ltd スパッタリング装置のカソード
JP3514488B2 (ja) * 1993-06-30 2004-03-31 株式会社アルバック マグネトロンスパッタ方法及び装置
CN1157335A (zh) * 1996-02-13 1997-08-20 王福贞 新型永磁控平面阴极电弧源
JP3344318B2 (ja) * 1998-05-27 2002-11-11 日本電気株式会社 スパッタ装置
JP2003239069A (ja) * 2002-02-15 2003-08-27 Ulvac Japan Ltd 薄膜の製造方法及び装置
JP4246547B2 (ja) * 2003-05-23 2009-04-02 株式会社アルバック スパッタリング装置、及びスパッタリング方法

Also Published As

Publication number Publication date
TWI377263B (ko) 2012-11-21
CN1670243A (zh) 2005-09-21
JP2005298966A (ja) 2005-10-27
CN100535178C (zh) 2009-09-02
KR101135389B1 (ko) 2012-04-17
KR20060044372A (ko) 2006-05-16
TW200538569A (en) 2005-12-01

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