TW200538562A - Copper alloy and method for production thereof - Google Patents
Copper alloy and method for production thereof Download PDFInfo
- Publication number
- TW200538562A TW200538562A TW094107552A TW94107552A TW200538562A TW 200538562 A TW200538562 A TW 200538562A TW 094107552 A TW094107552 A TW 094107552A TW 94107552 A TW94107552 A TW 94107552A TW 200538562 A TW200538562 A TW 200538562A
- Authority
- TW
- Taiwan
- Prior art keywords
- precipitates
- inclusions
- particle size
- alloy
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004071571 | 2004-03-12 | ||
JP2004093661 | 2004-03-26 | ||
JP2004234868A JP2005290543A (ja) | 2004-03-12 | 2004-08-11 | 銅合金およびその製造方法 |
JP2004234891A JP2005307334A (ja) | 2004-03-26 | 2004-08-11 | 銅合金およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200538562A true TW200538562A (en) | 2005-12-01 |
Family
ID=34975596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094107552A TW200538562A (en) | 2004-03-12 | 2005-03-11 | Copper alloy and method for production thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070062619A1 (ja) |
EP (1) | EP1731624A4 (ja) |
KR (1) | KR20060120276A (ja) |
CA (1) | CA2559103A1 (ja) |
TW (1) | TW200538562A (ja) |
WO (1) | WO2005087957A1 (ja) |
Cited By (4)
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---|---|---|---|---|
TWI400342B (zh) * | 2008-12-01 | 2013-07-01 | Jx Nippon Mining & Metals Corp | Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method |
CN112877565A (zh) * | 2021-01-12 | 2021-06-01 | 鞍钢股份有限公司 | 一种铜钢固液双金属复合材料及其制备方法 |
CN115786764A (zh) * | 2022-11-22 | 2023-03-14 | 广州番禺职业技术学院 | 一种铜镜材料及其制备方法 |
CN116555620A (zh) * | 2023-04-24 | 2023-08-08 | 扬州地标金属制品有限公司 | 一种多元合金材料及其制备方法 |
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JP5306591B2 (ja) * | 2005-12-07 | 2013-10-02 | 古河電気工業株式会社 | 配線用電線導体、配線用電線、及びそれらの製造方法 |
KR100883335B1 (ko) * | 2008-07-09 | 2009-02-12 | (주)태성알로이 | 장신구용 고내식성의 동합금 |
US20100226815A1 (en) * | 2009-03-09 | 2010-09-09 | Lazarus Norman M | Lead-Free Brass Alloy |
US20100303667A1 (en) * | 2009-03-09 | 2010-12-02 | Lazarus Norman M | Novel lead-free brass alloy |
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WO2011060034A1 (en) * | 2009-11-10 | 2011-05-19 | Gbc Metals, Llc | Antitarnish, antimicrobial copper alloys and surfaces made from such alloys |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
JP5441876B2 (ja) * | 2010-12-13 | 2014-03-12 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
GB2502011B (en) * | 2011-01-21 | 2015-03-04 | Fondamenta Llc | Electrode for attention training techniques |
KR101285700B1 (ko) * | 2011-03-07 | 2013-07-12 | 윤태병 | 황금색 동합금과 그의 제조방법 |
JP5451674B2 (ja) * | 2011-03-28 | 2014-03-26 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Si−Co系銅合金及びその製造方法 |
JP4799701B1 (ja) * | 2011-03-29 | 2011-10-26 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金条及びその製造方法 |
CA2889459A1 (en) | 2012-10-26 | 2014-05-01 | Sloan Valve Company | White antimicrobial copper alloy |
PL224928B1 (pl) * | 2012-12-19 | 2017-02-28 | SYSTEM Spółka Akcyjna | Sposób napawania warstwy metalicznej na element metalowy |
RU2525876C1 (ru) * | 2013-02-26 | 2014-08-20 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Сплав на основе меди |
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CN103397222A (zh) * | 2013-07-01 | 2013-11-20 | 安徽三联泵业股份有限公司 | 不锈钢拉深模具铜合金及其制备方法 |
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DE102013014501A1 (de) * | 2013-09-02 | 2015-03-05 | Kme Germany Gmbh & Co. Kg | Kupferlegierung |
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RU2587110C9 (ru) * | 2014-09-22 | 2016-08-10 | Дмитрий Андреевич Михайлов | МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелО, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН |
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WO2018076161A1 (zh) * | 2016-10-25 | 2018-05-03 | 广东伟强铜业科技有限公司 | 一种黄铜合金及其制造方法 |
KR101941163B1 (ko) * | 2017-07-31 | 2019-01-23 | 한국생산기술연구원 | 구리 합금 및 이의 제조방법 |
RU2667259C1 (ru) * | 2017-08-24 | 2018-09-18 | Юлия Алексеевна Щепочкина | Спеченный сплав на основе меди |
CN111748712B (zh) * | 2020-06-18 | 2021-08-06 | 云南新铜人实业有限公司 | 一种铜银合金带材及其生产工艺 |
KR20210157552A (ko) * | 2020-06-22 | 2021-12-29 | 현대자동차주식회사 | 밸브 시트용 구리 합금 |
CN112281018A (zh) * | 2020-10-12 | 2021-01-29 | 中铁建电气化局集团康远新材料有限公司 | 一种高强度高导电铜锡合金接触线及其制备工艺 |
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CN115305383B (zh) * | 2022-07-30 | 2023-05-12 | 江西省科学院应用物理研究所 | 一种含混合稀土的高强度、高导电Cu-Co系合金材料及其制备方法 |
CN115404375A (zh) * | 2022-09-08 | 2022-11-29 | 南京公诚节能新材料研究院有限公司 | 一种铜基合金材料及其制备方法 |
CN115710654A (zh) * | 2022-11-15 | 2023-02-24 | 浙江中达精密部件股份有限公司 | 一种铜镍锡合金及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU515818A1 (ru) * | 1971-07-20 | 1976-05-30 | Государственный Научно-Исследовательский И Проектный Институт Сплавов И Обработки Цветных Металлов | Сплав на основе меди |
US4243437A (en) * | 1978-11-20 | 1981-01-06 | Marion Bronze Company | Process for forming articles from leaded bronzes |
US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
US4822560A (en) * | 1985-10-10 | 1989-04-18 | The Furukawa Electric Co., Ltd. | Copper alloy and method of manufacturing the same |
WO1991019320A1 (en) * | 1990-05-31 | 1991-12-12 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor package using it |
JP3296709B2 (ja) * | 1995-07-10 | 2002-07-02 | 古河電気工業株式会社 | 電子機器用薄板銅合金およびその製造方法 |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
EP1264905A3 (en) * | 1997-09-05 | 2002-12-18 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
JP3306585B2 (ja) * | 1997-12-09 | 2002-07-24 | 三菱マテリアル株式会社 | 晶出物および析出物が微細で、その分布割合が低いCu合金圧延薄板 |
JP4159757B2 (ja) * | 2001-03-27 | 2008-10-01 | 株式会社神戸製鋼所 | 強度安定性および耐熱性に優れた銅合金 |
-
2005
- 2005-03-02 EP EP05719817A patent/EP1731624A4/en not_active Withdrawn
- 2005-03-02 KR KR1020067018569A patent/KR20060120276A/ko not_active Application Discontinuation
- 2005-03-02 CA CA002559103A patent/CA2559103A1/en not_active Abandoned
- 2005-03-02 WO PCT/JP2005/003502 patent/WO2005087957A1/ja not_active Application Discontinuation
- 2005-03-11 TW TW094107552A patent/TW200538562A/zh unknown
-
2006
- 2006-09-11 US US11/518,194 patent/US20070062619A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400342B (zh) * | 2008-12-01 | 2013-07-01 | Jx Nippon Mining & Metals Corp | Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method |
CN112877565A (zh) * | 2021-01-12 | 2021-06-01 | 鞍钢股份有限公司 | 一种铜钢固液双金属复合材料及其制备方法 |
CN112877565B (zh) * | 2021-01-12 | 2022-05-20 | 鞍钢股份有限公司 | 一种铜钢固液双金属复合材料及其制备方法 |
CN115786764A (zh) * | 2022-11-22 | 2023-03-14 | 广州番禺职业技术学院 | 一种铜镜材料及其制备方法 |
CN115786764B (zh) * | 2022-11-22 | 2023-12-22 | 广州番禺职业技术学院 | 一种铜镜材料及其制备方法 |
CN116555620A (zh) * | 2023-04-24 | 2023-08-08 | 扬州地标金属制品有限公司 | 一种多元合金材料及其制备方法 |
CN116555620B (zh) * | 2023-04-24 | 2024-04-30 | 扬州地标金属制品有限公司 | 一种多元合金材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1731624A1 (en) | 2006-12-13 |
WO2005087957A1 (ja) | 2005-09-22 |
US20070062619A1 (en) | 2007-03-22 |
EP1731624A4 (en) | 2007-06-13 |
CA2559103A1 (en) | 2005-09-22 |
KR20060120276A (ko) | 2006-11-24 |
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