KR20060120276A - 동 합금 및 그 제조방법 - Google Patents
동 합금 및 그 제조방법 Download PDFInfo
- Publication number
- KR20060120276A KR20060120276A KR1020067018569A KR20067018569A KR20060120276A KR 20060120276 A KR20060120276 A KR 20060120276A KR 1020067018569 A KR1020067018569 A KR 1020067018569A KR 20067018569 A KR20067018569 A KR 20067018569A KR 20060120276 A KR20060120276 A KR 20060120276A
- Authority
- KR
- South Korea
- Prior art keywords
- precipitates
- inclusions
- alloy
- particle size
- copper alloy
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00071571 | 2004-03-12 | ||
JP2004071571 | 2004-03-12 | ||
JPJP-P-2004-00093661 | 2004-03-26 | ||
JP2004093661 | 2004-03-26 | ||
JPJP-P-2004-00234891 | 2004-08-11 | ||
JP2004234868A JP2005290543A (ja) | 2004-03-12 | 2004-08-11 | 銅合金およびその製造方法 |
JPJP-P-2004-00234868 | 2004-08-11 | ||
JP2004234891A JP2005307334A (ja) | 2004-03-26 | 2004-08-11 | 銅合金およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20060120276A true KR20060120276A (ko) | 2006-11-24 |
Family
ID=34975596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067018569A KR20060120276A (ko) | 2004-03-12 | 2005-03-02 | 동 합금 및 그 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070062619A1 (ja) |
EP (1) | EP1731624A4 (ja) |
KR (1) | KR20060120276A (ja) |
CA (1) | CA2559103A1 (ja) |
TW (1) | TW200538562A (ja) |
WO (1) | WO2005087957A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100883335B1 (ko) * | 2008-07-09 | 2009-02-12 | (주)태성알로이 | 장신구용 고내식성의 동합금 |
KR100946721B1 (ko) * | 2009-03-26 | 2010-03-12 | 주식회사 씨제이씨 | 고강도 동합금 및 고강도 동합금 주물 |
KR101285700B1 (ko) * | 2011-03-07 | 2013-07-12 | 윤태병 | 황금색 동합금과 그의 제조방법 |
KR101941163B1 (ko) * | 2017-07-31 | 2019-01-23 | 한국생산기술연구원 | 구리 합금 및 이의 제조방법 |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5306591B2 (ja) * | 2005-12-07 | 2013-10-02 | 古河電気工業株式会社 | 配線用電線導体、配線用電線、及びそれらの製造方法 |
CN102227510B (zh) * | 2008-12-01 | 2015-06-17 | Jx日矿日石金属株式会社 | 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法 |
US20100226815A1 (en) * | 2009-03-09 | 2010-09-09 | Lazarus Norman M | Lead-Free Brass Alloy |
US20100303667A1 (en) * | 2009-03-09 | 2010-12-02 | Lazarus Norman M | Novel lead-free brass alloy |
WO2011060034A1 (en) * | 2009-11-10 | 2011-05-19 | Gbc Metals, Llc | Antitarnish, antimicrobial copper alloys and surfaces made from such alloys |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
JP5441876B2 (ja) * | 2010-12-13 | 2014-03-12 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
GB2502011B (en) * | 2011-01-21 | 2015-03-04 | Fondamenta Llc | Electrode for attention training techniques |
JP5451674B2 (ja) * | 2011-03-28 | 2014-03-26 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Si−Co系銅合金及びその製造方法 |
JP4799701B1 (ja) * | 2011-03-29 | 2011-10-26 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金条及びその製造方法 |
CA2889459A1 (en) | 2012-10-26 | 2014-05-01 | Sloan Valve Company | White antimicrobial copper alloy |
PL224928B1 (pl) * | 2012-12-19 | 2017-02-28 | SYSTEM Spółka Akcyjna | Sposób napawania warstwy metalicznej na element metalowy |
RU2525876C1 (ru) * | 2013-02-26 | 2014-08-20 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Сплав на основе меди |
RU2507287C1 (ru) * | 2013-04-17 | 2014-02-20 | Юлия Алексеевна Щепочкина | Сплав на основе меди |
CN103397222A (zh) * | 2013-07-01 | 2013-11-20 | 安徽三联泵业股份有限公司 | 不锈钢拉深模具铜合金及其制备方法 |
CN103397223A (zh) * | 2013-07-01 | 2013-11-20 | 安徽三联泵业股份有限公司 | 冰箱模具铜合金及其制备方法 |
CN103397221A (zh) * | 2013-07-01 | 2013-11-20 | 安徽三联泵业股份有限公司 | 拉伸模具用铜合金及其制备方法 |
CN103421978B (zh) * | 2013-08-23 | 2015-05-27 | 苏州长盛机电有限公司 | 一种铜镁合金材料 |
DE102013014501A1 (de) * | 2013-09-02 | 2015-03-05 | Kme Germany Gmbh & Co. Kg | Kupferlegierung |
MX2016004371A (es) * | 2013-10-07 | 2017-05-01 | Sloan Valve Co | Aleacion de cobre antimicrobiana blanca. |
CN103757480B (zh) * | 2014-01-10 | 2016-05-11 | 滁州学院 | 一种耐海水腐蚀复杂白铜合金材料及其制备方法 |
CN103757473B (zh) * | 2014-01-10 | 2016-01-20 | 滁州学院 | 一种环保易切削锌白铜合金材料及其制备方法 |
CN104032181A (zh) * | 2014-05-12 | 2014-09-10 | 蚌埠市宏威滤清器有限公司 | 一种高强高导易切削铜合金材料及其制备方法 |
CN104032182A (zh) * | 2014-05-12 | 2014-09-10 | 蚌埠市宏威滤清器有限公司 | 一种高导电易切削白铜合金材料及其制备方法 |
CN104032174A (zh) * | 2014-05-12 | 2014-09-10 | 蚌埠市宏威滤清器有限公司 | 一种无铅易切削锌白铜合金材料及其制备方法 |
RU2587110C9 (ru) * | 2014-09-22 | 2016-08-10 | Дмитрий Андреевич Михайлов | МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелО, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН |
RU2587113C2 (ru) * | 2014-09-22 | 2016-06-10 | Дмитрий Андреевич Михайлов | Медный сплав, легированный теллуром, для коллекторов электрических машин |
RU2587108C9 (ru) * | 2014-09-22 | 2016-08-10 | Дмитрий Андреевич Михайлов | МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелМ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН |
RU2587112C9 (ru) * | 2014-09-22 | 2016-08-10 | Дмитрий Андреевич Михайлов | МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелТ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН |
CN104630546A (zh) * | 2015-03-05 | 2015-05-20 | 苏州市凯业金属制品有限公司 | 一种高强耐热铜合金金属管 |
DE102015013201B4 (de) | 2015-10-09 | 2018-03-29 | Diehl Metall Stiftung & Co. Kg | Verwendung einer nickelfeie weiße CuZn-Legierung |
CN105624454B (zh) * | 2016-02-02 | 2017-11-24 | 亳州沃野知识产权服务有限公司 | 一种高强度高过滤通量合金构件的制备方法 |
RU2622194C1 (ru) * | 2016-10-10 | 2017-06-13 | Юлия Алексеевна Щепочкина | Сплав на основе меди |
WO2018076161A1 (zh) * | 2016-10-25 | 2018-05-03 | 广东伟强铜业科技有限公司 | 一种黄铜合金及其制造方法 |
RU2667259C1 (ru) * | 2017-08-24 | 2018-09-18 | Юлия Алексеевна Щепочкина | Спеченный сплав на основе меди |
CN111748712B (zh) * | 2020-06-18 | 2021-08-06 | 云南新铜人实业有限公司 | 一种铜银合金带材及其生产工艺 |
KR20210157552A (ko) * | 2020-06-22 | 2021-12-29 | 현대자동차주식회사 | 밸브 시트용 구리 합금 |
CN112281018A (zh) * | 2020-10-12 | 2021-01-29 | 中铁建电气化局集团康远新材料有限公司 | 一种高强度高导电铜锡合金接触线及其制备工艺 |
CN112877565B (zh) * | 2021-01-12 | 2022-05-20 | 鞍钢股份有限公司 | 一种铜钢固液双金属复合材料及其制备方法 |
CN113564579B (zh) * | 2021-07-06 | 2022-10-28 | 燕山大学 | 一种利用激光熔覆制备铜基非晶复合涂层的方法 |
CN115305383B (zh) * | 2022-07-30 | 2023-05-12 | 江西省科学院应用物理研究所 | 一种含混合稀土的高强度、高导电Cu-Co系合金材料及其制备方法 |
CN115404375A (zh) * | 2022-09-08 | 2022-11-29 | 南京公诚节能新材料研究院有限公司 | 一种铜基合金材料及其制备方法 |
CN115710654A (zh) * | 2022-11-15 | 2023-02-24 | 浙江中达精密部件股份有限公司 | 一种铜镍锡合金及其制备方法 |
CN115786764B (zh) * | 2022-11-22 | 2023-12-22 | 广州番禺职业技术学院 | 一种铜镜材料及其制备方法 |
CN116555620B (zh) * | 2023-04-24 | 2024-04-30 | 扬州地标金属制品有限公司 | 一种多元合金材料及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU515818A1 (ru) * | 1971-07-20 | 1976-05-30 | Государственный Научно-Исследовательский И Проектный Институт Сплавов И Обработки Цветных Металлов | Сплав на основе меди |
US4243437A (en) * | 1978-11-20 | 1981-01-06 | Marion Bronze Company | Process for forming articles from leaded bronzes |
US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
US4822560A (en) * | 1985-10-10 | 1989-04-18 | The Furukawa Electric Co., Ltd. | Copper alloy and method of manufacturing the same |
WO1991019320A1 (en) * | 1990-05-31 | 1991-12-12 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor package using it |
JP3296709B2 (ja) * | 1995-07-10 | 2002-07-02 | 古河電気工業株式会社 | 電子機器用薄板銅合金およびその製造方法 |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
EP1264905A3 (en) * | 1997-09-05 | 2002-12-18 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
JP3306585B2 (ja) * | 1997-12-09 | 2002-07-24 | 三菱マテリアル株式会社 | 晶出物および析出物が微細で、その分布割合が低いCu合金圧延薄板 |
JP4159757B2 (ja) * | 2001-03-27 | 2008-10-01 | 株式会社神戸製鋼所 | 強度安定性および耐熱性に優れた銅合金 |
-
2005
- 2005-03-02 EP EP05719817A patent/EP1731624A4/en not_active Withdrawn
- 2005-03-02 KR KR1020067018569A patent/KR20060120276A/ko not_active Application Discontinuation
- 2005-03-02 CA CA002559103A patent/CA2559103A1/en not_active Abandoned
- 2005-03-02 WO PCT/JP2005/003502 patent/WO2005087957A1/ja not_active Application Discontinuation
- 2005-03-11 TW TW094107552A patent/TW200538562A/zh unknown
-
2006
- 2006-09-11 US US11/518,194 patent/US20070062619A1/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100883335B1 (ko) * | 2008-07-09 | 2009-02-12 | (주)태성알로이 | 장신구용 고내식성의 동합금 |
KR100946721B1 (ko) * | 2009-03-26 | 2010-03-12 | 주식회사 씨제이씨 | 고강도 동합금 및 고강도 동합금 주물 |
KR101285700B1 (ko) * | 2011-03-07 | 2013-07-12 | 윤태병 | 황금색 동합금과 그의 제조방법 |
KR101941163B1 (ko) * | 2017-07-31 | 2019-01-23 | 한국생산기술연구원 | 구리 합금 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
TW200538562A (en) | 2005-12-01 |
EP1731624A1 (en) | 2006-12-13 |
WO2005087957A1 (ja) | 2005-09-22 |
US20070062619A1 (en) | 2007-03-22 |
EP1731624A4 (en) | 2007-06-13 |
CA2559103A1 (en) | 2005-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20060120276A (ko) | 동 합금 및 그 제조방법 | |
KR100766639B1 (ko) | 구리 합금 및 그 제조 방법 | |
JP4134279B1 (ja) | Cu合金材 | |
WO2006109801A1 (ja) | 銅合金およびその製造方法 | |
WO2006104152A1 (ja) | 銅合金およびその製造方法 | |
US10294547B2 (en) | Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment | |
JP2005113259A (ja) | Cu合金およびその製造方法 | |
JP4424503B2 (ja) | 棒鋼・線材 | |
WO2006093140A1 (ja) | 銅合金 | |
JP2005290543A (ja) | 銅合金およびその製造方法 | |
CN102439182A (zh) | 可机加工的铜基合金和生产它的方法 | |
KR20110069014A (ko) | 리본형 연성 금속성 유리 | |
JP2004307905A (ja) | Cu合金およびその製造方法 | |
JP2007126739A (ja) | 電子材料用銅合金 | |
JP2010106363A (ja) | 時効析出型銅合金、銅合金材料、銅合金部品および銅合金材料の製造方法 | |
KR102486303B1 (ko) | 주조용 몰드재, 및 구리 합금 소재 | |
CN114277280B (zh) | 一种析出强化型锡黄铜合金及其制备方法 | |
JP4348163B2 (ja) | 被削性に優れる鋼及びその製造方法 | |
CN106435250A (zh) | 可机加工的铜基合金和生产它的方法 | |
JP4032915B2 (ja) | 機械構造用線または機械構造用棒鋼およびその製造方法 | |
JP2005307334A (ja) | 銅合金およびその製造方法 | |
JP4278060B2 (ja) | 耐摩耗性に優れた球状バナジウム炭化物含有低熱膨張材料及びこの製造方法 | |
EP4174200A1 (en) | Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, and heat dissipation substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |