EP1731624A4 - COPPER ALLOY AND PRODUCTION METHOD THEREOF - Google Patents

COPPER ALLOY AND PRODUCTION METHOD THEREOF

Info

Publication number
EP1731624A4
EP1731624A4 EP05719817A EP05719817A EP1731624A4 EP 1731624 A4 EP1731624 A4 EP 1731624A4 EP 05719817 A EP05719817 A EP 05719817A EP 05719817 A EP05719817 A EP 05719817A EP 1731624 A4 EP1731624 A4 EP 1731624A4
Authority
EP
European Patent Office
Prior art keywords
production
copper alloy
alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05719817A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1731624A1 (en
Inventor
Yasuhiro Maehara
Mitsuharu Yonemura
Keiji Nakajima
Tsuneaki Nagamichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004234868A external-priority patent/JP2005290543A/ja
Priority claimed from JP2004234891A external-priority patent/JP2005307334A/ja
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Publication of EP1731624A1 publication Critical patent/EP1731624A1/en
Publication of EP1731624A4 publication Critical patent/EP1731624A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP05719817A 2004-03-12 2005-03-02 COPPER ALLOY AND PRODUCTION METHOD THEREOF Withdrawn EP1731624A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004071571 2004-03-12
JP2004093661 2004-03-26
JP2004234868A JP2005290543A (ja) 2004-03-12 2004-08-11 銅合金およびその製造方法
JP2004234891A JP2005307334A (ja) 2004-03-26 2004-08-11 銅合金およびその製造方法
PCT/JP2005/003502 WO2005087957A1 (ja) 2004-03-12 2005-03-02 銅合金およびその製造方法

Publications (2)

Publication Number Publication Date
EP1731624A1 EP1731624A1 (en) 2006-12-13
EP1731624A4 true EP1731624A4 (en) 2007-06-13

Family

ID=34975596

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05719817A Withdrawn EP1731624A4 (en) 2004-03-12 2005-03-02 COPPER ALLOY AND PRODUCTION METHOD THEREOF

Country Status (6)

Country Link
US (1) US20070062619A1 (ja)
EP (1) EP1731624A4 (ja)
KR (1) KR20060120276A (ja)
CA (1) CA2559103A1 (ja)
TW (1) TW200538562A (ja)
WO (1) WO2005087957A1 (ja)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
KR100883335B1 (ko) * 2008-07-09 2009-02-12 (주)태성알로이 장신구용 고내식성의 동합금
CN102227510B (zh) * 2008-12-01 2015-06-17 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法
US20100226815A1 (en) * 2009-03-09 2010-09-09 Lazarus Norman M Lead-Free Brass Alloy
US20100303667A1 (en) * 2009-03-09 2010-12-02 Lazarus Norman M Novel lead-free brass alloy
KR100946721B1 (ko) * 2009-03-26 2010-03-12 주식회사 씨제이씨 고강도 동합금 및 고강도 동합금 주물
WO2011060034A1 (en) * 2009-11-10 2011-05-19 Gbc Metals, Llc Antitarnish, antimicrobial copper alloys and surfaces made from such alloys
JP4677505B1 (ja) * 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5441876B2 (ja) * 2010-12-13 2014-03-12 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
GB2502011B (en) * 2011-01-21 2015-03-04 Fondamenta Llc Electrode for attention training techniques
KR101285700B1 (ko) * 2011-03-07 2013-07-12 윤태병 황금색 동합금과 그의 제조방법
JP5451674B2 (ja) * 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) * 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
CA2889459A1 (en) 2012-10-26 2014-05-01 Sloan Valve Company White antimicrobial copper alloy
PL224928B1 (pl) * 2012-12-19 2017-02-28 SYSTEM Spółka Akcyjna Sposób napawania warstwy metalicznej na element metalowy
RU2525876C1 (ru) * 2013-02-26 2014-08-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Сплав на основе меди
RU2507287C1 (ru) * 2013-04-17 2014-02-20 Юлия Алексеевна Щепочкина Сплав на основе меди
CN103397222A (zh) * 2013-07-01 2013-11-20 安徽三联泵业股份有限公司 不锈钢拉深模具铜合金及其制备方法
CN103397223A (zh) * 2013-07-01 2013-11-20 安徽三联泵业股份有限公司 冰箱模具铜合金及其制备方法
CN103397221A (zh) * 2013-07-01 2013-11-20 安徽三联泵业股份有限公司 拉伸模具用铜合金及其制备方法
CN103421978B (zh) * 2013-08-23 2015-05-27 苏州长盛机电有限公司 一种铜镁合金材料
DE102013014501A1 (de) * 2013-09-02 2015-03-05 Kme Germany Gmbh & Co. Kg Kupferlegierung
MX2016004371A (es) * 2013-10-07 2017-05-01 Sloan Valve Co Aleacion de cobre antimicrobiana blanca.
CN103757480B (zh) * 2014-01-10 2016-05-11 滁州学院 一种耐海水腐蚀复杂白铜合金材料及其制备方法
CN103757473B (zh) * 2014-01-10 2016-01-20 滁州学院 一种环保易切削锌白铜合金材料及其制备方法
CN104032181A (zh) * 2014-05-12 2014-09-10 蚌埠市宏威滤清器有限公司 一种高强高导易切削铜合金材料及其制备方法
CN104032182A (zh) * 2014-05-12 2014-09-10 蚌埠市宏威滤清器有限公司 一种高导电易切削白铜合金材料及其制备方法
CN104032174A (zh) * 2014-05-12 2014-09-10 蚌埠市宏威滤清器有限公司 一种无铅易切削锌白铜合金材料及其制备方法
RU2587110C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелО, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
RU2587113C2 (ru) * 2014-09-22 2016-06-10 Дмитрий Андреевич Михайлов Медный сплав, легированный теллуром, для коллекторов электрических машин
RU2587108C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелМ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
RU2587112C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелТ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
CN104630546A (zh) * 2015-03-05 2015-05-20 苏州市凯业金属制品有限公司 一种高强耐热铜合金金属管
DE102015013201B4 (de) 2015-10-09 2018-03-29 Diehl Metall Stiftung & Co. Kg Verwendung einer nickelfeie weiße CuZn-Legierung
CN105624454B (zh) * 2016-02-02 2017-11-24 亳州沃野知识产权服务有限公司 一种高强度高过滤通量合金构件的制备方法
RU2622194C1 (ru) * 2016-10-10 2017-06-13 Юлия Алексеевна Щепочкина Сплав на основе меди
WO2018076161A1 (zh) * 2016-10-25 2018-05-03 广东伟强铜业科技有限公司 一种黄铜合金及其制造方法
KR101941163B1 (ko) * 2017-07-31 2019-01-23 한국생산기술연구원 구리 합금 및 이의 제조방법
RU2667259C1 (ru) * 2017-08-24 2018-09-18 Юлия Алексеевна Щепочкина Спеченный сплав на основе меди
CN111748712B (zh) * 2020-06-18 2021-08-06 云南新铜人实业有限公司 一种铜银合金带材及其生产工艺
KR20210157552A (ko) * 2020-06-22 2021-12-29 현대자동차주식회사 밸브 시트용 구리 합금
CN112281018A (zh) * 2020-10-12 2021-01-29 中铁建电气化局集团康远新材料有限公司 一种高强度高导电铜锡合金接触线及其制备工艺
CN112877565B (zh) * 2021-01-12 2022-05-20 鞍钢股份有限公司 一种铜钢固液双金属复合材料及其制备方法
CN113564579B (zh) * 2021-07-06 2022-10-28 燕山大学 一种利用激光熔覆制备铜基非晶复合涂层的方法
CN115305383B (zh) * 2022-07-30 2023-05-12 江西省科学院应用物理研究所 一种含混合稀土的高强度、高导电Cu-Co系合金材料及其制备方法
CN115404375A (zh) * 2022-09-08 2022-11-29 南京公诚节能新材料研究院有限公司 一种铜基合金材料及其制备方法
CN115710654A (zh) * 2022-11-15 2023-02-24 浙江中达精密部件股份有限公司 一种铜镍锡合金及其制备方法
CN115786764B (zh) * 2022-11-22 2023-12-22 广州番禺职业技术学院 一种铜镜材料及其制备方法
CN116555620B (zh) * 2023-04-24 2024-04-30 扬州地标金属制品有限公司 一种多元合金材料及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1353430A (en) * 1971-07-20 1974-05-15 Gni I Pi Splavov I Obrabotki T Copper-based alloys
US4243437A (en) * 1978-11-20 1981-01-06 Marion Bronze Company Process for forming articles from leaded bronzes
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
GB2182054A (en) * 1985-10-10 1987-05-07 Furukawa Electric Co Ltd Copper alloy and method of manufacturing the same
EP0485627A1 (en) * 1990-05-31 1992-05-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor package using it
JPH0978162A (ja) * 1995-07-10 1997-03-25 Furukawa Electric Co Ltd:The 電子機器用銅合金およびその製造方法
EP0769563A1 (en) * 1995-10-20 1997-04-23 Olin Corporation Iron modified phosphor-bronze
JP2002285261A (ja) * 2001-03-27 2002-10-03 Kobe Steel Ltd 強度安定性および耐熱性に優れた銅合金
EP1264905A2 (en) * 1997-09-05 2002-12-11 The Miller Company Copper based alloy featuring precipitation hardening and solid-solution hardening

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306585B2 (ja) * 1997-12-09 2002-07-24 三菱マテリアル株式会社 晶出物および析出物が微細で、その分布割合が低いＣｕ合金圧延薄板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1353430A (en) * 1971-07-20 1974-05-15 Gni I Pi Splavov I Obrabotki T Copper-based alloys
US4243437A (en) * 1978-11-20 1981-01-06 Marion Bronze Company Process for forming articles from leaded bronzes
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
GB2182054A (en) * 1985-10-10 1987-05-07 Furukawa Electric Co Ltd Copper alloy and method of manufacturing the same
EP0485627A1 (en) * 1990-05-31 1992-05-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor package using it
JPH0978162A (ja) * 1995-07-10 1997-03-25 Furukawa Electric Co Ltd:The 電子機器用銅合金およびその製造方法
EP0769563A1 (en) * 1995-10-20 1997-04-23 Olin Corporation Iron modified phosphor-bronze
EP1264905A2 (en) * 1997-09-05 2002-12-11 The Miller Company Copper based alloy featuring precipitation hardening and solid-solution hardening
JP2002285261A (ja) * 2001-03-27 2002-10-03 Kobe Steel Ltd 強度安定性および耐熱性に優れた銅合金

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005087957A1 *

Also Published As

Publication number Publication date
TW200538562A (en) 2005-12-01
EP1731624A1 (en) 2006-12-13
WO2005087957A1 (ja) 2005-09-22
US20070062619A1 (en) 2007-03-22
CA2559103A1 (en) 2005-09-22
KR20060120276A (ko) 2006-11-24

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