TW200530353A - Photocuring resinoid compsn. and printed circuit board using same - Google Patents

Photocuring resinoid compsn. and printed circuit board using same Download PDF

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Publication number
TW200530353A
TW200530353A TW094104100A TW94104100A TW200530353A TW 200530353 A TW200530353 A TW 200530353A TW 094104100 A TW094104100 A TW 094104100A TW 94104100 A TW94104100 A TW 94104100A TW 200530353 A TW200530353 A TW 200530353A
Authority
TW
Taiwan
Prior art keywords
photocurable
thermosetting resin
resin composition
composition according
coating
Prior art date
Application number
TW094104100A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357434B (ja
Inventor
Chiho Ueda
Kouji Kurihara
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200530353A publication Critical patent/TW200530353A/zh
Application granted granted Critical
Publication of TWI357434B publication Critical patent/TWI357434B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04H—BROADCAST COMMUNICATION
    • H04H2201/00—Aspects of broadcast communication
    • H04H2201/10—Aspects of broadcast communication characterised by the type of broadcast system
    • H04H2201/11—Aspects of broadcast communication characterised by the type of broadcast system digital multimedia broadcasting [DMB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW094104100A 2004-02-26 2005-02-05 Photocuring resinoid compsn. and printed circuit board using same TW200530353A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004051686A JP4328645B2 (ja) 2004-02-26 2004-02-26 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW200530353A true TW200530353A (en) 2005-09-16
TWI357434B TWI357434B (ja) 2012-02-01

Family

ID=35010853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104100A TW200530353A (en) 2004-02-26 2005-02-05 Photocuring resinoid compsn. and printed circuit board using same

Country Status (4)

Country Link
JP (1) JP4328645B2 (ja)
KR (1) KR101128571B1 (ja)
CN (1) CN1661475B (ja)
TW (1) TW200530353A (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4994922B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
JP4711354B2 (ja) * 2007-07-17 2011-06-29 ソニーケミカル＆インフォメーションデバイス株式会社 画像表示装置の製造方法
CN100554335C (zh) * 2007-10-17 2009-10-28 太阳油墨（苏州）有限公司 用于印刷电路板的外观检查的树脂组合物
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
JP5325462B2 (ja) * 2008-05-29 2013-10-23 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びプリント配線板
JP5076075B2 (ja) * 2008-08-27 2012-11-21 サンノプコ株式会社 紫外線硬化型組成物
JP5076076B2 (ja) * 2008-09-27 2012-11-21 サンノプコ株式会社 紫外線硬化型組成物
JP5303705B2 (ja) * 2009-02-24 2013-10-02 サンノプコ株式会社 硬化性組成物
JP5632146B2 (ja) * 2009-09-02 2014-11-26 太陽ホールディングス株式会社 硬化性樹脂組成物
TWI430024B (zh) * 2010-08-05 2014-03-11 Asahi Kasei E Materials Corp A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device
JP5250003B2 (ja) 2010-09-13 2013-07-31 株式会社日立製作所 樹脂材料及びこれを用いた高電圧機器
EP2608291A1 (en) * 2011-09-29 2013-06-26 Hitachi, Ltd. Separator for nonaqueous electrolyte secondary batteries, method for producing same, and nonaqueous electrolyte secondary battery
CN103450414B (zh) * 2012-05-28 2016-08-03 比亚迪股份有限公司 一种光敏树脂的组合物及其制备方法和光敏树脂
PT2997099T (pt) * 2013-05-31 2021-01-11 Elantas Pdg Inc Composições de resina de poliuretano formuladas para revestimento de superfície de unidades de circuito eletrónico
JP5799177B2 (ja) * 2013-08-26 2015-10-21 積水化学工業株式会社 光後硬化性樹脂組成物
JP5670533B1 (ja) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
WO2015103757A1 (en) * 2014-01-09 2015-07-16 Henkel (China) Investment Co. Ltd. A method for fabricating a semiconductor package, and the use of a non-contact upward jetting system in the fabrication of a semiconductor package
CN107206770B (zh) * 2014-11-18 2020-09-08 汉高股份有限及两合公司 光固化粘合剂组合物、其制备及其用途
JP6489049B2 (ja) * 2015-07-03 2019-03-27 住友大阪セメント株式会社 無機粒子含有組成物、塗膜、塗膜付きプラスチック基材、および表示装置
JP2018053098A (ja) * 2016-09-29 2018-04-05 住友大阪セメント株式会社 無機粒子含有組成物、塗膜、塗膜付きプラスチック基材、および表示装置
JP7254567B2 (ja) * 2019-03-11 2023-04-10 太陽インキ製造株式会社 硬化性組成物
JP7383388B2 (ja) * 2019-03-27 2023-11-20 太陽ホールディングス株式会社 硬化性組成物、ドライフィルム、硬化物および電子部品
CN115948073A (zh) * 2023-01-10 2023-04-11 东莞市毅联电子科技有限公司 一种耐候显影光阻涂料的生产工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
JP3742009B2 (ja) * 1999-07-12 2006-02-01 太陽インキ製造株式会社 アルカリ現像型光硬化性組成物及びそれを用いて得られる焼成物パターン
EP1266922B1 (en) * 2000-02-14 2005-01-12 Taiyo Ink Manufacturing Co. Ltd Photocurable/thermosetting composition for forming matte film
JP2002196486A (ja) 2000-12-27 2002-07-12 Tamura Kaken Co Ltd 感光性樹脂組成物及びプリント配線板
JP2002296777A (ja) 2001-03-29 2002-10-09 Tamura Kaken Co Ltd 感光性樹脂組成物

Also Published As

Publication number Publication date
KR101128571B1 (ko) 2012-03-27
CN1661475B (zh) 2011-01-26
TWI357434B (ja) 2012-02-01
KR20060042242A (ko) 2006-05-12
JP4328645B2 (ja) 2009-09-09
CN1661475A (zh) 2005-08-31
JP2005241977A (ja) 2005-09-08

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